JPS59132138A - Pellet mounting device - Google Patents
Pellet mounting deviceInfo
- Publication number
- JPS59132138A JPS59132138A JP641583A JP641583A JPS59132138A JP S59132138 A JPS59132138 A JP S59132138A JP 641583 A JP641583 A JP 641583A JP 641583 A JP641583 A JP 641583A JP S59132138 A JPS59132138 A JP S59132138A
- Authority
- JP
- Japan
- Prior art keywords
- pellet
- wafer sheet
- pellets
- nozzle
- wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
- H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01039—Yttrium [Y]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Die Bonding (AREA)
Abstract
Description
【発明の詳細な説明】 〔発明の技術分野〕 本発明は、ペレットマウント装置に関する。[Detailed description of the invention] [Technical field of invention] The present invention relates to a pellet mounting device.
第１図は、従来のペレットマウント装置の斜視図、第２
図は同装置の要部を示す断面図である。Figure 1 is a perspective view of a conventional pellet mount device, Figure 2 is a perspective view of a conventional pellet mount device;
The figure is a sectional view showing the main parts of the device.
図中１は、ペレット吸着工具２を先端部に設けたノズル
である。該啄レット吸着工具２には、他端で外部真空源
に配管しているビニール管３が取付けられる。ノズルＬ
には啄レッドに適当な荷重を掛けるウェット５と、ペレ
ット吸着工具２０回転防止をする回転防止板４が設けら
れている。ノズルｌは、ウェノ・−シート６に貼付され
ているペレット群７の所定のペレット７ａの中心と、モ
ータとカムで構成されている駆動手段（図示せず）によ
って開閉する４個のケ゛−ジング爪９ａ ＊ ９．ｂ
ｔ ９ ｃ ｙ ９ｄからなるダージング部互の中心間
とを矢印で示す如く、ぎツクス運動する。1 in the figure is a nozzle with a pellet suction tool 2 provided at its tip. A vinyl pipe 3 is attached to the baglet suction tool 2, the other end of which is connected to an external vacuum source. Nozzle L
is provided with a wet plate 5 that applies an appropriate load to the pellet and a rotation prevention plate 4 that prevents the pellet suction tool 20 from rotating. The nozzle l is connected to the center of a predetermined pellet 7a of the pellet group 7 attached to the weno sheet 6, and four cages that are opened and closed by a driving means (not shown) consisting of a motor and a cam. Claw 9a*9. b
The darting parts consisting of t 9 c y 9 d make a jerky movement between the centers of each other as shown by the arrows.
ここで、８はウェハーシート６を張着しているカセット
リング、１３は該ウェハーシート６をカセットリング８
に固定している固定リングである。Here, 8 is a cassette ring to which the wafer sheet 6 is attached, and 13 is a cassette ring 8 to which the wafer sheet 6 is attached.
This is a fixed ring that is fixed to the
また、１２はウェハーシート６からペレット群７の剥離
ｒよくするだめに設けられた突き上はニードルであり、
ニードル１２は上下動駆動手段（図示せず）と一端で係
合している軸１１の他端に固定されている。Further, 12 is a needle provided with a protrusion to facilitate peeling of the pellet group 7 from the wafer sheet 6;
The needle 12 is fixed to the other end of the shaft 11, which engages at one end with a vertical drive means (not shown).
まだ、ＩＯはバックアップリングで、該バックアップリ
ング１０の両端にプツシ−１４が嵌挿されておシ、軸１
１と滑合状態にある。１６はバックアップリングを固定
しているブラケットで、６ｔｒ、６ｂ、６ｃ、６ｄはカ
セットリング８の最大移動範囲を現わす。Ｉ５は、ペレ
ット７をゲージング部互で定位置決め後、別の吸着ノズ
ル（図示せず）によりマウントしたリードフレームであ
る。The IO is still a backup ring, and the pushers 14 are inserted into both ends of the backup ring 10, and the shaft 1
It is in a sliding state with 1. 16 is a bracket that fixes the backup ring, and 6tr, 6b, 6c, and 6d represent the maximum movement range of the cassette ring 8. I5 is a lead frame on which the pellets 7 are fixed in position between the gauging parts and then mounted by another suction nozzle (not shown).
而して、被レット供給操作が次のように行われる。The ret supply operation is performed as follows.
