JPS59111345A - Low-permittivity circuit substrate - Google Patents

Low-permittivity circuit substrate

Info

Publication number
JPS59111345A
JPS59111345A JP57220331A JP22033182A JPS59111345A JP S59111345 A JPS59111345 A JP S59111345A JP 57220331 A JP57220331 A JP 57220331A JP 22033182 A JP22033182 A JP 22033182A JP S59111345 A JPS59111345 A JP S59111345A
Authority
JP
Japan
Prior art keywords
powder
ceramic
permittivity
circuit substrate
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP57220331A
Other languages
Japanese (ja)
Inventor
Kishio Yokouchi
貴志男 横内
Kazuaki Kurihara
和明 栗原
Nobuo Kamehara
亀原　伸男
Koichi Niwa
丹羽　紘一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP57220331A priority Critical patent/JPS59111345A/en
Publication of JPS59111345A publication Critical patent/JPS59111345A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/15—Ceramic or glass substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass

Abstract

PURPOSE:To lower the permittivity of a ceramic material as a dielectric for the circuit substrate by dispersing hollow spherical powder into a raw material matrix for ceramics. CONSTITUTION:Glass powder 1 crushed up to approximately several micron and hollow alumina 2 are kneaded with a resin and a solvent and changed into a slurry-shaped material, molded to a substrate shape, and sintered at the softening point of glass. The clearances of hollow alumina 2 are filled with glass powder 1 and the powder combines with the hollow alumina, thus forming the substrate. Accordingly, the ceramic circuit substrate of 4-5 low permittivity is obtained.

Description

【発明の詳細な説明】 （１）発明の技術分野 本発明はＬＳＩなどの電子部品を実装配線するための回
路基板に関し、より詳しくは回路基板の誘電率を下げ、
電気信号の高速伝搬をも可能にする基板の材料、形状に
関する。DETAILED DESCRIPTION OF THE INVENTION (1) Technical field of the invention The present invention relates to a circuit board for mounting and wiring electronic components such as LSI, and more specifically, it relates to a circuit board for mounting and wiring electronic components such as LSIs, and more specifically, to reduce the dielectric constant of the circuit board,
It relates to the material and shape of the substrate that also enables high-speed propagation of electrical signals.

（２）技術の背景 近年ＬＳＩの高性能及び高集積化の傾向は次第に加速的
になってきている。そのＬＳＩの実装法としては■個々
の素子にパッケージを施す方法と■多数の素子を基板上
に実装する方法であるセラミック多層基板がある。この
ようなセラミック多層基板に対しては多層構造、放熱、
低誘電率などの技術的事項が要求さ扛ている。(2) Technical Background In recent years, the trend toward higher performance and higher integration of LSIs has been gradually accelerating. The LSI mounting methods include (1) a method of packaging individual elements, and (2) a method of mounting a large number of elements on a substrate, which is a ceramic multilayer board. Multilayer structure, heat dissipation,
Technical issues such as low dielectric constant are required.

（３）従来技術と問題点 従来前記のように回路基板の材料は放熱、多層化などの
点から樹脂に代ってセラミックが使用されるようになっ
ている。ところがセラミック材料は一般に樹脂に比べて
誘電率が下記のように高く、信号の高速伝搬を妨げる欠
点があった。(3) Prior Art and Problems Conventionally, as mentioned above, ceramics have been used as materials for circuit boards instead of resins from the viewpoint of heat dissipation, multilayering, etc. However, ceramic materials generally have a higher dielectric constant than resins, as shown below, and have the disadvantage of hindering high-speed signal propagation.

（４）発明の目的 本発明はセラミック回路基板において誘電体であるセラ
ミック材料の誘電率を低下することを目的とする。(4) Purpose of the Invention The purpose of the present invention is to reduce the dielectric constant of a ceramic material that is a dielectric in a ceramic circuit board.

（５）発明の構成 一般に回路基板の誘電率は導体間の材料の誘電率の平均
値として影響するので、セラミックに微細な空孔を作る
ことにより見かけの誘電率を低下させることができる。(5) Structure of the Invention Generally, the dielectric constant of a circuit board is affected by the average value of the dielectric constant of the material between the conductors, so the apparent dielectric constant can be lowered by creating fine pores in the ceramic.

本発明はこのようにセラミック基板に空孔を作る手段と
して中空形状のセラミック粉末を使用することを構成す
るものである。すなわち本発明はセラミック粉末の焼結
によって形成される回路基板において、誘電体であるセ
ラミックの原料マドＩＪックス中に、中空球状の粉末を
分散させたことを特徴とした回路基板を提供する。The present invention thus constitutes the use of hollow ceramic powder as a means for creating holes in a ceramic substrate. That is, the present invention provides a circuit board formed by sintering ceramic powder, characterized in that hollow spherical powder is dispersed in a ceramic raw material mud IJx that is a dielectric.

本発明において中空球状の粉末は無機質の粉末であれば
よく、特にＡｆｉ２０３が好ましい。In the present invention, the hollow spherical powder may be any inorganic powder, and Afi203 is particularly preferred.

