JPS5911002A - Waveguide-microstrip line converter - Google Patents
Waveguide-microstrip line converterInfo
- Publication number
- JPS5911002A JPS5911002A JP12004982A JP12004982A JPS5911002A JP S5911002 A JPS5911002 A JP S5911002A JP 12004982 A JP12004982 A JP 12004982A JP 12004982 A JP12004982 A JP 12004982A JP S5911002 A JPS5911002 A JP S5911002A
- Authority
- JP
- Japan
- Prior art keywords
- conductor
- waveguide
- probe
- insulator
- globe
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P5/00—Coupling devices of the waveguide type
- H01P5/08—Coupling devices of the waveguide type for linking dissimilar lines or devices
- H01P5/10—Coupling devices of the waveguide type for linking dissimilar lines or devices for coupling balanced with unbalanced lines or devices
- H01P5/107—Hollow-waveguide/strip-line transitions
Abstract
Description
【発明の詳細な説明】
本発明針11、導波管−マイクロスL ’) ノブ線路
変換器に関し1、特にm産時における性能均一な構造の
導波省−マイクロストリノブ線路変換器を提供しようと
するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a knob line converter (11, waveguide-micros L'); 1. Provides a waveguide-saving microstri-knob line converter having a structure with uniform performance, especially during production. This is what I am trying to do.
従莱この種の導波管−マイクロストリップ線路変換器の
構造を第1図及びその断面図を第2図に7i′、、−V
oこれは導波管1の短絡面2より電気長がλ、/4附近
のfi/置すなわちS−λ、/4の6シ置にプローブ導
体棒3と誘電体制オ′・lよりなるグローブ絶縁体を導
波管1の伝搬電磁波の電界方向に挿入し、導体接続部9
− aで半田接続さt7たインピーダンス整合板5を介
して導体接続部9−bで、前記プ「J−ブ導体棒3とマ
イクロストす・7ブ導体6とが半1.f1接続される。The structure of this type of waveguide-to-microstrip line converter is shown in Figure 1, and its cross-sectional view is shown in Figure 2 at 7i', -V.
o This is a globe consisting of a probe conductor rod 3 and a dielectric body O'·l at a fi/position near the short-circuit surface 2 of the waveguide 1 with an electrical length of λ, /4, that is, S−λ, /4. An insulator is inserted in the direction of the electric field of the propagating electromagnetic wave in the waveguide 1, and the conductor connection part 9
- The aforementioned PJ-b conductor bar 3 and the MicroSt.7-b conductor 6 are semi-1.f1 connected at the conductor connection portion 9-b via the impedance matching plate 5 which was soldered at t7 a. .
マイクロストリップ線路d1、マイクロストリップ導体
6と誘電体板子及び接地導体8より構成さね、接地導体
8が導波管側壁に合さった位置にある。The microstrip line d1 is composed of a microstrip conductor 6, a dielectric plate, and a ground conductor 8, and the ground conductor 8 is located at a position where it meets the side wall of the waveguide.
インピーダンス整合板5は、グローブ導体棒3とマイク
ロストリップ導体6のインピーダンス整合をなしうる役
割を持っており、その寸法a及びbは、マイクロストリ
ップ線路のインピーダンス、グローブ導体棒3の導波管
挿入長り及び短絡面2上りの車前S1グローブ導体3の
的径、グローブ絶縁体の1誘電イ′、によ−・て異なり
、実験的に決めら11るものである。The impedance matching plate 5 has the role of performing impedance matching between the globe conductor bar 3 and the microstrip conductor 6, and its dimensions a and b correspond to the impedance of the microstrip line and the waveguide insertion length of the globe conductor bar 3. It varies depending on the target diameter of the S1 globe conductor 3 in front of the vehicle above the short-circuit surface 2 and the dielectric strength of the globe insulator, and is determined experimentally.
