JPS59128763U

JPS59128763U - Ceramic substrate dividing device

Info

Publication number: JPS59128763U
Application number: JP2266983U
Authority: JP
Inventors: 昇高橋
Original assignee: 株式会社富士通ゼネラル
Priority date: 1983-02-18
Filing date: 1983-02-18
Publication date: 1984-08-30
Also published as: JPH0140653Y2

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Brief explanation of drawings]

第１図はマトリクス状に区画された複数のチップ基板を
含むセラミック製母基板の斜視図、第２図はこの考案の
分割装置の一実施例を示す斜視図、　　□第３図は第２
図の■−■線断面図、第４図は第２図のＩＶ−ｒＶ線断
面図、第５図は第２図の■−Ｖ線断面図、第６図は第２
図のＶＩ−ＶＩ線断面図である。図中、１は母基板、２は筋目線、３はチップ基板、１０
はプレート本体、１１は操作レバー、１３は刃体、１４
は案内金具、１５はスプリング、１８は水平段部、１９
は垂直端面部、２０はガイド手段、２５はシュータ、２
９は突起、３０はピン、３３はマガジンホルダー、３４
はマガジンで、ＩＩ第４図２１　２２　．１２２／／！１Fig. 1 is a perspective view of a ceramic motherboard containing a plurality of chip substrates partitioned into a matrix, Fig. 2 is a perspective view showing an embodiment of the dividing device of this invention, □ Fig. 3 is a perspective view of a second
Figure 4 is a sectional view taken along line IV-rV in Figure 2, Figure 5 is a sectional view taken along line ■-V in Figure 2, Figure 6 is a sectional view taken along line 2
It is a sectional view taken along the line VI-VI in the figure. In the figure, 1 is the mother board, 2 is the line, 3 is the chip board, and 10
is the plate body, 11 is the operating lever, 13 is the blade body, 14
is a guide fitting, 15 is a spring, 18 is a horizontal step, 19
2 is a vertical end face, 20 is a guide means, 25 is a shooter, 2
9 is a protrusion, 30 is a pin, 33 is a magazine holder, 34
is a magazine, II Fig. 4 21 22 . 122//! 1

Claims

[Scope of utility model registration request]

(1) A device for dividing a ceramic motherboard including a plurality of chip substrates partitioned into a matrix along a grid line, the device including a plate body and one side of the plate body. arranged parallel to the
a blade body provided to move up and down in a direction perpendicular to the upper surface of the plate body; a guide means provided on the plate body so as to guide the mother board toward the blade body; a shooter that drops chip substrate aggregates divided from the motherboard by a blade in units of one column or one row in the same direction; and a storage for the chip substrate aggregates that is detachably attached to the lower end of the shooter. A ceramic substrate dividing device characterized by being equipped with a magazine.

(2) Utility model registration In claim (1), the blade body is attached to an operating lever that is rotatable in the vertical direction and that is normally biased upward by a spring. A ceramic substrate dividing device featuring:

(3) Utility model registration In claim (1) or (2), the blade body has a horizontal stepped portion formed parallel to the surface of the motherboard and a horizontal stepped portion orthogonal to the horizontal stepped portion. A concave portion is formed with a vertical end surface portion cut in such a manner that the blade body is in an upper inoperative position, and an edge thereof is in contact with the mother board on the vertical end surface portion. Features: Ceramic substrate dividing device.

(4) Utility model registration In claim (1), means for preventing the chip substrate assembly divided by the blade from being reversed is provided near the top of the shooter near the plate body. A ceramic substrate dividing device characterized by:

(5) Scope of claims for utility model registration (1) or (4)
To J...! The shooter is arranged in a funnel shape.
It has a pair of guide plates, and a means for abutting one end of the chip substrate assembly divided by the blade and rotating the other end downward is provided on the top of one of the guide plates. A ceramic substrate dividing device characterized by:

(6) In claim (1) for utility model registration, the magazine is an E-shaped body with cross sections substantially facing each other, and includes a pair of upper sides, a pair of middle holes, and a bottom wall. , comprising a pair of protrusions provided on the bottom wall portion, and the chip substrate assembly is held between the pair of hollow holes and the pair of protrusions. Ceramic substrate dividing device.