JPS5886622A - Computer - Google Patents

Computer

Info

Publication number
JPS5886622A
JPS5886622A JP56185053A JP18505381A JPS5886622A JP S5886622 A JPS5886622 A JP S5886622A JP 56185053 A JP56185053 A JP 56185053A JP 18505381 A JP18505381 A JP 18505381A JP S5886622 A JPS5886622 A JP S5886622A
Authority
JP
Japan
Prior art keywords
printed circuit
heat
circuit board
power supply
air
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP56185053A
Other languages
Japanese (ja)
Inventor
Kenichi Nishi
健一 西
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP56185053A priority Critical patent/JPS5886622A/en
Publication of JPS5886622A publication Critical patent/JPS5886622A/en
Pending legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/20Cooling means
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F2200/00Indexing scheme relating to G06F1/04 - G06F1/32
    • G06F2200/20Indexing scheme relating to G06F1/20
    • G06F2200/201Cooling arrangements using cooling fluid

Landscapes

  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Direct Current Feeding And Distribution (AREA)

Abstract

PURPOSE:To perform air cooling effectively and to prevent damage due to a voltage drop, etc., by partitioning a power source part and board part in each hierarchy and cooling the power sources through a heat exchanger, cooling the board parts in a conventional way, and supplying electric power to every hierarchy through short buses. CONSTITUTION:A package part 3 for printed boards PWB and a power source package part 4 are partitioned with a partitioning plate 2. A power source is provided to each hierarchy, and buses B1-B6 to printed boards penetrate the partitioning plate 2. The 1st heat exchangers T1-T6 connected in series are fitted to the power sources P1-P6 in the middle of a circulating passage 5 for a refrigerant. The 2nd heat exchanger 7 performs heat exchange between the circulating passage 5 and a flow passage 6 for water and air. A suction unit 8 and discharge unit 9 cool the board part. Refrigerants in the heat exchangers T1-T6 are heated by the power sources P1-P6 and are supplied to the heat exchanger 7 through the flow passage 5; and the heat that the refrigerant has is given to the air or water of the flow passage 6, and the refrigerant returns to the heat exchangers T1-T6.

Description

【発明の詳細な説明】 この発明は筺体内か階層状に分けらn、各階層にH’[
子部品が収付けらnているプリント基板が複数枚実装さ
jしている計S−憬の改良に関するO 計算機a周知のとおり、筐体内はPlt層状に分けらf
ており、8階層に0電子部品が取付けら扛たプリント基
板が複数枚実装さ扛ている。
[Detailed Description of the Invention] This invention is divided into hierarchies within the housing, and H'[
As is well known, the inside of the housing is divided into PLT layers.
There are multiple printed circuit boards with no electronic components mounted on the 8th floor.

そしてこnらプリント基板Kに1個または複数の電源か
ら電力が供給さrしている。
Electric power is supplied to the printed circuit board K from one or more power sources.

、ところで、近年計:JI機においては電源を複数に分
け、心安とする機能(ロ)路に個別に電力を供給するの
が一般的で、一つの電源から艮い電源プスで供給するこ
と−はしないLうKなりつつある。
By the way, in recent years, in JI machines, it is common to divide the power supply into multiple parts and supply power to the safe functions (b) separately, and it is not possible to supply power from a single power supply instead of using a power supply. It's becoming more and more important.

したがって、噌盾林に配置さfした各階層の情能I!!
回路には出来る限り、短い距離でwh、源を供給するこ
とが望ましく、その方が電源プスに↓る電圧下口ツノも
さけることができる。
Therefore, each level of emotion I placed in the forest! !
It is desirable to supply the power source to the circuit over a short distance as much as possible, which can also avoid the voltage drop at the power source.

ところが、電源を機能回路と隣接させておくことは電源
から生ずる多くの熱の処tIIL1r十分に考慮する心
安がある。
However, it is safe to place the power supply adjacent to the functional circuit, taking into account the heat dissipation caused by the power supply.

この発明はこの工うな観点に立ってなさ扛たもので、以
下図に、示す実6111i例に工ってこの発明會説明す
る。
The present invention was developed based on this point of view, and will be explained below using an example 6111i shown in the figure.