ところで導波管−マイクロストリノブ変換器の電気的4
/1能の良さQ」1、VSWRで表わされる。すなわち
VSWRが広い周波数帯域で1に近いことか良い。第3
図及び第4図は、12GHz帯の導波ゞ1テrを使用し
7誘電体板かデフロノ基板よりなる特1′1インピーダ
ンス50Qなるマイクロストリップ線路との変換特性例
である。第3図は寸法S = 6111111a=4m
m、bで3mmでグローブ導体棒3の挿入長りをパラメ
ータに特1/1゛例を示しだものである。又、第4図(
G1、S := 6 mm 、 L == 4 mm
、 b = 3 mmでインピーダンス整合板5の長さ
aをパラメータとしだものである。By the way, the electric waveguide-microstrinob converter 4
/1 Performance Q'1, expressed as VSWR. In other words, it is good that the VSWR is close to 1 over a wide frequency band. Third
The figure and FIG. 4 are examples of conversion characteristics between a microstrip line of 1'1 impedance 50Q and made of 7 dielectric plates or a defrono board using a 12 GHz band waveguide. Figure 3 shows the dimensions S = 6111111a = 4m
A special 1/1 example is shown with m and b being 3 mm and the insertion length of the globe conductor rod 3 as a parameter. Also, Figure 4 (
G1, S:=6 mm, L==4 mm
, b = 3 mm, and the length a of the impedance matching plate 5 is used as a parameter.
前記特+1例より導波管−マイクロストリップ線路変換
器のVSWRi性は構成する部品の寸法に火きく左右さ
れることがわかる7、11 GHz〜12GHz の
帯域でVSWRが1.2以下の特性を要求さ11る場合
、少なくともプローブ導体挿入長し及びインピーダンス
整合板の長さa(17,l、1 ramより十分小さな
マ]法精度を必要とする。tだインピーダンス整合板6
の幅b1プローブ絶縁体の=J法及び誘電率ε等の変f
ヒも同様にVSWR%性に大きく影響し同様のχJ法精
度と均一性が要求されることが前記特性例より推定さね
、実際影響が大きい。From the example above, it can be seen that the VSWRi properties of a waveguide-microstrip line converter are greatly influenced by the dimensions of the constituent parts. If required, at least the insertion length of the probe conductor and the length of the impedance matching plate a (17, l, sufficiently smaller than 1 ram) method accuracy is required.
Width b1 Probe insulator = J method and variation f of dielectric constant ε, etc.
It can be inferred from the above characteristic examples that the χJ method similarly has a large effect on the VSWR % and requires the same accuracy and uniformity of the χJ method, and in fact has a large effect.
ところが、従来例による構造でd5、構成する各部品の
χ]法精度か良くても、導体接続部9−aにおいて、組
み立てに分布を生ずる。すなわち、グローブ挿入長しの
不均一、導体接続部9−aの半)11 盛す上すにより
影響、半田イ・]け時の熱によるグローブ絶縁体の熱変
形のため半田イ・1け近傍の分布容量の変化の影響があ
り、インピーダンス整合板の・J去を変化させた時と同
様の効果を生じ、、VSWR特性の再現性を悪くする欠
点を有していた。″!、/コグローブ絶縁体は加工性の
良いことから、ポリエチレン、ポリスチロール等の熱に
弱い性質のものを使用している。However, in the structure according to the conventional example, even if the accuracy of the [chi] method of each constituent component is good, there will be a distribution in assembly at the conductor connection portion 9-a. In other words, the length of the glove insertion is uneven, the conductor connection part 9-a is affected by the overlaying of the conductor connection part 9-a, and the area near the solder A-1 is affected by the thermal deformation of the glove insulator due to the heat during soldering. This has the effect of changing the distributed capacitance of the impedance matching plate, resulting in the same effect as when changing the . ``!, / Coglobe insulators are made of heat-resistant materials such as polyethylene and polystyrene because they have good processability.
本発明では、前記欠点をなくし、VSWR特性の再現性
すなわち量産性を有する構造の導波管−マイクロストリ
ップ線変換器を提供し」:つとするものであり、以「本
発明の実施例について説明する。第1〜第2図と同一物
に1、同一番号を旧し、て説明を省略する。The present invention aims to eliminate the above-mentioned drawbacks and provide a waveguide-to-microstrip line converter having a structure that has reproducibility of VSWR characteristics, that is, mass production. 1 and 2 are the same as those in FIGS. 1 and 2, and the same numbers are used to omit the explanation.
本発明に二よる導波管−マイクロストリップ変換?■1
1、インピータンス整合板6とグローブ導体棒3か導体
4Jlより作らJlだ一体化さノ′1だグローブ整合素
子11を使用することにより、崖Fl」接続部を少なく
シ、絹\ン、て寸法並びに電気的再現1<1を良くした
構造を有するものである3、
第5図U;1、本考案の一実施例である。第1図で示し
/こインピーダンス整合板及びブ「1−フ導体棒乾4、
グローブ整合素子11に置き代えられており、中空の誘
電体よりなるプローブ絶縁体d、導波管壁に固定さねて
いる。Waveguide-microstrip conversion according to the present invention? ■1
1.By using the impedance matching plate 6 and the globe matching element 11, which is made from the globe conductor rod 3 or the conductor 4, it is possible to reduce the number of connection parts. It has a structure with improved dimensions and electrical reproduction 1<1. 3. Figure 5 U; 1 is an embodiment of the present invention. As shown in Figure 1, the impedance matching plate and block 1-F conductor rod 4,
It is replaced by a globe matching element 11, and a probe insulator d made of a hollow dielectric is fixed to the waveguide wall.
