JPS59129762A - Production of thickly plated metallic wire by molten metal - Google Patents

Production of thickly plated metallic wire by molten metal

Info

Publication number
JPS59129762A
JPS59129762A JP440283A JP440283A JPS59129762A JP S59129762 A JPS59129762 A JP S59129762A JP 440283 A JP440283 A JP 440283A JP 440283 A JP440283 A JP 440283A JP S59129762 A JPS59129762 A JP S59129762A
Authority
JP
Japan
Prior art keywords
metal
molten metal
metallic wire
rolls
wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP440283A
Other languages
Japanese (ja)
Other versions
JPS649394B2 (en
Inventor
Takaharu Yonemoto
米本 隆治
Mitsuaki Onuki
大貫 光明
Yasuhiko Miyake
三宅 保彦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Cable Ltd
Original Assignee
Hitachi Cable Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Cable Ltd filed Critical Hitachi Cable Ltd
Priority to JP440283A priority Critical patent/JPS59129762A/en
Publication of JPS59129762A publication Critical patent/JPS59129762A/en
Publication of JPS649394B2 publication Critical patent/JPS649394B2/ja
Granted legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C2/00Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
    • C23C2/34Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor characterised by the shape of the material to be treated
    • C23C2/36Elongated material
    • C23C2/38Wires; Tubes

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Coating With Molten Metal (AREA)

Abstract

PURPOSE:To obtain a thickly plated metallic wire having a smooth surface by inserting a metallic wire advanced into a molten metal into the hole formed between two grooved and water-cooled rolls and adhering the solidified metal thereon. CONSTITUTION:Two water cooled rolls 6, 6 are pressed to each other and are disposed in a tank 1 filled therein with a molten metal 2, in such a way that the line connecting the central axes thereof is positioned on the liquid surface. A groove 8 having a semicircular sectional shape is provided circumferentially on the outside circumferential surface of each roll, and a circular hole part 7 is formed in each contact part. A metallic wire 3 having the m.p. higher than the m.p. of the metal 2 is advanced into the metal 2 and is conducted, via a guide roll 5, to the inserting hole part 7 between the rolls 6 and 6. The metal 2 solidifies and grows along the groove 8 according to the rotation of the rolls 6, 6, and the solidified metals and the wire 3 are adhered to each other near the inserting hole and the metallic wire is pulled up as a plated metallic wire 4. A thick plating film is easily formed by the above-mentioned method.

Description

【発明の詳細な説明】 本発明は溶融金属による厚メツキ金属線の製造方法に関
するものである。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing thick plated metal wire using molten metal.

一般に溶融金属による溶融メッキ方法は第1図に示すよ
うにタンク1内の溶融金属中に矢印の方向へ金属線3を
進入させ、ガイドロール5を介してその金属線に溶融金
属を付着させることによりメッキ層を形成させてメッキ
金属線4を得ていた。
Generally, the hot-dip plating method using molten metal involves introducing a metal wire 3 into the molten metal in a tank 1 in the direction of the arrow and adhering the molten metal to the metal wire via a guide roll 5, as shown in FIG. A plated metal wire 4 was obtained by forming a plated layer.

しかしながら、この方法に於いては得られたメッキ金属
線のメッキ層表面は自由凝固となるため、平滑でなく、
まだ溶融金属は金属線を引き上げる際に落下するためあ
る一定量以上はメッキされず厚いメッキ被膜を得ること
は困難であった。
However, in this method, the surface of the plated layer of the plated metal wire obtained is not smooth because it solidifies freely.
Since the molten metal falls when the metal wire is pulled up, more than a certain amount is not plated, making it difficult to obtain a thick plating film.

本発明の目的は、前記した従来技術の欠点を解消し、金
属線に表面が平滑な厚メツキ被膜を得る厚メツキ金属線
の製造方法を提供することにある。
SUMMARY OF THE INVENTION An object of the present invention is to provide a method for manufacturing a thickly plated metal wire, which eliminates the drawbacks of the prior art described above and provides a thick plated coating with a smooth surface on the metal wire.

