JPS589158B2 - Electroplating liquid used to form a Zn-Ti alloy plating film on steel surfaces - Google Patents

Electroplating liquid used to form a Zn-Ti alloy plating film on steel surfaces

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Publication number
JPS589158B2
JPS589158B2 JP13596780A JP13596780A JPS589158B2 JP S589158 B2 JPS589158 B2 JP S589158B2 JP 13596780 A JP13596780 A JP 13596780A JP 13596780 A JP13596780 A JP 13596780A JP S589158 B2 JPS589158 B2 JP S589158B2
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JP
Japan
Prior art keywords
plating film
plating
solution
content
alloy plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP13596780A
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Japanese (ja)
Other versions
JPS5760089A (en
Inventor
大島正則
長堀貞治
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Individual
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Individual
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Application filed by Individual filed Critical Individual
Priority to JP13596780A priority Critical patent/JPS589158B2/en
Publication of JPS5760089A publication Critical patent/JPS5760089A/en
Publication of JPS589158B2 publication Critical patent/JPS589158B2/en
Expired legal-status Critical Current

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Description

【発明の詳細な説明】 この発明は、鉄鋼表面に、15重量%までのTiの含有
が可能なZn−Ti合金メッキ皮膜を形成するのに用い
られる電気メッキ液に関するものである。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an electroplating solution used to form a Zn-Ti alloy plating film that can contain up to 15% by weight of Ti on the surface of steel.

一般に、鉄鋼表面にZn皮膜を電気メッキ法により形成
するに際しては、硫酸亜鉛を含有する電気メッキ液が使
用されることはよく知られるところである。
Generally, it is well known that an electroplating solution containing zinc sulfate is used to form a Zn film on the surface of steel by electroplating.

また、電気Znメツキ皮膜の結晶粒を微細化すると共に
、これに光沢性を付与し、さらにその電着性を改善する
目的で、上記電気Znメッキ液にグルコン酸チタニウム
を添加含有させた電気メッキ液も提案されており、しか
もこの電気Znメッキ液を使用した場合、Znメツキ皮
膜中にはTiを含有するようになることから、このメッ
キ皮膜は比較的良好な耐食性を示すものであった。
In addition, in order to refine the crystal grains of the electrolytic Zn plating film, add gloss to it, and further improve its electrodepositivity, electroplating was performed in which titanium gluconate was added to the electrolytic Zn plating solution. A solution has also been proposed, and when this electrolytic Zn plating solution is used, the Zn plating film contains Ti, so this plating film exhibits relatively good corrosion resistance.

しかし、上記Tiを含有する電気Znメツキ皮膜におけ
るTi含有量は、最高でも高々1.2重量%程度である
ため、苛酷な腐食環境下では十分満足する耐食性を示さ
ないものである。
However, since the Ti content in the Ti-containing electrolytic Zn plating film is about 1.2% by weight at most, it does not exhibit sufficiently satisfactory corrosion resistance in a severe corrosive environment.