先ず、ウェハーシート上６にペレッ）７ａが、Ｋレット
自動位置決め装置（図示せず）によシ定位置決めされる
。次いで、ノズルＬが定位置決めされたペレット７ａの
真上に位置し、下降して停止する。First, a pellet (7a) is positioned on the wafer sheet 6 by a K-let automatic positioning device (not shown). Next, the nozzle L is located directly above the fixedly positioned pellet 7a, descends, and stops.
次に、突き上げニードル１２が上昇し、ノズルＬのペレ
ット吸着工具２に圧接する。しかるのち、ノズルＪが上
昇し、突き上げニードル１２が下降して、ウェハーシー
ト６からペレット７ａをペレット吸着工具２に移動する
。このとき、ノズルＬは下降して停止し、ペレット吸着
工具２内は、減圧状態になっている。ペレット７ａを真
空吸着したノズルＪは、グーソング部互までの距離１．
だけ移送し、ゲージング部旦の中心にペレッ）７ａを載
置する。次に、ゲージング部互が駆動してペレッ）７ｉ
を定位置決めする。Next, the thrusting needle 12 rises and comes into pressure contact with the pellet suction tool 2 of the nozzle L. Thereafter, the nozzle J rises, the push-up needle 12 descends, and the pellet 7a is transferred from the wafer sheet 6 to the pellet suction tool 2. At this time, the nozzle L descends and stops, and the inside of the pellet suction tool 2 is in a reduced pressure state. The nozzle J that has vacuum-adsorbed the pellet 7a has a distance of 1.
and place the pellet 7a in the center of the gauging section. Next, the gauging parts drive each other to pellet (7i)
to a fixed position.
然る後、別の吸着工具（図示せず）によりゲージング部
旦から、リードフレーム１５のマウント位置までｔ２の
距離だけノズル１が移動し、被レット７ａを接着剤を介
してリードフレーム１５の定位置に固着する。After that, the nozzle 1 is moved by a distance t2 from the gauging part 1 to the mounting position of the lead frame 15 using another suction tool (not shown), and the ret 7a is fixed on the lead frame 15 through the adhesive. stick in position.
而して、従来のベレットマウン）Ｍ置には、次の欠点が
ある。However, the conventional bellet mount has the following drawbacks.
■ グイシングされたウェハーを平面的に利用するだめ
に、ウェハー径の拡大化に伴なって必然的にＸ−Ｙステ
ージのストロークが大きくなる。さらに、ウェハーシー
トの被レッド定位置中心とペレットを真空吸着移送後、
状態修正をするゲージング部の中心との距離が長くなる
ため、装置の寸法が太きくなシ装置が大型になる。この
ため、製品の価格が高くなる。(2) If the wafer is used in a planar manner, the stroke of the X-Y stage will inevitably increase as the wafer diameter increases. Furthermore, after transferring the pellet to the fixed position center of the wafer sheet by vacuum suction,
Since the distance from the center of the gauging section that corrects the condition becomes longer, the dimensions of the device become thicker and the device becomes larger. This increases the price of the product.
■ 吸着工具２の移送距離１．がウェハ了径拡犬化に伴
なって大きくなるため、移送スピードを速くできない。■ Transfer distance of suction tool 21. As the wafer diameter increases, the transfer speed cannot be increased.
このだめ、午産性の向上を望めない。In this case, we cannot expect to improve the productivity of the rice.
また、下降停止時に移送手段である真空吸着部の自重に
よる慣性で移送手段の先端部がたわみ、その結果ペレッ
トをたたいて割れ等の損傷を招き、歩留シ及び信頼性を
低下する。In addition, when the descent is stopped, the tip of the transfer means is bent due to inertia due to the weight of the vacuum suction unit, which is the transfer means, and as a result, the pellets are hit, causing damage such as cracking, which reduces yield and reliability.
■ ウェハーシートの張着力を管理するのが非常に難か
しい。このため、熟練作業者を必要とする。また、ウェ
ハーシートを張着するリングをウェハー径に対応して多
数個必要とするため、その管理が大変である。■ It is very difficult to control the tension of wafer sheets. Therefore, skilled workers are required. Further, since a large number of rings for attaching the wafer sheet are required in correspondence with the diameter of the wafer, management thereof is difficult.
