JPS591252Y2 - Micro light emitting diode display - Google Patents
Micro light emitting diode displayInfo
- Publication number
- JPS591252Y2 JPS591252Y2 JP1979162908U JP16290879U JPS591252Y2 JP S591252 Y2 JPS591252 Y2 JP S591252Y2 JP 1979162908 U JP1979162908 U JP 1979162908U JP 16290879 U JP16290879 U JP 16290879U JP S591252 Y2 JPS591252 Y2 JP S591252Y2
- Authority
- JP
- Japan
- Prior art keywords
- light
- emitting diode
- shielding frame
- light emitting
- window
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Illuminated Signs And Luminous Advertising (AREA)
Description
【考案の詳細な説明】
本案は写真機等に組込まれる微小発光ダイオード表示器
に関する。[Detailed Description of the Invention] The present invention relates to a minute light emitting diode display device incorporated into a camera or the like.
従来、発光ダイオードを用いたハイブリッド型の小型表
示器では、第１図に示すように、発光ダイオード１０３
を囲む遮光枠１０６にくりぬき部１２６を設け、このく
りぬき部１２６に発光ダイオード１０３等の一部を収納
していた。Conventionally, in a hybrid type small display device using light emitting diodes, as shown in FIG.
A cutout 126 was provided in the light shielding frame 106 surrounding the light shielding frame 106, and a part of the light emitting diode 103 and the like was housed in the cutout 126.
しかし光の透過を生じさせない為、又強度を保つ為くり
ぬき部１２６の上方はうすくできないが写真機等に組み
込むにはもつと小型である必要がある。However, in order to prevent light from passing through and to maintain strength, the upper portion of the hollowed out portion 126 cannot be made thin, but it must be small enough to be incorporated into a camera or the like.
しかも発光ダイオード１０３の相互位置も近接している
ので従来のようなくりぬき部１２６があると、くりぬき
部１２６どうしが接して透孔が生じたす遮光枠１０６の
壁がうすくなって光洩れを生じたりして不都合であった
。Moreover, since the positions of the light emitting diodes 103 are close to each other, if there are cutouts 126 as in the conventional case, the wall of the light-shielding frame 106 where the cutouts 126 touch each other and the through holes are formed becomes thinner, causing light leakage. It was very inconvenient.
本案はこの不都合をなくするためになされたもので、以
下本案を詳細に説明する。This proposal was made to eliminate this inconvenience, and will be explained in detail below.
第２図は本案実施例の写真機用レベルメータの断面図で
ある。FIG. 2 is a sectional view of a level meter for a camera according to an embodiment of the present invention.
具体例を示しながら説明すると、１は厚さＱ、５ｍｍの
エポキシ基板で、表面には厚さ数十μｍのプリントパタ
ーン２，２が設けである。To explain with reference to a specific example, reference numeral 1 is an epoxy substrate with a thickness Q of 5 mm, and a printed pattern 2 with a thickness of several tens of μm is provided on the surface.
３はＧａＰの発光ダイオードで一辺Ｑ、３ｍｍのさいこ
ろ状をしており導電性接着剤４でプリントパターン２上
に固着されており、太さ１５μｍの金線５で配線されて
いる。Reference numeral 3 denotes a GaP light emitting diode, which has a dice shape with one side Q and 3 mm, is fixed on the printed pattern 2 with a conductive adhesive 4, and is wired with a gold wire 5 having a thickness of 15 μm.
６は第３図に示すような黒色の樹脂成型品からなる遮光
枠で、発光ダイオード３を囲む窓部７，７・・・・・・
は外側に向く壁面が欠除されている。6 is a light-shielding frame made of a black resin molded product as shown in FIG. 3, and has window portions 7, 7, .
The walls facing outward are missing.
この窓部７，７・・・・・・の大きさは中Ｑ、８ｍｍで
奥ゆきｌ、３ｍｍ高さ０．７ｍｍである。The size of the window portions 7, 7, . . . is medium Q, 8 mm in depth, 3 mm in depth, and 0.7 mm in height.
