JPS59120128U - Resin mold equipment - Google Patents

Resin mold equipment

Info

Publication number
JPS59120128U
JPS59120128U JP1345783U JP1345783U JPS59120128U JP S59120128 U JPS59120128 U JP S59120128U JP 1345783 U JP1345783 U JP 1345783U JP 1345783 U JP1345783 U JP 1345783U JP S59120128 U JPS59120128 U JP S59120128U
Authority
JP
Japan
Prior art keywords
resin mold
mold equipment
resin
viscosity
pot
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1345783U
Other languages
Japanese (ja)
Inventor
須山　直美
Original Assignee
日本電気ホームエレクトロニクス株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気ホームエレクトロニクス株式会社 filed Critical 日本電気ホームエレクトロニクス株式会社
Priority to JP1345783U priority Critical patent/JPS59120128U/en
Publication of JPS59120128U publication Critical patent/JPS59120128U/en
Pending legal-status Critical Current

Links

Landscapes

  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

−第１図は従来の樹脂モールド装置の構造を示す、　　
側断面図、第２図は本考案の一実施例を示す個所ｉ　　
面図を示す。 ［３・・・・・・ポット、５・・・・・・ランナ、６・
・・・・・金型キヤ、　′ビテイ、７・・・・・・ゲー
ト、９・・・・・−樹脂、１１・・・・・・粘度検出手
段、１２・・・・・・シャッタ。-Figure 1 shows the structure of a conventional resin molding device,
A side sectional view, FIG. 2 shows a part i of an embodiment of the present invention.
Show the front view. [3...Pot, 5...Runner, 6.
...Mold carrier, 'bite, 7...Gate, 9...-Resin, 11...Viscosity detection means, 12...Shutter.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] ポットに供給された樹脂を加熱流動化し加圧してランチ
及びゲートを介して金型キャビティ内に充填するものに
おいて、上記ポット内の樹脂の粘度を検出する粘度検出
手段と、粘度検出手段の検出出力に基いてランチを開閉
するシャッタとを具備したことを特徴とする樹脂モール
ド装置２A viscosity detection means for detecting the viscosity of the resin in the pot, and a detection output of the viscosity detection means, in a device that heats and fluidizes the resin supplied to the pot, pressurizes it, and fills it into the mold cavity via a launch and a gate. Resin molding device 2 characterized in that it is equipped with a shutter that opens and closes the lunch based on
JP1345783U 1983-01-31 1983-01-31 Resin mold equipment Pending JPS59120128U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1345783U JPS59120128U (en) 1983-01-31 1983-01-31 Resin mold equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1345783U JPS59120128U (en) 1983-01-31 1983-01-31 Resin mold equipment

Publications (1)

Publication Number Publication Date
JPS59120128U true JPS59120128U (en) 1984-08-13

Family

ID=30144841

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1345783U Pending JPS59120128U (en) 1983-01-31 1983-01-31 Resin mold equipment

Country Status (1)

Country Link
JP (1) JPS59120128U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006016609A1 (en) * 2004-08-11 2006-02-16 Japan Gmt Co., Ltd. Mold for stamping molding, stamping molding device, method of manufacturing stamping molded product, and stamping molded product

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006016609A1 (en) * 2004-08-11 2006-02-16 Japan Gmt Co., Ltd. Mold for stamping molding, stamping molding device, method of manufacturing stamping molded product, and stamping molded product

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