JPS5891666A - 半導体素子の冷却方法 - Google Patents

半導体素子の冷却方法

Info

Publication number
JPS5891666A
JPS5891666A JP56190225A JP19022581A JPS5891666A JP S5891666 A JPS5891666 A JP S5891666A JP 56190225 A JP56190225 A JP 56190225A JP 19022581 A JP19022581 A JP 19022581A JP S5891666 A JPS5891666 A JP S5891666A
Authority
JP
Japan
Prior art keywords
gas
pressure
liquid
phase flow
cooling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56190225A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6137792B2 (cs
Inventor
Yasuhide Takahashi
高橋　康英
Nobuyoshi Takahashi
信義 高橋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP56190225A priority Critical patent/JPS5891666A/ja
Publication of JPS5891666A publication Critical patent/JPS5891666A/ja
Publication of JPS6137792B2 publication Critical patent/JPS6137792B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP56190225A 1981-11-26 1981-11-26 半導体素子の冷却方法 Granted JPS5891666A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56190225A JPS5891666A (ja) 1981-11-26 1981-11-26 半導体素子の冷却方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56190225A JPS5891666A (ja) 1981-11-26 1981-11-26 半導体素子の冷却方法

Publications (2)

Publication Number Publication Date
JPS5891666A true JPS5891666A (ja) 1983-05-31
JPS6137792B2 JPS6137792B2 (cs) 1986-08-26

Family

ID=16254559

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56190225A Granted JPS5891666A (ja) 1981-11-26 1981-11-26 半導体素子の冷却方法

Country Status (1)

Country Link
JP (1) JPS5891666A (cs)

Also Published As

Publication number Publication date
JPS6137792B2 (cs) 1986-08-26

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