JPS5897856U - Lens adapter for light emitting diode lamp - Google Patents

Lens adapter for light emitting diode lamp

Info

Publication number
JPS5897856U
JPS5897856U JP19587981U JP19587981U JPS5897856U JP S5897856 U JPS5897856 U JP S5897856U JP 19587981 U JP19587981 U JP 19587981U JP 19587981 U JP19587981 U JP 19587981U JP S5897856 U JPS5897856 U JP S5897856U
Authority
JP
Japan
Prior art keywords
light emitting
emitting diode
diode lamp
lens adapter
lamp
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP19587981U
Other languages
Japanese (ja)
Inventor
藤田　貞三
Original Assignee
和泉電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 和泉電気株式会社 filed Critical 和泉電気株式会社
Priority to JP19587981U priority Critical patent/JPS5897856U/en
Publication of JPS5897856U publication Critical patent/JPS5897856U/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図はこの考案の実施例を示す要部を縦断した拡大側
面図、第２図は表示パネルの正面図である。 １・・・発光ダイオード、２・・・抵抗、３・・・照光
レンズ、４・・・口金、７・・・レンズアダプタ、７ａ
・・・凹凸部、７ｂ・・・凹窪部、７Ｃ・・・取付脚、
８・・・表示パネル。FIG. 1 is an enlarged vertically sectional side view of the main part showing an embodiment of this invention, and FIG. 2 is a front view of the display panel. DESCRIPTION OF SYMBOLS 1... Light emitting diode, 2... Resistor, 3... Illumination lens, 4... Base, 7... Lens adapter, 7a
... Uneven part, 7b... Concave part, 7C... Mounting leg,
8...Display panel.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 外表面に光拡散用凹凸部を設けるとともに内面中央部に
発光ダイオードランプの照光レンズ面を内嵌させる凹窪
部を穿設し、周側から前記ランプ外周と着脱自由な複数
個の取付脚を延設して構成したことを特徴とする発光ダ
イオードランプ用レンズアダプタ。An uneven part for light diffusion is provided on the outer surface, and a recessed part is bored in the center of the inner surface into which the illuminating lens surface of the light emitting diode lamp is fitted, and a plurality of mounting legs that can be freely attached to and detached from the outer periphery of the lamp are provided from the circumferential side. A lens adapter for a light emitting diode lamp, characterized in that it has an extended configuration.
JP19587981U 1981-12-24 1981-12-24 Lens adapter for light emitting diode lamp Pending JPS5897856U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19587981U JPS5897856U (en) 1981-12-24 1981-12-24 Lens adapter for light emitting diode lamp

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19587981U JPS5897856U (en) 1981-12-24 1981-12-24 Lens adapter for light emitting diode lamp

Publications (1)

Publication Number Publication Date
JPS5897856U true JPS5897856U (en) 1983-07-02

Family

ID=30109137

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19587981U Pending JPS5897856U (en) 1981-12-24 1981-12-24 Lens adapter for light emitting diode lamp

Country Status (1)

Country Link
JP (1) JPS5897856U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010161420A (en) * 1998-03-27 2010-07-22 Yoshio Takada Light emitter
JP2010193824A (en) * 2009-02-26 2010-09-09 Fine Rubber Kenkyusho:Kk Light source for plant cultivation

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5275285A (en) * 1975-12-08 1977-06-24 Savage John Jun Light emitting diode assembly

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5275285A (en) * 1975-12-08 1977-06-24 Savage John Jun Light emitting diode assembly

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010161420A (en) * 1998-03-27 2010-07-22 Yoshio Takada Light emitter
JP2010193824A (en) * 2009-02-26 2010-09-09 Fine Rubber Kenkyusho:Kk Light source for plant cultivation

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