■ 検出手段のＸ、Ｙ軸方向と、リングに張着されたウ
ェハーシートのペレットのＸ、Ｙ軸方向との初期位置合
せに要する時間が、ウェハー径が大きくなればなる程長
くなり、稼働率を低下する。■ The time required for initial alignment of the X and Y axes of the detection means and the X and Y axes of the pellets of the wafer sheet attached to the ring increases as the wafer diameter increases, which reduces the operating rate. decrease.
本発明は、生産性及び製品歩留シを向上させると共に、
製品コストの低減を達成したペレットマウント装置を提
供することをその目的とするものである。The present invention improves productivity and product yield, and
The object of the present invention is to provide a pellet mounting device that achieves reduction in product cost.
本発−明は、ウェハーシート上のペレットを移行するペ
レット供給手段を設け、ペレットの配置信号に応じて、
ペレット供給手段の位置を調節するようにして、生産性
及び製品歩留シを向上させると共に、製品コストの低減
を達成したペレットマウント。The present invention provides pellet supply means for transferring pellets on a wafer sheet, and according to a pellet placement signal,
A pellet mount that improves productivity and product yield as well as reduces product costs by adjusting the position of pellet supply means.
以下、本発明の一実施例を図面を参照して説明する。 Hereinafter, one embodiment of the present invention will be described with reference to the drawings.
第３図は一実施例のペレット供給装置の要部を示す断面
図、第４図は、同装置の斜視図である。なお従来の装置
と同一部分は同一符号を付し、説明は略している。FIG. 3 is a sectional view showing the main parts of a pellet feeding device according to one embodiment, and FIG. 4 is a perspective view of the same device. Note that the same parts as those of the conventional device are given the same reference numerals, and explanations are omitted.
図中、ウェハーシート６の両端には角穴２８が連設され
ている。角穴２８に咬合するように配置された突起物Ｚ
７は、回転板１８の外周に放射状に植設されている。ブ
ラケットで回輯自在に係合している軸１９は、一端で対
向するように回転板１８を係上し、他端でカッブリング
２０の一端を係止している。カッブリング２０の他端は
、モータブラケット２１に固定されているパルスモータ
２２の軸に固定されている。In the figure, square holes 28 are continuously provided at both ends of the wafer sheet 6. A protrusion Z arranged to engage the square hole 28
7 are installed radially around the outer periphery of the rotary plate 18. The shaft 19, which is rotatably engaged with the bracket, engages the rotating plate 18 so as to face each other at one end, and engages one end of the coupling ring 20 at the other end. The other end of the coupling ring 20 is fixed to the shaft of a pulse motor 22 fixed to a motor bracket 21.
ノクルスモータ２２の回転で回転板１８が回転するよう
になっている。すなわち、ノ々ルスモーク２２の回転角
度に対応してウェハ−シートロが移行されるようになっ
ている。The rotation of the Noculus motor 22 causes the rotation plate 18 to rotate. That is, the wafer sheet is moved in accordance with the rotation angle of the nozzle smoke 22.
軸１９に取付けられている回転板１８の上方は、ウェハ
ーシート６と滑動するホルダー２３が配設されている。A holder 23 that slides on the wafer sheet 6 is disposed above the rotary plate 18 attached to the shaft 19.
ホルダー２３の中央部にはバックアップリング２４が入
る穴が設けである。A hole into which a backup ring 24 is inserted is provided in the center of the holder 23.
これによシ、回転板１８の回転でウエノ・−シート６の
動きが、水平から垂直に変換されるようになっている。As a result, the movement of the Ueno sheet 6 is changed from horizontal to vertical by rotation of the rotary plate 18.
２９はウェハーシート６からペレット７ａを剥離するだ
めのペレット突き上げ部である。ペレット突き上は部す
は、両端にブツシュ１４を嵌挿し、ブツシュ１４と滑合
状態にある軸２５と係合しているバックアップリング２
４を有している。バックアップ２４は、ホルダー３０に
固定されている。軸２５は、（図示しない）駆動手段し
てあり玉止下動するようになっている。Reference numeral 29 is a pellet pushing-up portion for peeling off the pellet 7a from the wafer sheet 6. The pellet protrusion part has bushings 14 fitted on both ends thereof, and a backup ring 2 engaged with a shaft 25 that is in sliding contact with the bushings 14.
It has 4. Backup 24 is fixed to holder 30. The shaft 25 has a drive means (not shown) and is adapted to be moved downwardly.