さらに本発明において中空球状の粉末のかさ比重及び粒
径は適当に所望の用途目的に合わせて選択することがで
きる。Further, in the present invention, the bulk specific gravity and particle size of the hollow spherical powder can be appropriately selected depending on the desired purpose of use.

（６）発明の実施例 第１図に示されているように、数ミクロン程度に粉砕し
たガラス粉末１と中空アルミナ２を樹脂及び溶剤と混練
してスラリー状とし、基板形状に成形してガラス軟化点
で焼結する。ガラス粉末１は中空アルミナ２の隙間を満
して結合し、基板を形成することができた。その結果訪
電率４〜５の低誘電率のセラミック回路基板を得ること
ができた。(6) Embodiment of the Invention As shown in FIG. 1, glass powder 1 crushed to several microns and hollow alumina 2 are kneaded with a resin and a solvent to form a slurry, and the slurry is formed into a substrate shape. Sinter at softening point. The glass powder 1 filled the gap between the hollow alumina 2 and was bonded to form a substrate. As a result, a low dielectric constant ceramic circuit board with a contact factor of 4 to 5 could be obtained.

（７）発明の効果 本発明によればセラミック回路基板の見かけの誘電率を
低下させることができるので伝送特性を向上式せること
ができる。(7) Effects of the Invention According to the present invention, the apparent dielectric constant of the ceramic circuit board can be lowered, so that the transmission characteristics can be improved.

【図面の簡単な説明】[Brief explanation of the drawing]

第１図はセラミック回路基板断面の略図である。 １・・・ガラス、　　　２・・・中空ア゛ルミナ、３・
・・導体パターン。 特許出願人 富士通株裕会社 特許出願代理人 弁理士　青　木　　　　朗 弁理士　西　舘　和　之 弁理士　　内　　１）　幸　　男 弁理士　　山　　口　　昭　　之FIG. 1 is a schematic diagram of a cross section of a ceramic circuit board. 1...Glass, 2...Hollow alumina, 3...
...Conductor pattern. Patent applicant Fujitsu Ltd. Patent application representative Patent attorney Akira Aoki Patent attorney Kazuyuki Nishidate Patent attorney 1) Yukio Patent attorney Akiyuki Yamaguchi

Claims (1)

【特許請求の範囲】[Claims] セラミック粉末の焼結によって形成される回路基板にお
いて、誘電体であるセラミックの原料マトリックス中に
、中空球状の粉末を分散させたことを特徴とした回路基
板。A circuit board formed by sintering ceramic powder, characterized in that hollow spherical powder is dispersed in a ceramic raw material matrix that is a dielectric.
JP57220331A 1982-12-17 1982-12-17 Low-permittivity circuit substrate Pending JPS59111345A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57220331A JPS59111345A (en) 1982-12-17 1982-12-17 Low-permittivity circuit substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57220331A JPS59111345A (en) 1982-12-17 1982-12-17 Low-permittivity circuit substrate

Publications (1)

Publication Number Publication Date
JPS59111345A true JPS59111345A (en) 1984-06-27

Family

ID=16749467

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57220331A Pending JPS59111345A (en) 1982-12-17 1982-12-17 Low-permittivity circuit substrate

Country Status (1)

Country Link
JP (1) JPS59111345A (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0234896A2 (en) * 1986-02-28 1987-09-02 Digital Equipment Corporation Improved micro-electronics devices and methods of manufacturing same
EP0405947A2 (en) * 1989-06-27 1991-01-02 Digital Equipment Corporation Method of manufacturing thick-film devices
EP0450773A2 (en) * 1990-03-23 1991-10-09 Minnesota Mining And Manufacturing Company Ceramic composite for electronic applications
EP0477004A2 (en) * 1990-09-20 1992-03-25 Fujitsu Limited Multi-layer wiring board
US5204289A (en) * 1991-10-18 1993-04-20 Minnesota Mining And Manufacturing Company Glass-based and glass-ceramic-based composites
US5213878A (en) * 1990-03-23 1993-05-25 Minnesota Mining And Manufacturing Company Ceramic composite for electronic applications
US5324370A (en) * 1992-02-27 1994-06-28 Fujitsu Limited Method of manufacturing a multi-layered ceramic circuit board containing layers of reduced dielectric constant
WO2018083830A1 (en) * 2016-11-02 2018-05-11 株式会社村田製作所 Ceramic electronic component and method for manufacturing ceramic electronic component

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5426873A (en) * 1977-07-30 1979-02-28 Matsushita Electric Works Ltd Method of strengthing base material of paper for resin impregnation
JPS5728345A (en) * 1980-06-26 1982-02-16 Ibm Method of forming ceramic substrate
JPS5789212A (en) * 1980-11-25 1982-06-03 Tdk Electronics Co Ltd Composite ceramic electronic material