図において、 IIIH計smの一体+Ft”FaH階
増階層分けらnた各階層であって、各)’1層にtX 
パッケージシェルフが取付けらfしており、そのシェル
フ[r[プリントカードPWBがそ扛そn実装さnてい
る。121は上記PWB実装部(3:と、電源爽装部(
4)と金分ける仕切板である。上記電源実装$141に
に各階層に分けらfしたプリント基板実装部の各階層に
対応する工うに図示していない商用電源ラインまたは主
電源につながる′電源P、 % P、が同じく階層状に
収付けらfしており、電源P1の出力は階層Flのプリ
ント着板へ供給さ扛、電源P冨の出力は1ift層F2
 のプリント基板へ供給さjLる。
In the figure, each layer is divided into n layers of IIIH total sm + Ft''FaH layer, and each)'1 layer has tX
A package shelf is installed and the printed card PWB is mounted on the shelf. 121 is the PWB mounting part (3:) and the power supply replacement part (
4) It is a partition plate that separates the money. The power supply P, % P, which is connected to a commercial power line or main power supply (not shown), is also arranged in a hierarchical manner in the power supply mounting part 141, which is divided into layers. The output of power supply P1 is supplied to the printed board of layer Fl, and the output of power supply P is supplied to layer F2 of layer F2.
is supplied to the printed circuit board.

B1−86は電源出力を対応する噌!−の電子部品へ供
給するための電線プス又はケーブルであり、仕切板を責
通している。
B1-86 corresponds to the power output! - An electric wire or cable for supplying electronic parts, and passes through the partition plate.

’ri % ’rs汀′直列につながrt、;第1の熱
交換器であって、電源pt〜P6そnぞ扛に取付けらr
し谷亀隙から生じる熱を抽出するもので、7レオン等の
冷媒が循環する循環流路(51の途中に設けらnている
。;6)に空気または水が#、rする流路。
'ri% 'rs' connected in series rt; the first heat exchanger, which is connected to the power supply pt~P6 and the r
It extracts the heat generated from the valley gap, and is a flow path in which air or water flows through the circulation flow path (provided in the middle of 51; 6) in which a refrigerant such as 7 Leon is circulated.

+7)に5g2の熱交換器であって、循環流路(51と
流路(6)との闇で熱交換が行わnる。
+7) is a 5g2 heat exchanger, and heat exchange is performed between the circulation channel (51) and the channel (6).

なお、I42の熱交換器(7:及び流路(6)は電源p
t〜P6からartたところに位置し1例えば筺体…の
背rjnvc設けらnている。
In addition, the heat exchanger (7: and flow path (6) of I42 are connected to the power supply p
It is located at a place art from t to P6, and is provided on the back of the casing, for example.

また、 181r[プリント基板実装部を冷却するため
の外気をとり込む吸気ブアンユニッ)、191t’!排
気フアンユニツトである。
In addition, 181r [intake unit that takes in outside air to cool the printed circuit board mounting section], 191t'! This is an exhaust fan unit.

この発INに以上の1うになっているから第lの熱交換
′@T1〜T6の中のめ媒は′電源P!〜P6そrtぞ
jLから生ずる熱に工って加熱さfL、膨張し^圧とな
って矢印点線で示す工うに流路(51を通って第2の熱
交換器(7)に遅し、ここで冷媒が壱する熱1kfL路
;6:の空気またに水に与え、自らは縦幅して圧力を下
け、書び第lや熱8侠器1゛鳳〜1゛6にもどる。
Since this output IN is as described above, the medium in the lth heat exchange '@T1 to T6 is the power supply P! 〜P6 So, the heat generated from jL is used to heat fL, expand, and become under pressure.It passes through the flow path (51) shown by the dotted arrow line and is transferred to the second heat exchanger (7), where it is heated. The heat generated by the refrigerant is 1kfL, which is given to the air and water, which then lowers the pressure by increasing its width and returns to the 1st and 8th heat vessel 1゛鳳~1゛6.

なお、流路+61 tl−流fLる空気また框水汀世l
えば空−装置の耐却器から供給さtしるものであっても
Lい。
In addition, the flow path +61 tl-flow fL air and water flow l
For example, even if it is supplied from an empty equipment's reactor, it will be too small.

一万、プリント基板実装部(3)は吸気ファンユニット
(8)によって収り込まrt + 排気ファンユニット
191 [工って排出さ扛る空気に工って冷却さnる。
10,000, the printed circuit board mounting part (3) is accommodated by the intake fan unit (8) and is cooled by the air being exhausted by the exhaust fan unit 191.

この発明は以上の1うになっているので、井装置の大き
い[#Pt〜P6μプリント、4板とa別の方法で効果
的に耐飾は扛、プリント着板には電練力為ら生する熱の
影響を与えない。−万。
Since this invention has the above-mentioned features, it is possible to effectively decorate the printed board by using a different method for printing with a large plate [#Pt~P6μ], and using electric polishing force for printing. Not affected by heat. Ten thousand.

プリント基板は通常の9酊に工って牟却さ’fLる。し
かも階層ごとに電隙惧紺が短い距離でなさ詐るため、電
源供#時の電圧ドロップや、長い電源ラインに起りがち
な外部ノイズを拾うことによる機能回路の誤動作を防ぐ
ことができる。
The printed circuit board was constructed in the usual manner and then discarded. Moreover, since the electric gap is minimized over a short distance in each layer, it is possible to prevent malfunctions of functional circuits due to voltage drops when power is supplied and external noise that tends to occur on long power lines.