そこで、本発明者等は、上述のような観点から、鉄鋼表
面に電気メッキされるZn−Ti合金メッキ皮膜中のT
i含有量を飛躍的に高くし、もってどのような苛酷な腐
食環境下におかれても著しくすぐれた耐食性を示すZn
−Ti合金メッキ皮膜を形成すべく研究を行なった結果
、硫酸亜鉛を含有する酸性電気Znメツキ液中に、硫酸
アンモンと、硫酸チタンおよびカルボン酸基を有する低
級有機酸とを含有させ、さらにメッキ液安定化成分とし
て弗化アンモン、ケイ弗化アンモン、過硫酸アンモン、
および過酸化水素水のうちの1種または2種以上を含有
させると、この結果のメッキ液は、主要成分が硫酸塩で
構成されているために、酸性にして、きわめて小さい電
気抵抗をもつようになり、また、このメッキ液によれば
、鉄鋼表面への電気メッキを高い電流密度で、長時間操
業を行なっても前記メッキ液安定化成分の働きでメッキ
液中にTi化合物の析出がなく、きわめて安定した状態
でメッキを行なうことができると共に、鉄鋼表面に形成
されるZn−Ti合金メッキ皮膜中には、Tiを、その
含有量を自由に調節可能なな状態で、最高15重量%ま
で含有させることが可能であり、しかもこのZn−Ti
合金メッキ皮膜は、Ti含有量がきわめて高いために飛
躍的にすぐれた耐食性を示すと共に、上記低級有機酸の
作用で結晶微細にして光沢のあるものとなるという知見
を得たのである。
Therefore, from the above-mentioned point of view, the present inventors investigated the T content in the Zn-Ti alloy plating film electroplated on the steel surface.
Zn has a dramatically high i content and exhibits outstanding corrosion resistance no matter how harsh the corrosive environment is.
-As a result of research to form a Ti alloy plating film, it was found that ammonium sulfate, titanium sulfate, and a lower organic acid having a carboxylic acid group were added to an acidic electrolytic Zn plating solution containing zinc sulfate, and further plating was performed. Ammonium fluoride, ammonium silicofluoride, ammonium persulfate, as liquid stabilizing components.
When one or more of hydrogen peroxide and aqueous hydrogen peroxide are included, the resulting plating solution becomes acidic and has extremely low electrical resistance, since the main component is sulfate. Furthermore, according to this plating solution, even if electroplating on steel surfaces is performed at high current density and for long periods of time, there will be no precipitation of Ti compounds in the plating solution due to the action of the plating solution stabilizing components. , plating can be performed in an extremely stable state, and the Zn-Ti alloy plating film formed on the steel surface contains Ti at a maximum of 15% by weight, with the content freely adjustable. Zn-Ti can be contained up to
It was discovered that the alloy plating film exhibits dramatically superior corrosion resistance due to its extremely high Ti content, and also that the action of the lower organic acid makes the crystals fine and glossy.

したがって、この発明は、上記知見にもとづいてなされ
たものであって、硫酸亜鉛:80〜400g/l,硫酸
アンモン:20〜120g/l,硫酸チタン=5〜80
g/l、カルボン酸基を有する低級有機酸:2〜160
g/l,弗化アンモン,ケイ弗化アンモン、過硫酸アン
モン、および過酸化水素水のうちの1種または2種以上
のメッキ液安定化成分:1〜20g/lからなる組成を
有する電気メッキ液中で、高電流密度で長時間操業可能
な状態で、鉄鋼表面に電気メッキを施すことによって、
最高15重量%のTiを含有した耐食性にすぐれたZn
−Ti合金メッキ皮膜を安定的に形成することに特徴を
有するものである。
Therefore, this invention was made based on the above findings, and includes zinc sulfate: 80 to 400 g/l, ammonium sulfate: 20 to 120 g/l, and titanium sulfate = 5 to 80 g/l.
g/l, lower organic acid with carboxylic acid group: 2-160
Electroplating having a composition of 1 to 20 g/l, plating solution stabilizing component of one or more of ammonium fluoride, ammonium silicate, ammonium persulfate, and hydrogen peroxide solution: 1 to 20 g/l By applying electroplating to the steel surface in a state that can be operated for a long time at high current density in liquid,
Zn with excellent corrosion resistance containing up to 15% by weight of Ti
-It is characterized by the stable formation of a Ti alloy plating film.

つぎに、この発明の電気メッキ液において、硫酸亜鉛、
硫酸アンモン、硫酸チタン、カルボン酸基を有する低級
有機酸、およびメッキ液安定化成分の含有量を上記の通
りに限定した理由を説明する。
Next, in the electroplating solution of this invention, zinc sulfate,
The reason why the contents of ammonium sulfate, titanium sulfate, lower organic acid having a carboxylic acid group, and plating solution stabilizing component were limited to the above values will be explained.

(a)硫酸亜鉛 その含有量が80g/l未満では、鉄鋼表面におけるメ
ッキ皮膜形成速度が遅く、一方400g/lを越えて含
有させてもメッキ液中への完全溶解は困難であり、かえ
ってメッキ性を悪化させる原因ともなることから、その
含有量を80〜400g/lと定めた。
(a) If the content of zinc sulfate is less than 80 g/l, the rate of formation of a plating film on the steel surface is slow; on the other hand, if the zinc sulfate content exceeds 400 g/l, it is difficult to completely dissolve it in the plating solution, and the plating film may deteriorate. Since it may cause deterioration of properties, its content was set at 80 to 400 g/l.