３８は乳白色の光拡散シートで窓部７，７・・・・・・
の上方を覆うように遮光枠６の上方に敷設しである。38 is a milky white light diffusion sheet and window portions 7, 7...
It is laid above the light shielding frame 6 so as to cover the upper part.
８は厚さ０．１ｍｍの断面路り字状をなした金属のマス
ク板で、発光ダイオード３のま上付近に円形や三角形の
透（Ｌ９を有している。Reference numeral 8 denotes a metal mask plate having a cross section of 0.1 mm in thickness and having a circular or triangular opening (L9) near the top of the light emitting diode 3.
このマスク板８は遮光枠６の窓部７，７・・・・・・の
上面も側面も覆うように、遮光枠６の周辺を溶着させる
等の方法で検定される。This mask plate 8 is tested by welding the periphery of the light shielding frame 6 so as to cover the top and side surfaces of the windows 7, 7, . . . of the light shielding frame 6.
尚、マスク板８の屈曲部１０は直角に曲げると切れたり
弱くなったりする事があるので直角ではなり１００゜乃
至１１０°程度にし、かわりに遮光枠６の外壁も下方が
出張った断面台形状のものとするとより好ましくなる。Note that the bent portion 10 of the mask plate 8 may break or become weak if bent at a right angle, so it should not be at a right angle, but should be at an angle of about 100° to 110°, and the outer wall of the light shielding frame 6 should also have a trapezoidal cross section with a protruding lower part. It is more preferable to use .
第４図は本案の他の実施例の表示器の構成部品を示す斜
視図で、光拡散シートは長方形の樹脂シートでしかない
ので図は省略しである。FIG. 4 is a perspective view showing the components of a display according to another embodiment of the present invention, and the light diffusion sheet is only a rectangular resin sheet, so the illustration is omitted.
第４図のＣにおいて基板１１の上に載置固着された発光
ダイオード１３．１３・・・・・・は、口字状を形成す
る７つのセグメントの略中央部に位置するよう、＊状に
配置しである。In C of FIG. 4, the light emitting diodes 13, 13, . It is arranged.
第４図のｂは白色の樹脂成型品の遮光枠１６の斜視図で
、遮光性だけでなく反射枠のような働きも具備している
。FIG. 4b is a perspective view of the light-shielding frame 16, which is a white resin molded product, and has not only light-shielding properties but also functions like a reflective frame.
口字状のうち周囲の６つのセグメントに対応する窓部１
７，１７・・・・・・はそれぞれ外側に向く壁面が欠除
されている。Window part 1 corresponding to the six surrounding segments of the mouth shape
7, 17, . . . , each has a wall surface facing outward removed.
中央の窓部１７′は従来と同じ円柱又は円錐台状の形状
をなしている。The central window portion 17' has the same cylindrical or truncated conical shape as the conventional one.
尚、遮光枠１６の表面には凸部１６′を設けであるが、
これは光を表示窓一杯に広げるため光拡散シートと遮光
枠表面との間に空間を設ける目的で作られたものである
。Note that the surface of the light-shielding frame 16 is provided with a convex portion 16';
This was created for the purpose of providing a space between the light diffusion sheet and the surface of the light shielding frame in order to spread the light to the entire display window.
従って窓部１７，１７・・・・・・の表面開口部の形状
が広がっている等の配慮があればこの凸部１６′は不要
である。Therefore, if consideration is given to widening the shape of the surface openings of the windows 17, 17, . . ., this convex portion 16' is unnecessary.
基板１１の上に遮光枠１６を接着剤等で固定したのち、
第４図のａに示すマスク板１８で遮光枠１６を覆う。After fixing the light shielding frame 16 on the board 11 with adhesive or the like,
The light-shielding frame 16 is covered with a mask plate 18 shown in FIG. 4a.
マスク板１８には遮光枠１６の窓部１７，１７・・・・
・・１７′に対応する位置に口字状の透孔１９，１９・
・・・・・が設けである。The mask plate 18 has windows 17, 17, . . . of the light shielding frame 16.
・・A mouth-shaped through hole 19, 19・ at the position corresponding to 17′
...is a provision.