プローブ整合素子11は第6図a、bに示す如く、打ち
抜き、又はエツチング加にと簡単な折曲げ加工により寸
法精度良く作らiLる。グローブ絶縁体12は、グロー
ブ整合素子11の導波管挿入部13を固定するもので中
心部が円又は角の案内穴を有する中空の誘電体である。As shown in FIGS. 6a and 6b, the probe matching element 11 is manufactured with high dimensional accuracy by punching, etching, and simple bending. The globe insulator 12 fixes the waveguide insertion part 13 of the globe matching element 11, and is a hollow dielectric body having a circular or square guide hole in the center.
本発明の実施例の組み立て作業においては、グローブ導
体棒の半田接続作業を解消しているので・1゛法及び電
気的再現性が非常に高く用、産性に向いだ構造を有して
いる。In the assembly work of the embodiment of the present invention, since the soldering work of the globe conductor rod is eliminated, the 1' method and electrical reproducibility are very high, and the structure is suitable for use and productivity. .
第7図1.同実施例による導波管スI・リップ線路変換
器のVSWF(特性を示すものてあり、11.3GHz
〜12.6GHzでVSWRl。25以下という良い性
能を得ている。Figure 71. VSWF (characteristics shown) of the waveguide slip I/rip line converter according to the same example, 11.3 GHz
VSWRl at ~12.6GHz. A good performance of 25 or less has been obtained.
第8図は、グローブ整合素子11をつげ利きグローブ導
体棒14とインピータンス整合板5を接Ul−さしめで
ならしめた第2の実施例である。FIG. 8 shows a second embodiment in which the globe matching element 11 is connected to the curved globe conductor rod 14 and the impedance matching plate 5 by connecting them with each other.
プローブ絶縁体4の熱変形をさけるだめ、あらかじめ、
つけ伺きプローブ導体とインピーダンス整合板を接続し
ておくことにより所期の目的を達成できるものであるが
、マイクロストリップ線路と逆方向にインピーダンス整
合板が延長さ′11るので、つげ付きプローブ導体棒1
4は第1の実施例より長くする必要がある。In order to avoid thermal deformation of the probe insulator 4,
The desired purpose can be achieved by connecting the probe conductor with an impedance matching plate, but since the impedance matching plate extends in the opposite direction to the microstrip line, it is difficult to connect the probe conductor with barbs. stick 1
4 needs to be longer than the first embodiment.
以」二のように本発明に7よる導波管−マイクロストリ
ップ変換器は不完による1ト1能の劣下がなく安価に提
供することができるものである。As described above, the waveguide-to-microstrip converter according to the present invention has no deterioration in performance due to imperfections and can be provided at low cost.
第1図シー1.従来例における導波賀−マイクロストす
、ブ線路変換器の11視図、第2図はその断面図、第3
図及び第4図i+−回変換器の特性図、第6図は本発明
の一実施例における導波管−マイクロストリノブ線路変
換器のiすi面図、第6図&−、1、同変換器のプロー
ブ整合素r説明のだめの斜視図、第7図は本発明に31
、る実加ツ例の特1/1図、第8図は同(1μの実M1
例のグローブ整合素子の胴視図である。
1 導波管、4 ・・ブロー7絶li付、5・−・イ
ンピーダンス!1合合4反、6− マイクロスj−IJ
、。
導体、11・ グローブ整合素子、°3・−・4波管
挿入部、14・ つばイ・1きブローフ導体棒、9・
導体接続部。
代理人の氏名 弁理士 中 尾 敏 男 ほか1名第1
図
第2図
第3図
項)Δ喚【A≧ξ (6〃l)
第4図
第5図
を
第6図Figure 1 Sea 1. 11 is a perspective view of a conventional waveguide-to-microwave line converter, FIG. 2 is a cross-sectional view thereof, and FIG.
Fig. 4 is a characteristic diagram of the i+- time converter, Fig. 6 is an i-plane view of the waveguide-microstrinob line converter in an embodiment of the present invention, Fig. 6 &-, 1, A perspective view of the probe matching element r of the same converter for explanation, FIG.