ｆラケット２１と、ホルダー２３の固・定ブラケット（
図示せず）と、ホルダー３０と、ニードル１２を上下動
する駆動手段（図示せず）は、ウェハーシート６の動き
と直交するステージ（図示せず）に搭載されている。ス
テージの移＼
動は、メネジと螺合している。雄ネジの一端でｔ＃ Ａ
、 スモークと係止しておシ、ハルスモータ回転角に対
応した直線移動に変換されるようになっている。f Racket 21 and holder 23 fixing/fixing bracket (
(not shown), the holder 30, and a driving means (not shown) for vertically moving the needle 12 are mounted on a stage (not shown) that is perpendicular to the movement of the wafer sheet 6. The movement of the stage is screwed together with the female thread. T# A at one end of male thread
When it is locked with the smoke, it is converted into linear movement corresponding to the rotation angle of the Hals motor.
なお、ウェハーシート６の移動方向の一端は、回転板１
８と咬合しており、他端はウェハーシート６を張着する
ような回転ドラム（図示せず）に咬合している。Note that one end of the wafer sheet 6 in the moving direction is connected to the rotating plate 1.
8, and the other end engages with a rotating drum (not shown) on which the wafer sheet 6 is stuck.
２７は、ウェハーシート６上のペレット７ａを位置修正
する検出手段であシ、ＩＴＶカメラ、系と制御装置とで
構成されている。27 is a detection means for correcting the position of the pellet 7a on the wafer sheet 6, and is composed of an ITV camera, a system, and a control device.
突き上げ部りのニードル１２軸心と検出手段すの光学系
軸心とは、調整時に合わせられている。また、ノズルＪ
の吸着工具２の軸心も予じめニードル１２軸心と合せら
れている。The axial center of the needle 12 at the push-up portion and the axial center of the optical system of the detection means are aligned during adjustment. Also, nozzle J
The axis of the suction tool 2 is also aligned with the axis of the needle 12 in advance.
次に、このペレットマウント装置の動作を説明する。Next, the operation of this pellet mount device will be explained.
ウェハーシート６上のペレット群７の任意ペレット７ａ
を、パルスモータ２２とステージ（図示せず）とを駆動
して検出手段どの検出エリア内に移動させ、ウェハーの
イニシャル合わせを完了する。つぎに検出手段Ｕでベン
ツ）７ａを自動位置決め後、ノズル１がペレット７ａ方
向に移動し、ベンツ）７ａ上に下降停止する。ノズルＩ
の移動と連動してペレット突き上げ部すのニードルＩ２
が上昇して停止し、ベンツ）７ａを吸着工具２に圧接す
る。しかるのち、ノズルユが上昇し、突き上げ部りのニ
ードル１２が下降してベンツ）７ａがゲージング部に吸
着移送される。これと同期してステージがつぎのペレッ
ト群７まで移動する。この移動量は、ウェハーシート６
上のペレット間隔量として予じめ制御装置に入力データ
として入力されている。検出部の領域内に移動されたベ
ンツ）７ｂは同じく自動位置決めされた後、ノズル１で
ゲージング部に移送される。Any pellet 7a of pellet group 7 on wafer sheet 6
The pulse motor 22 and the stage (not shown) are driven to move the detection means into any detection area, thereby completing the initial alignment of the wafers. Next, after automatic positioning of the vent 7a by the detection means U, the nozzle 1 moves in the direction of the pellet 7a and descends and stops above the pellet 7a. Nozzle I
Needle I2 of the pellet thrusting part is linked with the movement of
rises and stops, pressing the vent 7a against the suction tool 2. Thereafter, the nozzle is raised, the needle 12 at the raised portion is lowered, and the needle 7a is adsorbed and transferred to the gauging portion. In synchronization with this, the stage moves to the next pellet group 7. This amount of movement is the wafer sheet 6
The above pellet spacing amount is input in advance to the control device as input data. Benz) 7b that has been moved into the area of the detection section is also automatically positioned and then transferred to the gauging section by the nozzle 1.