即ち本発明の要旨は、溝付きの2個の水冷ロールを用い
、前記2個のロールの当接により形成される孔の間に溶
融金属中に進入してきた金属線を挿通し、金属線のまわ
りに各々のロールによって凝固させた溶融金属を接着さ
せながらメッキする点にある。
That is, the gist of the present invention is to use two water-cooled rolls with grooves, to insert the metal wire that has entered the molten metal between the holes formed by the contact between the two rolls, and to cool the metal wire. The point is that plating is performed while adhering solidified molten metal to the surrounding area using each roll.

以下に本発明の実施例を図面に基づいて詳述する、 第2図に於いて、タンク1内には溶融金属2が充されて
いる。一方性周面円周方向に断面が半円状の溝8を有し
た2個の水冷ロール6.6が当接して円形状孔部7を形
成しており、且つこれら当接した2個のロールはその中
心#4(1を結ぶ線が溶融金属の液面に位置するような
配置関係とする。尚5はガイドロールを示し、金属線3
を水冷ロール6.6間の孔部に導くように適宜位置に設
定されている。
Embodiments of the present invention will be described in detail below with reference to the drawings. In FIG. 2, a tank 1 is filled with molten metal 2. Two water-cooled rolls 6.6 each having a groove 8 with a semicircular cross section in the circumferential direction on one-sided circumferential surfaces are in contact with each other to form a circular hole 7. The rolls are arranged so that the line connecting center #4 (1) is located at the liquid level of the molten metal. 5 indicates a guide roll, and metal wire 3
It is set at an appropriate position so as to guide the water into the hole between the water-cooled rolls 6.6.

上記構成に於いて、溶融金属より融点の高い、即ち特性
の異なる金属線3をタンク1の溶融金属中につける。引
き続き金属線をガイドロール5を介して水冷ロール間の
挿通孔へ導入する。
In the above configuration, a metal wire 3 having a higher melting point than the molten metal, that is, having different characteristics, is attached to the molten metal in the tank 1. Subsequently, the metal wire is introduced through the guide roll 5 into the insertion hole between the water-cooled rolls.

まだ水冷ロールは矢印方向の回転をしているのでロール
の溝に沿って溶融金属が凝固成長し、ロール同士の当接
点即ち挿通孔近傍において凝固金属同士および金属線が
接着され、上方へメッキ金属線5となって引上げられる
とと\なる。
Since the water-cooled roll is still rotating in the direction of the arrow, the molten metal solidifies and grows along the grooves of the roll, and the solidified metal and the metal wire are bonded to each other at the point of contact between the rolls, that is, near the insertion hole, and the plated metal flows upward. When it becomes line 5 and is pulled up, it becomes \.

この際ロール回転速度、水冷量、孔径を変えることによ
って任意の厚さのメッキ被膜を得ることが可能である。
At this time, it is possible to obtain a plating film of any thickness by changing the roll rotation speed, amount of water cooling, and hole diameter.

また水冷ロールは溝8の部分のみに熱伝導性の高い金属
を使用して凝固しやすくし、その他のロール面には断熱
材などを使用することにより、孔形状どおりにメッキ被
膜を形成させることが可能である。
In addition, the water-cooled roll uses a highly thermally conductive metal only in the grooves 8 to make it easier to solidify, and by using heat insulating material on the other roll surfaces, a plating film can be formed in accordance with the hole shape. is possible.

まだ、通常溶融金属の凝固はロール面が当接する部分よ
り下方で形成されており、ロール面の当接する部分での
若干の圧延も行なわれるため、金属線と溶融金属の接着
が良好となる。
However, the solidification of the molten metal is usually formed below the area where the roll surface contacts, and some rolling is also performed at the area where the roll surface contacts, resulting in good adhesion between the metal wire and the molten metal.