(b)硫酸アンモン 硫酸アンモンは、メッキ作業中におけるメッキ液へのT
iイオンの溶解度を仕上げて、メッキ液中のTi濃度を
高い状態に保持すると共に、メッキ液の導電性を高め、
もって高Ti含有のZn−Ti合金メッキ皮膜の迅速な
形成をはかる作用があるが、その含有量が20g/l未
満では前記作用に所望の効果が得られず、一方120g
/lを越えると、メッキ性が阻害されるようになること
から、その含有量を20〜120g/lと定めた。
(b) Ammonium sulfate Ammonium sulfate is a T
Improves the solubility of i-ions, maintains the Ti concentration in the plating solution at a high level, and increases the conductivity of the plating solution.
This has the effect of rapidly forming a Zn-Ti alloy plating film containing high Ti content, but if the content is less than 20 g/l, the desired effect cannot be obtained;
If the content exceeds 20 to 120 g/l, the plating properties will be impaired.

(c)硫酸チタン その含有量が5g/l未満では、Zn−Ti台金メッキ
皮膜中のTi含有量が1.5重量%以下となってしまい
、所望のすぐれた耐食性を確保することが困難であり、
したがってZn−Ti合金メッキ皮膜中に1.5重量%
以上のTiを含有させるためには5g/l以上の含有が
必要であるが、メッキ液中に完全溶解するのは80g/
lまでであり、これを越えて添加してもZn−Ti台金
メッキ皮膜中にTiを15重量%を越えて含有させるこ
とはできず、むしろ未溶解の硫酸チタンがメッキ液中に
存在することによってメッキ性が阻害されるようになる
ことから、その含有量を5〜80g/lと定めた。
(c) Titanium sulfate If the content is less than 5 g/l, the Ti content in the Zn-Ti base metal plating film will be less than 1.5% by weight, making it difficult to secure the desired excellent corrosion resistance. can be,
Therefore, 1.5% by weight in the Zn-Ti alloy plating film
In order to contain more than 5 g/l of Ti, it is necessary to contain more than 5 g/l, but it is only 80 g/l to completely dissolve in the plating solution.
1, and even if more than this is added, it is not possible to make the Zn-Ti base metal plating film contain more than 15% by weight of Ti, rather undissolved titanium sulfate is present in the plating solution. Since the plating properties are inhibited by this, the content was determined to be 5 to 80 g/l.

(d)カルボン酸基を有する低級有機酸 この発明の電気メッキ液は通常PH3〜4で使用される
が、このPH値では硫酸チタンが水酸化物となって析出
し、沈澱するようになり、メッキ性を著し《阻害する。
(d) Lower organic acid having a carboxylic acid group The electroplating solution of the present invention is usually used at a pH of 3 to 4, but at this pH value, titanium sulfate becomes a hydroxide and precipitates. Significantly impairs plating properties.

このため、この発明の電気メッキ液においては、カルボ
ン酸基を有する低級有機酸を含有させて水酸化チタンの
析出を抑制し、もって電気メッキ液の安定化をはかつて
いるが、その含有量が2g/l未満では所望のメッキ液
安定化効果を確保することができず、一方160ダg/
lを越えた含有量になると、メッキ液の電気抵抗が著し
く高くなることから、その含有量を2〜160g/lと
定めた。
Therefore, in the electroplating solution of the present invention, a lower organic acid having a carboxylic acid group is contained to suppress the precipitation of titanium hydroxide, thereby stabilizing the electroplating solution. If it is less than 2 g/l, the desired stabilizing effect of the plating solution cannot be secured;
Since the electrical resistance of the plating solution increases significantly if the content exceeds 1.0 g/l, the content was set at 2 to 160 g/l.

なお、カルボン酸基を有する低級有機酸としては、例え
ば酒石酸、クエン酸、およびグルコン酸などの使用が好
ましい。
In addition, as the lower organic acid having a carboxylic acid group, it is preferable to use, for example, tartaric acid, citric acid, and gluconic acid.