ウェハー周縁方向にステージで移送されウェハー周縁外
が検出領域に来ると、ペレットがないだめ°゛行”替え
をする必要がある。この″行″ンをステージに取ｐ付け
ておき、これを固定プラケットに固定された反射型セン
ツー−で認識して、この光学的信号を変換した電気信号
出力に基づいて行われる。″行″替え信号は、パルス数
”ｒ ／”ルスモーク２２に出力する。／Ｅ ＃ Ｘ
％ −タ２２は・ぐルス数に対応して回転するため軸１
９が回転し、回転板１８を回転する。この結果、回転板
１８の突起物１７と咬合しているウェハーシート２６が
巻き取られることによシ、ステージ移動と直交する方向
にウェハーシート２６が移動される（第４図矢印Ａで図
示）。When the wafer is transported by the stage in the direction of the wafer's periphery and the outside of the wafer's periphery reaches the detection area, it is necessary to change the rows because there are no pellets.This "row" is attached to the stage and fixed. This is performed based on the electrical signal output obtained by converting this optical signal by recognizing it with a reflective sensor fixed to the placket.The "row" change signal is outputted to the Lusmoke 22 with the number of pulses "r/". E#X
% - Since the shaft 22 rotates in accordance with the number of
9 rotates to rotate the rotating plate 18. As a result, the wafer sheet 26 that engages with the protrusion 17 of the rotating plate 18 is wound up, thereby moving the wafer sheet 26 in a direction perpendicular to the stage movement (as shown by arrow A in FIG. 4). .
この移動量は、予じめペレット間距離をパルス数に換算
して入力されている。このような作業を順次繰シ返えし
、ペレットの供給マウント操作が行われる。This amount of movement is input in advance by converting the inter-pellet distance into the number of pulses. By repeating such operations one after another, pellet feeding and mounting operations are performed.
このようにこのペレットマウント装置によれば、次のよ
うな効果を有する。As described above, this pellet mount device has the following effects.
■ ペレット移送距離ｔ３をウニ・・−の大きさに無関
係に小さくできるので、作業速度を高めて、生産性を著
しく向上し、製品コストを低減できる。(2) Since the pellet transfer distance t3 can be made small regardless of the size of the sea urchin, the working speed can be increased, productivity can be significantly improved, and product costs can be reduced.
■ ノズル部と支持部の距離を短かくして、ノズル部の
自重による慣性でペレットを割ってペレットの機能を損
なう品質事故を減少できる。■ By shortening the distance between the nozzle part and the support part, it is possible to reduce quality accidents where the pellets break due to inertia due to the nozzle part's own weight and damage the pellet's function.
このだめ、製品歩留シを向上し、高信頼性の半導体装置
を提供することができる。As a result, product yield can be improved and a highly reliable semiconductor device can be provided.
■ ウェハーシートの張着が一定となるため、ペレット
吸着率が向上し、ペレットを有効に活用して生産性を向
上できる。■ Since the adhesion of the wafer sheet is constant, the pellet adsorption rate is improved, and pellets can be used effectively to improve productivity.
■ 装置が簡単になるだめ、製品コストを低減できる。■ Product costs can be reduced because the equipment is simpler.
■ ウェハーシートに多数のウェハーを貼付することで
、ウェハーシート交換に要する時間を減少できる。この
だめ、装置の稼働率が上がる。その結果、生産性を向上
させることができる。■ By attaching a large number of wafers to a wafer sheet, the time required for changing wafer sheets can be reduced. This will increase the operating rate of the equipment. As a result, productivity can be improved.
以上説明した如く、本発明に係るベレットマウント装置
によれば、生産性及び製品歩留りを向上させると共に、
製品コストを低減できる等顕著な効果を奏するものであ
る。As explained above, according to the bullet mount device according to the present invention, productivity and product yield can be improved, and
This has remarkable effects such as reducing product costs.
第１図は、従来のベレットマウント装置を示す斜視図、
第２図は、同ペレットマウント装置の要部を示す断面図
、第３図は、本発明の一実施例の要部を示す断面図、第
４図は、同実施例の斜視図である。
工・・・ノズル部、２・・・吸着工具、３・・・ヒニー
ル管、４・・・回転防止板、５・・・ウェイト、６・・
・ウェハーシート、７・・・ペレット群、８・・・カセ
ットリング、９１１．９ｂ 、９Ｃ，９ｄ−ゲージング
爪、９・・・ゲージング部、１０・・・バックアップリ
ング、１１・・・軸、１２・・・ニードル、１３・・・
固定リング、Ｉ４・・・ブツシュ−１１５・・・リード
フレーム、１６・・・欠番、１７・・・突起物、１８・
・・回転板、１９・・・軸、２０・・・カップリング、
２１・・・モータフラケット、２２・・・ノぞルスモー
ク、２３・・・ホル７−１２．４・・・バックアップリ
ング、２５・・・軸、２７・・・検出手段、２８・・・
角穴、２９−・・ペレット突き上げ部、３０・・・ホル
ダー〇
出願人代理人 弁理士 鈴 江 武 彦牙２図
１
牙３図
牙４図FIG. 1 is a perspective view showing a conventional bullet mount device;
FIG. 2 is a sectional view showing a main part of the pellet mount device, FIG. 3 is a sectional view showing a main part of an embodiment of the present invention, and FIG. 4 is a perspective view of the same embodiment. Engineering...Nozzle part, 2...Adsorption tool, 3...Hinyl tube, 4...Rotation prevention plate, 5...Weight, 6...