さらにこのようにして得られたメッキ線を圧延あるいは
伸線加工して細線としても良い、この際により接着を強
固とするだめに拡散加熱を行なっても良い。
Further, the plated wire thus obtained may be rolled or drawn to form a fine wire. At this time, diffusion heating may be performed to further strengthen the adhesion.

尚、前記実施例に於いては、メッキすべき線を丸線とし
だが必らずしもこの限りではなく形状はどんなものでも
良く、まだメッキ後の形状も溝形状を変えることにより
任意に行なうことが出来る。
Incidentally, in the above embodiment, the wire to be plated is a round wire, but this is not necessarily the case, and the shape may be any shape, and the shape after plating can be changed arbitrarily by changing the shape of the groove. I can do it.

上述した如く本発明にあっては容易に厚メツキ被膜を得
ることが出来、例えばZnメッキ#l線においては耐食
性の飛躍的な向上がはがれる。また本発明は金属線のま
わシに、溶融金属を凝固させる機構であるため従来溶融
メッキでは接着性が悪かった組合せにおいても素材を作
った後、加熱、伸線を行なうことによってメッキ線を製
造することも可能となる。
As described above, according to the present invention, a thick plating film can be easily obtained, and for example, a Zn-plated #1 wire can be peeled off with a dramatic improvement in corrosion resistance. In addition, since the present invention has a mechanism that solidifies molten metal on the metal wire roll, plated wire can be manufactured by heating and drawing the material after making the material, even in combinations where conventional hot-dip plating had poor adhesion. It is also possible to do so.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は従来の溶融メッキ方法を示す装置の概略断面図
である。 第2図は本発明の実施例を示す装置の断面図である。 第3図は第2図の水冷ロールの液面方向断面図である。 図中符号
FIG. 1 is a schematic cross-sectional view of an apparatus showing a conventional hot-dip plating method. FIG. 2 is a sectional view of an apparatus showing an embodiment of the present invention. FIG. 3 is a cross-sectional view of the water-cooled roll shown in FIG. 2 in the liquid surface direction. Symbol in the diagram

Claims (1)

【特許請求の範囲】[Claims] 外周面円周方向に沿って溝を有する2個の水冷ロールを
当接させて金属挿通孔を形成すると共に前記両ロールを
その中心軸を結ぶ線が溶融金属の液面付近に位置する配
置関係とし、前記挿通孔に前記溶融金属内に導ひかれる
異種金属線を通し、前記水冷ロールの回転に伴って金属
線を移動させつつ前記金属線のまわりに溶融金属を凝固
させ厚メツキ被膜を形成することを特徴とする溶融金属
による厚メツキ金属線の製造方法。
A metal insertion hole is formed by bringing two water-cooled rolls having grooves along the circumferential direction of their outer peripheral surfaces into contact with each other, and a line connecting the central axes of both rolls is located near the liquid surface of the molten metal. A dissimilar metal wire guided into the molten metal is passed through the insertion hole, and the molten metal is solidified around the metal wire while moving the metal wire as the water cooling roll rotates to form a thick plating film. A method for producing thick plated metal wire using molten metal, characterized by:
JP440283A 1983-01-14 1983-01-14 Production of thickly plated metallic wire by molten metal Granted JPS59129762A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP440283A JPS59129762A (en) 1983-01-14 1983-01-14 Production of thickly plated metallic wire by molten metal

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP440283A JPS59129762A (en) 1983-01-14 1983-01-14 Production of thickly plated metallic wire by molten metal

Publications (2)

Publication Number Publication Date
JPS59129762A true JPS59129762A (en) 1984-07-26
JPS649394B2 JPS649394B2 (en) 1989-02-17

Family

ID=11583339

Family Applications (1)

Application Number Title Priority Date Filing Date
JP440283A Granted JPS59129762A (en) 1983-01-14 1983-01-14 Production of thickly plated metallic wire by molten metal

Country Status (1)

Country Link
JP (1) JPS59129762A (en)

Also Published As

Publication number Publication date
JPS649394B2 (en) 1989-02-17

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