(e)メッキ液安定化成分 上記のように、これらの成分には、いずれも高い電流密
度による長時間メッキ操業に際して、メッキ液中に水酸
化チタンなどのTi化合物が析出するのを防止し、もっ
てZn−Ti合金皮膜中に高いTi@有量な確保するメ
ッキ液安定化の均等的作用があるが、その含有量が1g
/l未満では前記作用に所望の効果が得られず、一方2
0g/lを越えて含有させると、メッキ液中のTiイオ
ンが安定化するようになって、Zn−Ti台金皮膜中に
多量のTiを含有させることが困難になることから、そ
の含有量を1〜20g/lと定めた。
(e) Plating solution stabilizing components As mentioned above, these components all have the ability to prevent Ti compounds such as titanium hydroxide from precipitating in the plating solution during long-term plating operations at high current densities. This has a uniform effect of stabilizing the plating solution by ensuring a high amount of Ti in the Zn-Ti alloy film, but when the content is 1g
/l, the desired effect cannot be obtained;
If the content exceeds 0 g/l, the Ti ions in the plating solution become stabilized, making it difficult to contain a large amount of Ti in the Zn-Ti base metal film. was set at 1 to 20 g/l.

つぎに、この発明の電気メッキ液を実施例により具体的
に説明する。
Next, the electroplating solution of the present invention will be specifically explained with reference to Examples.

まず、被メッキ材として100mm×100mm×0.
24mmの寸法をもった低炭素鋼板を用意し、この鋼板
に脱脂および水洗を施した後、13%塩酸に25秒浸漬
の酸洗を施し、ついで水洗することによって表面清浄な
銅板とした。
First, the material to be plated is 100mm x 100mm x 0.
A low carbon steel plate with a size of 24 mm was prepared, and this steel plate was degreased and washed with water, then pickled by dipping in 13% hydrochloric acid for 25 seconds, and then washed with water to obtain a surface-clean copper plate.

つぎに、このように表面清浄の鋼板を、それぞれ別途用
意した第1表に示されるメッキ液組成をもつと共に、い
ずれもPH:3.4および液温:70℃の酸性電気メッ
キ液中に浸漬し、電流密度:6A/dm2(ただし従来
Znメツキ鋼板は8A/dm2)、メッキ時間:2分の
条件で電気メツキを行ない、前記鋼板の表面に厚さ3μ
mのメッキ皮膜をそれぞれ形成することによって、この
発明の電気メッキ液使用によるZn−Ti合金メッキ鋼
板(以下本発明Zn−Ti合金メッキ鋼板という)1〜
21、および従来の電気メッキ液使用によるZnメッキ
鋼板 (以下従来Znメッキ鋼板という)をそれぞれ製造した
Next, the surface-cleaned steel plates were immersed in an acidic electroplating solution prepared separately, each having a plating solution composition shown in Table 1, and having a pH of 3.4 and a solution temperature of 70°C. Electroplating was performed under the conditions of current density: 6 A/dm2 (conventional Zn-plated steel sheet was 8 A/dm2), plating time: 2 minutes, and the surface of the steel sheet was coated with a thickness of 3 μm.
Zn-Ti alloy plated steel sheets using the electroplating solution of the present invention (hereinafter referred to as the Zn-Ti alloy plated steel sheets of the present invention) are obtained by forming plating films of m respectively.
No. 21, and a Zn-plated steel sheet using a conventional electroplating solution (hereinafter referred to as conventional Zn-plated steel sheet) were manufactured, respectively.

なお、上記本発明Zn−Ti合金メッキ鋼板1〜21の
メッキ皮膜中のTi含有量を第1表に合せて示した ついで、この結果得られた本発明Zn−Ti合金メッキ
鋼板1〜21および従来Znメツキ鋼板について、JI
S−Z2371にもとづく塩水噴霧試験を行ない、鋼板
メッキ面に赤錆が発生するまでの時間を測定した。
The Ti content in the plating film of the Zn-Ti alloy plated steel sheets 1 to 21 of the present invention is shown in Table 1, and the resulting Zn-Ti alloy plated steel sheets 1 to 21 of the present invention and Regarding conventional Zn-plated steel sheets, JI
A salt spray test based on S-Z2371 was conducted to measure the time until red rust appeared on the plated surface of the steel plate.

この測定結果を第1表に示した。The measurement results are shown in Table 1.

