JPS589210A - Thin-film coil device - Google Patents

Abstract

PURPOSE:To obtain a small-sized, easily-manufactured and thin-film coil device by insulating adjacent thin-film coils from each other, and making them overlap with each other at multiple-winding dormation parts. CONSTITUTION:A coil 3 has plural lead parts 7 formed on a substrate 1 as one coil terminal. On them, couples of conductor thin-film C and I-shaped patterns 41 are formed in such a way that parts (e) and (f) overlap with each other. On the patterns, G-shaped insulating layer patterns 51 are adhered so that only the parts (g) of the C-shaped patterns and the parts (f) of the I-shaped patterns are exposed. Then, couples of conductor thin-film I and C-shaped patterns 42 are formed so that parts (h) of the I-shaped patterns are connected to the parts (g) of the C-shaped patterns and the parts (i) of the C-shaped patterns are connected to the parts (f) of the I-shaped patterns. On them, insulating layer patterns 52 are formed in such a way that the parts (j) of the I-shaped patterns and the parts (k) of the C-shaped patterns are exposed. Those operations are repeated to obtain a small-sized, easily-manufactured coil device.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a thin 11i=sil device, in particular - magnetic,
This is effective when applied to the head section.

In the field of magnetic recording, thin film heads have been attracting attention in recent years.

This thin film process is used to form multiple layers of nine thin films; it is also possible to form magnetic patterns with thin film processes. A large number of fine thin film heads can be created on top of the thin film head.The thin film coils that make up the thin film head are extremely thin (
Because it is self-forming, the inductance can be reduced and high speed O
It is possible to operate. Furthermore, since high-density OgA packaging is possible, it can also be useful for increasing recording density.

This was conceived as a way to further extend the advantages of this high-density arrangement of thin-film coils.In order to obtain high track density, it is necessary to arrange multiple thin-film heads on a substrate as shown in Figures 1 to 3. It is necessary to obtain the head IIaI! by installing the head. 1116 break i1m-Jl' is the danshuen 0
11, [is a certainty 1 叡 1 consisting of a ferrite cape,
□ II Hanki 1 [Multiple round thin film heads are arranged in parallel on h, 3
Co., Ltd. thin film coil, 4 is 7 layers of conductive thin film pattern made of Cu etc., S is 8i0 or d810. 6 is a lead portion, γ is a magnetic pattern made of Palmer (Ni--Fe alloy), etc., and 8 is a magnetic gap.

In the past, each thin 1iwile 3 was spaced at a constant interval b (second
(Fig.) is formed on a substrate 1 by means such as vapor deposition, and specifically, it is a multilayer film in which a conductor thin film pattern layer 4 and an insulating layer 5 are sequentially laminated, and the butter 7 layers 4 of each layer are partially connected. Consists of a wound coil. By applying current to the lead portion 6, a fill magnetic field perpendicular to the substrate 1 is generated, and the magnetic flux due to the mosquito coil magnetic field forms a magnetic loop that goes around the magnetic pattern 7 - magnetic gap 8 - substrate 1. Then, information is magnetically recorded on a magnetic recording medium such as a magnetic tape that moves along a magnetic gap 8 shown by an arrow C.

However, in the past, adjacent thin film coils 3 were arranged side by side with a certain distance between them, but this had the disadvantage that it could not cope with the high track writing speed of magnetic recording media.The present invention aims to solve this conventional disadvantage. The purpose of this is to use a thin film coil device K having a structure in which a plurality of thin film coils in which conductive thin film pattern layers are formed in multiple layers with an insulating layer interposed therebetween are arranged in parallel on a substrate.
4. Adjacent said thin coils are formed so as to maintain insulation from each other and to overlap at the multi-turn forming portion.
An embodiment of the present invention which can be achieved by a thin film-filtering apparatus using I mold will now be described in detail with reference to FIGS. 4 and 6.

FIG. 4 is a partial view of a thin film magnetic head substrate according to the present invention.
2) is a plan view, and (b) is a sectional view taken along the breaking line d--d' in FIG. 6. It should be noted that the same parts as those mentioned above are indicated by the same reference numerals regarding the armpits.

As is clear from the figure, in this substrate, each thin-film coil 3 is formed with a multi-turn forming portion 9 (A) of the adjacent coil 3 while keeping the diagonal portion of the figure (A) insulated from each other and overlapping each other. The conventional spacing is eliminated.

FIGS. 5-4 to [F] are plan views showing the process of forming the thin film coil 3. 〇 Coil 3 Companies First, as shown in the cabinet, a plurality of lead portions, which are one fill terminal, are formed on the substrate 4. Next, a plurality of sets of conductor thin film patterns 41 each consisting of a C-shaped pattern and an L-shaped pattern shown in FIG. Next, on top of that, an approximately G-shaped insulating layer pattern s1 as shown in Fig.
Then, it is deposited so that only the f portion of the I-shaped pattern is exposed. Next, the conductive thin film pattern 42 consisting of the I-shaped pattern and C-shaped pattern shown in Figure 0 is placed in the I-shaped pattern (the h part of the turn is in the 8th part of the C-shaped pattern in Figure (B), and the C-shaped pattern is (b) The approximately G-shaped insulating layer pattern 52 shown in Fig. A part of the C-shaped pattern is exposed and only a part of the C-shaped pattern is exposed.By forming the pattern shown in FIGS. After performing this process several times to form a multi-turn coil, the lead part γ, which is the other terminal in the figure (G), is placed on the insulating layer pattern 52 shown in the figure. Form the pattern so that the part K1 is connected.

As a result, it is possible to form a thin film coil 3 according to the present invention in which nine adjacent multi-turn formation sections of =I/l/8 have insulation from each other and overlap each other as shown in FIG. Magnetic pattern 7
A plurality of thin film layers are arranged in parallel on the substrate to obtain a nine thin film magnetic head substrate.

According to the above-mentioned actual results, it is possible to form a thin film coil device that is small and easy to manufacture, and the practical effect is increased by %O.

[Brief explanation of the drawing]

FIGS. 1 to 3 are perspective views and cross-section views showing conventional solid-state thin film magnetic herad group I[O structures. Figure 4 (2) @Hiro Thin film magnetic head according to the present invention! 1,000*m and cross-sectional view showing I
ToA is a plan view showing the process of forming a thin film coil in the figure.
・[Code O1! Ming〕

Claims (2)

[Claims] (1) A structure in which a plurality of thin film coils in which conductive thin film pattern layers are formed in multiple layers with an insulating layer interposed therebetween are arranged in parallel on a substrate.
In the thin W4:I coil device, it is assumed that the thin film coils are formed adjacent to each other while maintaining insulation from each other and overlapping each other in the multi-turn forming portion.
ile device. (2) The substrate is made of a magnetic material, and a magnetic material pattern is formed on the substrate so as to straddle the multi-turn forming portion of the thin film coil, and the outer end of the magnetic material pattern and the substrate are bonded to each other. 2. The thin film coil device according to claim 1, wherein the thin film head substrate is constructed by forming a magnetic gear.