JPS59128751U - surface emitting device - Google Patents
surface emitting deviceInfo
- Publication number
- JPS59128751U JPS59128751U JP2260183U JP2260183U JPS59128751U JP S59128751 U JPS59128751 U JP S59128751U JP 2260183 U JP2260183 U JP 2260183U JP 2260183 U JP2260183 U JP 2260183U JP S59128751 U JPS59128751 U JP S59128751U
- Authority
- JP
- Japan
- Prior art keywords
- base
- emitting device
- peripheral wall
- light emitting
- main surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Illuminated Signs And Luminous Advertising (AREA)
- Switch Cases, Indication, And Locking (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図A、 Bはそれぞれこの考案に係る面発光装置の
一例を示す平面図および断面図、第2図は同装置の分解
斜視図である。
11・・・反射皿、12・・・ベース、13・・・周壁
、13a・・・内面、15..15□・・・発光素子、
16j。
162・・・素子設定用フレーム片、17.17□・・
・リード線接続用フレーム片、22・・・透光性物質、
23・・・光散乱材。FIGS. 1A and 1B are a plan view and a sectional view showing an example of a surface emitting device according to this invention, respectively, and FIG. 2 is an exploded perspective view of the same device. DESCRIPTION OF SYMBOLS 11... Reflection plate, 12... Base, 13... Peripheral wall, 13a... Inner surface, 15. .. 15□...Light emitting element,
16j. 162...Frame piece for element setting, 17.17□...
・Frame piece for lead wire connection, 22...transparent material,
23...Light scattering material.
Claims (1)
り状の周壁からなる反射皿により複数個の発光素子から
の光を外部に放射させる面発光装置において、上記ベー
スと周壁とを別体に構成し、上記発光素子に対応する素
子設定用およびリード線接続用のフレーム片を上記ベー
ス主面に形成した嵌合溝に圧入して、上記ベース主面に
接合固定した上記周壁内に光散乱材を含んだ透光性物質
を充填した面発光装置。In a surface light emitting device that radiates light from a plurality of light emitting elements to the outside using a base and a reflecting plate that is provided on the main surface of the base and has a peripheral wall whose inner surface is flared toward the end, the base and the peripheral wall are configured separately. , a frame piece for element setting and lead wire connection corresponding to the light emitting element is press-fitted into a fitting groove formed on the main surface of the base, and a light scattering material is placed in the peripheral wall bonded and fixed to the main surface of the base. A surface-emitting device filled with a translucent material.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2260183U JPS59128751U (en) | 1983-02-17 | 1983-02-17 | surface emitting device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2260183U JPS59128751U (en) | 1983-02-17 | 1983-02-17 | surface emitting device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS59128751U true JPS59128751U (en) | 1984-08-30 |
Family
ID=30153694
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2260183U Pending JPS59128751U (en) | 1983-02-17 | 1983-02-17 | surface emitting device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS59128751U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2017022420A (en) * | 2010-06-01 | 2017-01-26 | エルジー イノテック カンパニー リミテッド | Light emitting element package |
-
1983
- 1983-02-17 JP JP2260183U patent/JPS59128751U/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2017022420A (en) * | 2010-06-01 | 2017-01-26 | エルジー イノテック カンパニー リミテッド | Light emitting element package |
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