第1表に示されるように、従来Znメツキ鋼板において
は、30時間経過後に赤錆発生が見られるのに対して、
本発明Zn−Ti合金メッキ鋼板は、赤錆発生までに最
低120時間を要し、いずれもすぐれた耐食性を示し、
しかもこの耐食性はZn−Ti合金メッキ皮膜中のTi
含有量が多くなればなるほどすぐれたものになっており
、Zn−Ti合金メッキ皮膜中のTi含有量が15重量
係の本発明Zn−Ti合金メッキ鋼板10にいたっては
、約1400時間経過後にようやく赤錆発生が見られる
という、驚異的耐食性をもつことが明らかである 上述のように、この発明の電気メッキ液によれば、Ti
含有量のきわめて高いZn−Ti合金メツキ皮膜を通常
の操業条件は勿論のこと、高い電流密度によっても鉄鋼
表面に長時間操業可能に、かつ安定的に形成することが
でき、この結果得られたZn−Ti合金メッキ製品は、
著しくすぐれた耐食性をもつものであるなど工業上有用
な効果がもたらされるのである。
As shown in Table 1, in the conventional Zn-plated steel sheet, red rust appeared after 30 hours, whereas
The Zn-Ti alloy plated steel sheet of the present invention requires at least 120 hours to develop red rust and exhibits excellent corrosion resistance.
Moreover, this corrosion resistance is due to the Ti in the Zn-Ti alloy plating film.
The higher the content, the better the quality, and in the case of the Zn-Ti alloy plated steel sheet 10 of the present invention in which the Ti content in the Zn-Ti alloy plating film is 15% by weight, after about 1400 hours elapsed. It is clear that the electroplating solution of this invention has amazing corrosion resistance, as red rust is finally observed.
As a result, a Zn-Ti alloy plating film with an extremely high content can be stably formed on the steel surface under normal operating conditions as well as under high current density, allowing for long-term operation. Zn-Ti alloy plated products are
It has industrially useful effects such as extremely high corrosion resistance.

Claims (1)

【特許請求の範囲】 1 鉄鋼表面に、15重量%までのTiを含有したZn
−Ti合金メッキ皮膜を形成するのに用いられる電気メ
ッキ液にして、このメッキ液は、硫酸亜鉛:80〜40
0f/e、 硫酸アンモン=20〜120g/l、 硫酸チタン=5〜80g/l、 カルボン酸基を有する低級有機酸=2〜160g/l、 弗化アンモン、ケイ弗化アンモン、過硫酸アンモン、お
よび過酸化水素水のうちの1種または2種以上のメッキ
液安定化成分:1〜20g/l,からなる組成を有する
ことを特徴とする鉄鋼表面にZn−Ti合金メッキ皮膜
を形成するのに用いられる電気メッキ液。
[Claims] 1 Zn containing up to 15% by weight of Ti on the steel surface
-The electroplating solution used to form the Ti alloy plating film has a zinc sulfate content of 80 to 40%.
0f/e, ammonium sulfate = 20 to 120 g/l, titanium sulfate = 5 to 80 g/l, lower organic acid having a carboxylic acid group = 2 to 160 g/l, ammonium fluoride, ammonium silicofluoride, ammonium persulfate, A method for forming a Zn-Ti alloy plating film on a steel surface characterized by having a composition consisting of one or more plating solution stabilizing components of hydrogen peroxide solution and hydrogen peroxide solution: 1 to 20 g/l. Electroplating solution used for.
JP13596780A 1980-09-30 1980-09-30 Electroplating liquid used to form a Zn-Ti alloy plating film on steel surfaces Expired JPS589158B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13596780A JPS589158B2 (en) 1980-09-30 1980-09-30 Electroplating liquid used to form a Zn-Ti alloy plating film on steel surfaces

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13596780A JPS589158B2 (en) 1980-09-30 1980-09-30 Electroplating liquid used to form a Zn-Ti alloy plating film on steel surfaces

Publications (2)

Publication Number Publication Date
JPS5760089A JPS5760089A (en) 1982-04-10
JPS589158B2 true JPS589158B2 (en) 1983-02-19

Family

ID=15164035

Family Applications (1)

Application Number Title Priority Date Filing Date
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Country Status (1)

Country Link
JP (1) JPS589158B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0517079Y2 (en) * 1985-06-28 1993-05-07

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5467719B2 (en) * 2007-12-25 2014-04-09 Jfeスチール株式会社 Manufacturing method of surface-treated steel sheet

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0517079Y2 (en) * 1985-06-28 1993-05-07

Also Published As

Publication number Publication date
JPS5760089A (en) 1982-04-10

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