, Figure 1/1 of the actual example, and Figure 8 are the same (actual M1 of 1μ
FIG. 3 is a torso view of an example globe matching element. 1 Waveguide, 4... With blow 7-li, 5... Impedance! 1 go 4 anti, 6- Micros j-IJ
,. Conductor, 11・Globe matching element, °3・-・4 wave tube insertion part, 14・Tsubai・1 brochure conductor rod, 9・
Conductor connection. Name of agent: Patent attorney Toshio Nakao and 1 other person No. 1
Figure 2, Figure 3)
Claims (2)
ピーダンス整合板とプローブ導体棒とが一体化されたブ
r]−ブ整合素了と、グローブ絶縁体を挿入し、前記導
波管側部に設けられた前記プローブ絶縁体を挿入ぜし7
める穴を治するマイクロストリップ線路のマイクロスト
リップ導体に、前;j[1フロ−ブ整合素子を接続ぜし
めてなる導波管−マー丁りロストリップ線路変換器。(1) Insert a globe insulator and a globe insulator in which an impedance matching plate and a probe conductor rod are integrated into a waveguide wired in the transmission direction. Insert the probe insulator provided on the side of the waveguide 7
A waveguide-to-mark loss strip line converter comprising a microstrip conductor of a microstrip line to which a hole is to be fixed, and a loop matching element connected to the microstrip conductor.
整合板を接合せしめてなるブローフ整合素子を有する特
i′1請求範囲第1項記載の導波管−マイクロス]・リ
ップ線路変換器。(2) The waveguide-to-micros lip line converter according to claim 1, which has a brochure matching element formed by joining a globe conductor rod having a flange portion and an impedance matching plate.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12004982A JPS5911002A (en) | 1982-07-09 | 1982-07-09 | Waveguide-microstrip line converter |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12004982A JPS5911002A (en) | 1982-07-09 | 1982-07-09 | Waveguide-microstrip line converter |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5911002A true JPS5911002A (en) | 1984-01-20 |
JPS642281B2 JPS642281B2 (en) | 1989-01-17 |
Family
ID=14776622
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12004982A Granted JPS5911002A (en) | 1982-07-09 | 1982-07-09 | Waveguide-microstrip line converter |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5911002A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60170301A (en) * | 1984-02-15 | 1985-09-03 | Matsushita Electric Ind Co Ltd | Waveguide-strip line converting device |
JPH01236705A (en) * | 1988-03-16 | 1989-09-21 | Fujitsu Ltd | Frequency multiplier |
WO2001020273A1 (en) * | 1999-09-15 | 2001-03-22 | Endress + Hauser Gmbh + Co. Kg | Device for determining the fill level of a filling substance in a container |
JP2006238197A (en) * | 2005-02-25 | 2006-09-07 | Sharp Corp | Antenna probe, low noise converter provided with antenna probe and connection method of antenna probe |
CN105680133A (en) * | 2016-01-11 | 2016-06-15 | 中国电子科技集团公司第十研究所 | Inter-board perpendicular interconnection circuit structure for substrate integrated ridge waveguide |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7438071B2 (en) | 2020-09-15 | 2024-02-26 | 株式会社東芝 | semiconductor equipment |
-
1982
- 1982-07-09 JP JP12004982A patent/JPS5911002A/en active Granted
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60170301A (en) * | 1984-02-15 | 1985-09-03 | Matsushita Electric Ind Co Ltd | Waveguide-strip line converting device |
JPH0459801B2 (en) * | 1984-02-15 | 1992-09-24 | Matsushita Electric Ind Co Ltd | |
JPH01236705A (en) * | 1988-03-16 | 1989-09-21 | Fujitsu Ltd | Frequency multiplier |
WO2001020273A1 (en) * | 1999-09-15 | 2001-03-22 | Endress + Hauser Gmbh + Co. Kg | Device for determining the fill level of a filling substance in a container |
JP2006238197A (en) * | 2005-02-25 | 2006-09-07 | Sharp Corp | Antenna probe, low noise converter provided with antenna probe and connection method of antenna probe |
CN105680133A (en) * | 2016-01-11 | 2016-06-15 | 中国电子科技集团公司第十研究所 | Inter-board perpendicular interconnection circuit structure for substrate integrated ridge waveguide |
CN105680133B (en) * | 2016-01-11 | 2018-08-10 | 中国电子科技集团公司第十研究所 | Vertical interconnection circuit structure between substrate integrated ridge waveguide plate |
Also Published As
Publication number | Publication date |
---|---|
JPS642281B2 (en) | 1989-01-17 |
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