本案は上述の如く、基板と、基板上に載置固着された発
光ダオードと、外側に向く壁面が欠除された窓部を有し
、その窓部の中に発光ダイオードが入るように基板上に
固着された遮光枠と、窓部の欠除部を覆う側部と窓部に
対応する位置に所定の形状をなした透孔とを有し、遮光
枠の上方に敷設されたマスク板とを具備したものである
がら遮光枠の載置作業は部品が小さいにもかがわらず一
壁か゛開口しているので行ない易く（第４図の場合は中
央の窓部１７′のみ気をつければよいから従来に比べて
作業能率がよい）、又壁の厚みも十分とれるので光洩れ
も生じないで十分に小さく出来るので、精密機械に組み
込むのにふされしい微小発光ダイオード表示器が提供で
きる。As described above, the present invention includes a substrate, a light emitting diode placed and fixed on the substrate, and a window portion with a wall facing outward, and the light emitting diode is placed on the substrate so that the light emitting diode is inserted into the window portion. A mask board that has a light-shielding frame fixed to the light-shielding frame, a side part that covers the missing part of the window, and a through hole of a predetermined shape at a position corresponding to the window, and a mask plate that is laid above the light-shielding frame. Even though the parts are small, it is easy to place the light-shielding frame because one wall is open (in the case of Fig. 4, you only need to be careful about the window 17' in the center). In addition, since the wall thickness is sufficient, it can be made sufficiently small without causing any light leakage, and therefore a microscopic light emitting diode display suitable for being incorporated into precision machinery can be provided.
第１図は従来の表示器の断面図、第２図は本案一実施例
の表示器の断面図で、第３図は第２図の遮光枠の斜視図
、第４図は本案の他の実施例の部品の斜視図である。
１．１１・・・・・・基板、３，１３．１３・・・・・
・発光ダイオード６゜１６・・・・・・遮光枠、７，７
・・・・・・１７．１７・・・・・・窓部、３８・・・
・・・光拡散シート、８，１８・・・・・・マスク板、
９，１９．１９・・・・・・透孔。Fig. 1 is a cross-sectional view of a conventional display device, Fig. 2 is a cross-sectional view of a display device according to one embodiment of the present invention, Fig. 3 is a perspective view of the light-shielding frame shown in Fig. 2, and Fig. 4 is a cross-sectional view of another embodiment of the present invention. FIG. 3 is a perspective view of parts of an example. 1.11... Board, 3,13.13...
・Light-emitting diode 6゜16...Shading frame, 7,7
・・・・・・17.17・・・Window section, 38...
...Light diffusion sheet, 8,18...Mask plate,
9,19.19...Through hole.
Claims (1)
側に向く壁面が欠除された窓部を有し、その窓部の中に
発光ダイオードが入るように基板上に固着された遮光枠
と、窓部の欠除部を覆う側部と窓部に対応する位置に所
定の形状をなした透孔とを有し、遮光枠の上方に敷設さ
れたマスク板とを具備した事を特徴とする微小発光ダイ
オード表示器。A light-shielding frame having a substrate, a light-emitting diode mounted and fixed on the substrate, and a window portion with a wall facing outwards removed, and fixed on the substrate so that the light-emitting diode enters the window portion. It is characterized by having a side part that covers the missing part of the window part, a through hole in a predetermined shape at a position corresponding to the window part, and a mask plate placed above the light-shielding frame. A miniature light-emitting diode indicator.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1979162908U JPS591252Y2 (en) | 1979-11-24 | 1979-11-24 | Micro light emitting diode display |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1979162908U JPS591252Y2 (en) | 1979-11-24 | 1979-11-24 | Micro light emitting diode display |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5680573U JPS5680573U (en) | 1981-06-30 |
| JPS591252Y2 true JPS591252Y2 (en) | 1984-01-13 |
Family
ID=29673910
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1979162908U Expired JPS591252Y2 (en) | 1979-11-24 | 1979-11-24 | Micro light emitting diode display |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS591252Y2 (en) |
-
1979
- 1979-11-24 JP JP1979162908U patent/JPS591252Y2/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5680573U (en) | 1981-06-30 |
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