JPS5888741U

JPS5888741U - proximity switch

Info

Publication number: JPS5888741U
Application number: JP18561481U
Authority: JP
Inventors: 慎一郎鈴木
Original assignee: 株式会社山武
Priority date: 1981-12-11
Filing date: 1981-12-11
Publication date: 1983-06-16

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Brief explanation of the drawing]

第１図はこの考案における近接スイッチの一実施例を示
す側断面図、第２図はスイッチと被検出物体との距離と
コイルのＱとの関係を示す特性図、第３図は高層波形近
接スイッチの基本的な回路を示すブロック図、第４図は
スイッチと被検出物体との距離と、コイルのＱとの関係
を示す特性図。１・・・・・・ハウジング、２・・・・・・感応面、３
・・・・・・検出コイル、４・・・・・・コンデンサ、
５・・・・・・共振回路、６・・・・・・発振回路、７
・・・・・・検波・増幅回路、８・・・・・・積分回路
、９・・・・・・スイッチング回路、１０・・・・・・
出力回路、１１・・・・・・コア、１２・・・・・・プ
リント回路基板、１３・・・・・・金属薄板、１４・・
・・・・スペーサ、１５・・・・・・アース線、１６・
・・・・・アース導体、１７・・・・・・被検出物体。Fig. 1 is a side sectional view showing an embodiment of the proximity switch in this invention, Fig. 2 is a characteristic diagram showing the relationship between the distance between the switch and the detected object and the Q of the coil, and Fig. 3 is a high-rise waveform proximity FIG. 4 is a block diagram showing the basic circuit of the switch, and a characteristic diagram showing the relationship between the distance between the switch and the object to be detected and the Q of the coil. 1...Housing, 2...Sensitive surface, 3
...Detection coil, 4...Capacitor,
5...Resonance circuit, 6...Oscillation circuit, 7
...Detection/amplification circuit, 8...Integrator circuit, 9...Switching circuit, 10...
Output circuit, 11...core, 12...printed circuit board, 13...metal thin plate, 14...
...Spacer, 15...Ground wire, 16.
...Earth conductor, 17...Object to be detected.

Claims

[Scope of utility model registration request]

A core 11 is housed in the housing 1, and this core is disposed close to the sensitive surface 2 of the housing 1, and a detection coil 3 constituting a part of a high frequency oscillation circuit is housed in the core, Further, a metal thin plate 1 having a predetermined thickness between this detection coil and the sensing surface 2 of the housing 1 is provided.
3 is disposed at a predetermined distance from the detection coil 3 and electrically insulated from the core 11.