【図面の簡単な説明】[Brief explanation of drawings]

図はこの発明vcLる計鼻機の一笑/li!i例を示す
flll成図であり、(1)に筐体、121は仕切板、
(31はプリント基板実装部 (4)は篭源夷袈部、F
l〜F6rz+w層、PWBHプリント基板、  Pt
 〜P、 H’[源+  Bl ” B6は電源ブス又
はケーブル+ ll+、〜T6は粛lの熱交換器、(5
Iに循環流路、(61区流路。 +71に第2の熱交換器、(8)に吸気ファンユニット
+ 19+t!フアンユニツトでアル。 代理人  葛 野 僅 −
The figure shows this invention vcL nose meter lol/li! This is a full diagram showing an example i, in which (1) is the casing, 121 is the partition plate,
(31 is the printed circuit board mounting part, (4) is the katori part, F
l~F6rz+w layer, PWBH printed circuit board, Pt
~P, H' [Source + Bl'' B6 is the power bus or cable +ll+, ~T6 is the heat exchanger, (5
Circulation flow path in I, (61 section flow path. + 71 is the second heat exchanger, (8) is the intake fan unit + 19+t! Fan unit. Agent: Kuzuno -

Claims (1)

【特許請求の範囲】[Claims] 筐体内が階層状に分けらn、谷噌層そrしぞfLにa、
電子部品が奴付けらytだプリント4板がa数枚実装さ
ftている計算機において、各階層に対応いかつプリン
ト基板実装部と同じく階層状に配置さnyci数の電源
と、各′m源にそrtぞ′rL取付けらn、谷°電源か
ら生ずる熱1に収り出て第1のi1!%交換器と、上記
第1の熱交侠器を介して形成さn、かつ7レオン等の乍
媒が流rしる循!l流路と、空気または水がrifLる
直路と、上記循環流路と空気または水が随jLる上i1
α流路との間で熱421#を行わせる第2の熱父侠器と
、上記プリント4板が実装さ扛ている部分と一:源が取
付けら扛ている部分とを分ける仕切仮と、各哨l曽ごと
に′電源とプリント4&側とt帖ひ、かつ上記仕切&を
員遡する眠源ブス、またはケーブルと、プリント基板実
装部の上部と下部に収付けらrした空?′4r川7アン
ユニソトとから構成さ扛、プリント基板実装部と、電源
取付側はそfLぞn別の方法で冷却丁ゐ工うに構成した
ことを特徴とする計J1機。
The inside of the casing is divided into layers, and the valley layer is divided into layers.
In a computer in which a number of four printed circuit boards are mounted in which electronic components are attached, a number of power supplies corresponding to each level and arranged hierarchically in the same manner as the printed circuit board mounting section are connected to each source. Now that the L is installed, the heat generated from the valley power supply is contained in the first i1! % exchanger and the first heat exchanger, and a medium such as 7 Leon flows through the circulation! 1 flow path, a straight path through which air or water rifL, and an upper i1 through which air or water flows through the circulation flow path.
A second heat generator that generates heat 421# between the α flow path and a temporary partition that separates the part where the printed circuit board 4 is mounted and the part where the source is not installed. , for each block, there is a power supply and a print board on the 4& side, and a sleep source bus or cable that connects the partition & above, and an empty space installed at the top and bottom of the printed circuit board mounting section. The J1 machine is characterized by being constructed from 4R and 7 units, and the printed circuit board mounting section and power supply mounting side are designed to be cooled using different methods.
JP56185053A 1981-11-18 1981-11-18 Computer Pending JPS5886622A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56185053A JPS5886622A (en) 1981-11-18 1981-11-18 Computer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56185053A JPS5886622A (en) 1981-11-18 1981-11-18 Computer

Publications (1)

Publication Number Publication Date
JPS5886622A true JPS5886622A (en) 1983-05-24

Family

ID=16163971

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56185053A Pending JPS5886622A (en) 1981-11-18 1981-11-18 Computer

Country Status (1)

Country Link
JP (1) JPS5886622A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0611284A (en) * 1990-03-12 1994-01-21 Babcock & Wilcox Co:The Variable conduction heat pipe strengthening
WO1999047994A1 (en) * 1998-03-16 1999-09-23 Lee Mok Hyoung System for cooling device in computer

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0611284A (en) * 1990-03-12 1994-01-21 Babcock & Wilcox Co:The Variable conduction heat pipe strengthening
WO1999047994A1 (en) * 1998-03-16 1999-09-23 Lee Mok Hyoung System for cooling device in computer

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