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5426873A (en) * 1977-07-30 1979-02-28 Matsushita Electric Works Ltd Method of strengthing base material of paper for resin impregnation
JPS5728345A (en) * 1980-06-26 1982-02-16 Ibm Method of forming ceramic substrate
JPS5789212A (en) * 1980-11-25 1982-06-03 Tdk Electronics Co Ltd Composite ceramic electronic material

Cited By (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63358A (en) * 1986-02-28 1988-01-05 ディジタル　イクイップメント　コーポレーション Low permittivity material for manufacture of subminiature electronic device
EP0234896A2 (en) * 1986-02-28 1987-09-02 Digital Equipment Corporation Improved micro-electronics devices and methods of manufacturing same
EP0405947A2 (en) * 1989-06-27 1991-01-02 Digital Equipment Corporation Method of manufacturing thick-film devices
US5213878A (en) * 1990-03-23 1993-05-25 Minnesota Mining And Manufacturing Company Ceramic composite for electronic applications
EP0450773A2 (en) * 1990-03-23 1991-10-09 Minnesota Mining And Manufacturing Company Ceramic composite for electronic applications
US5108958A (en) * 1990-03-23 1992-04-28 Minnesota Mining And Manufacturing Company Ceramic composite for electronic applications
EP0477004A2 (en) * 1990-09-20 1992-03-25 Fujitsu Limited Multi-layer wiring board
US5275889A (en) * 1990-09-20 1994-01-04 Fujitsu Limited Multi-layer wiring board
GB2260541A (en) * 1991-10-18 1993-04-21 Minnesota Mining & Mfg Glass - and - glass - ceramic- based composites
US5204289A (en) * 1991-10-18 1993-04-20 Minnesota Mining And Manufacturing Company Glass-based and glass-ceramic-based composites
GB2260541B (en) * 1991-10-18 1995-09-13 Minnesota Mining & Mfg Glass-based and glass-ceramic-based composites
DE4234349C2 (en) * 1991-10-18 2002-02-07 Minnesota Mining & Mfg Glass-based and glass-ceramic-based composites and process for their manufacture
US5324370A (en) * 1992-02-27 1994-06-28 Fujitsu Limited Method of manufacturing a multi-layered ceramic circuit board containing layers of reduced dielectric constant
US5534331A (en) * 1992-02-27 1996-07-09 Fujitsu Limited Method of manufacturing a multi-layered ceramic circuit board containing layers of reduced dielectric constant
WO2018083830A1 (en) * 2016-11-02 2018-05-11 株式会社村田製作所 Ceramic electronic component and method for manufacturing ceramic electronic component
CN109644556A (en) * 2016-11-02 2019-04-16 株式会社村田制作所 The manufacturing method of ceramic electronic components and ceramic electronic components
JPWO2018083830A1 (en) * 2016-11-02 2019-06-24 株式会社村田製作所 Ceramic electronic component and method of manufacturing ceramic electronic component
US11037729B2 (en) 2016-11-02 2021-06-15 Murata Manufacturing Co., Ltd. Ceramic electronic component and method for manufacturing ceramic electronic component
CN109644556B (en) * 2016-11-02 2021-09-03 株式会社村田制作所 Ceramic electronic component and method for manufacturing ceramic electronic component

Similar Documents

Publication Publication Date Title
KR930000881B1 (en) Ceramic polylayer circuit panel and semiconductor module
US4781968A (en) Micro-electronics devices and methods of manufacturing same
US4865875A (en) Micro-electronics devices and methods of manufacturing same
JPS60136294A (en) Ceramic multilayer wiring circuit board
US7018494B2 (en) Method of producing a composite sheet and method of producing a laminate by using the composite sheet
US5458709A (en) Process for manufacturing multi-layer glass ceramic substrate
KR20010043936A (en) Conductive paste, Ceramic multilayer substrate, and Method for manufacturing ceramic multilayer substrate
CA2050095A1 (en) Dielectric composition containing cordierite and glass
JP3537620B2 (en) Multilayer wiring board
JPS59111345A (en) Low-permittivity circuit substrate
JPH04286149A (en) Manufacture of low permittivity hybrid multilayer ceramic wiring board
JPH02116196A (en) Ceramic multilayer circuit board and its manufacture
KR940002032B1 (en) Method for preparing green sheets
JPH08274470A (en) Multilayer interconnection board
JP4012601B2 (en) Copper metallized composition and glass-ceramic wiring board using the same
JPH03272197A (en) Manufacture of multilayer glass ceramic circuit
KR0173234B1 (en) Manufacturing method of multi-layer ceramic circuit board
KR0173233B1 (en) Manufacturing method of low dielectric rate multi-ceramic circuit board
JP3047985B2 (en) Manufacturing method of multilayer ceramic wiring board
JPH06120633A (en) Ceramic wiring board
JPS61278194A (en) Ceramic insulation substrate
JPS63202994A (en) Manufacture of multilayer ceramic circuit board
JP3232002B2 (en) Wiring board
JPS63122195A (en) Conductor paste for mullite system ceramic multilayer interconnection board
JPH0878847A (en) Low temperature baking multilayered circuit board