- Wafer sheet, 7... Pellet group, 8... Cassette ring, 911.9b, 9C, 9d- Gauging claw, 9... Gauging section, 10... Backup ring, 11... Shaft, 12 ...Needle, 13...
Fixing ring, I4...Button shoe-115...Lead frame, 16...Missed number, 17...Protrusion, 18.
...Rotating plate, 19...shaft, 20...coupling,
21... Motor flaket, 22... Nozzle smoke, 23... Hole 7-12.4... Backup ring, 25... Shaft, 27... Detection means, 28...
Square hole, 29-...Pellet thrusting part, 30...Holder〇Applicant's agent Patent attorney Suzue Takehiko Fang 2 Figure 1 Fang 3 Figure Fang 4
Claims (1)
ードフレームのペレットマウント部間を移動自在に設け
られ、かつ、前記ペレットの吸着工具を備えだノズルと
、前記ウェハーシート上の前記ペレットの位置を検出す
る検出手段と、前記ウェハーシートを巻き取って前記ペ
レットを移行する機構を備えたペレット供給手段と、該
ベレット供給手段を塔載しだＸ−Ｙステークと、前記検
出手段の信号に応じて前記ペレットの配置を修正するに
必要な移動量信号を両射Ｘ−Ｙステージに供給する制御
機構とを具備することを特徴とするペレットマウント装
置。 （２’）、 ：Ｘ＋：ウェハーシートはベレット供給手
段の回転一体に植設された突起物と緩挿する穿孔を有す
ることを特徴とする特許請求の範囲第１項記載のペレッ
トマウント装置。[Scope of Claims] A nozzle that is movable between a wafer sheet on which a large number of pellets are placed and a pellet mount portion of a lead frame, and that is equipped with a suction tool for the pellets; a detection means for detecting the position of the pellets; a pellet supply means having a mechanism for winding up the wafer sheet and transferring the pellets; an X-Y stake for mounting the pellet supply means; A pellet mount device comprising: a control mechanism that supplies a movement amount signal necessary for correcting the arrangement of the pellets to a bidirectional XY stage in accordance with a signal from the means. (2'), :X+: The pellet mounting device according to claim 1, wherein the wafer sheet has a perforation that is loosely inserted into a protrusion that is implanted integrally with the rotation of the pellet supply means.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP641583A JPS59132138A (en) | 1983-01-18 | 1983-01-18 | Pellet mounting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP641583A JPS59132138A (en) | 1983-01-18 | 1983-01-18 | Pellet mounting device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS59132138A true JPS59132138A (en) | 1984-07-30 |
Family
ID=11637733
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP641583A Pending JPS59132138A (en) | 1983-01-18 | 1983-01-18 | Pellet mounting device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59132138A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61292933A (en) * | 1985-06-20 | 1986-12-23 | Rohm Co Ltd | Method and apparatus for picking up pellet |
| JPS6457639U (en) * | 1987-10-01 | 1989-04-10 | ||
| JPH09186181A (en) * | 1997-01-27 | 1997-07-15 | Rohm Co Ltd | Method and device for picking up pellet |
-
1983
- 1983-01-18 JP JP641583A patent/JPS59132138A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61292933A (en) * | 1985-06-20 | 1986-12-23 | Rohm Co Ltd | Method and apparatus for picking up pellet |
| JPS6457639U (en) * | 1987-10-01 | 1989-04-10 | ||
| JPH09186181A (en) * | 1997-01-27 | 1997-07-15 | Rohm Co Ltd | Method and device for picking up pellet |
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