JPS5885210A - Semiconductive molded article capable of thermally recovering - Google Patents

Semiconductive molded article capable of thermally recovering

Info

Publication number
JPS5885210A
JPS5885210A JP18429681A JP18429681A JPS5885210A JP S5885210 A JPS5885210 A JP S5885210A JP 18429681 A JP18429681 A JP 18429681A JP 18429681 A JP18429681 A JP 18429681A JP S5885210 A JPS5885210 A JP S5885210A
Authority
JP
Japan
Prior art keywords
molded article
semiconductive
heat
weight
recoverable
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18429681A
Other languages
Japanese (ja)
Inventor
安田 則彦
上野 桂二
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries Ltd filed Critical Sumitomo Electric Industries Ltd
Priority to JP18429681A priority Critical patent/JPS5885210A/en
Publication of JPS5885210A publication Critical patent/JPS5885210A/en
Pending legal-status Critical Current

Links

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】 本発明は熱回復し得る半導電性成型品に関するものであ
る。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a heat-recoverable semiconductive molded article.

電カケープルジヨイント部の内部半導電層あるいは外部
半導電層には、従来テープなどがよく用いられて来た。
Conventionally, tape or the like has often been used for the internal semiconductive layer or the external semiconductive layer of the power cable joint.

最近では成型後の表面の平滑さ、加工の容易さ等の利点
から半導電性熱収縮チューブが用いられる様になって来
ている。従来からポリオレフィン系樹脂に導電性カーボ
ンブラックを多量に配合して、半導電性熱収縮チューブ
を′作成していた。通常半導電層として必要な導電性は
体積固有抵抗として102〜10’Ω・傭 程度である
Recently, semiconductive heat-shrinkable tubes have come into use due to their advantages such as smoothness of the surface after molding and ease of processing. Conventionally, semiconductive heat-shrinkable tubes have been made by blending a large amount of conductive carbon black with polyolefin resin. Normally, the conductivity required for a semiconducting layer is about 102 to 10'Ω·m in terms of volume resistivity.

樹脂に導電性カーボンブラックを練り込む場合、導電性
カーボンブラックとして良く知られているア七チレンカ
ーボンでも40〜70重量部、さらに通常補強用などに
用いられるHAFカーボン等では60〜80重量部ある
いはそれ以上混合する必要があった。ところが、カーボ
ンブラックを混合すると、材料の混線時の粘度が増加し
、成型品作成の為の加工が非常に困難となる。さらには
、材料自体の伸びも極端に低下して、成型品として非常
にもろいものになり、収縮成型品を作成する為の膨張倍
率が小さくなり、極端な場合、膨張が出来ず、収縮成型
品を作成する事が出来ない。本発明はこの欠点を改良す
る為のもので、その要旨はポリカプロラクトンを主体と
−する樹脂分100重量部に対して導電性カーボンブラ
ックが10−40重量部含有する樹脂組成物の架橋され
た成型品であって、加熱下での変形による歪が常温にて
残留されていることを特徴とする熱回復し得る半導電性
成型品である。
When kneading conductive carbon black into resin, 40 to 70 parts by weight of a7ethylene carbon, which is well known as conductive carbon black, and 60 to 80 parts by weight of HAF carbon, which is usually used for reinforcement, etc. More mixing was needed. However, when carbon black is mixed, the viscosity increases when the materials are mixed, making processing for producing molded products extremely difficult. Furthermore, the elongation of the material itself is extremely reduced, making it extremely brittle as a molded product, and the expansion ratio for creating shrink-molded products becomes small, and in extreme cases, it cannot expand, making shrink-molded products cannot be created. The present invention is intended to improve this drawback, and its gist is to create a cross-linked resin composition containing 10-40 parts by weight of conductive carbon black per 100 parts by weight of a resin containing polycaprolactone as a main component. The present invention is a heat-recoverable semiconductive molded product in which strain caused by deformation under heating remains at room temperature.

結晶性高分子である。このポリカプロラクトンに導電性
カーボンブラックを配合すると少ないカーボンブラック
量で良い導電性が得られることが見出され、その組成物
は、その成型品tζ熱回復性(加熱下での変形による歪
を常温にて残留させることによって得られる性質で、例
えば成型品がチューブ状のとき、加熱下で膨張して常温
にてその歪を残留させれば熱収縮性を示す)を付与する
ことができた。実施例1〜5はその成型品の樹脂組成物
の配合例を示す。
It is a crystalline polymer. It was discovered that when conductive carbon black is blended with this polycaprolactone, good conductivity can be obtained with a small amount of carbon black, and the composition has excellent thermal recovery properties (strain due to deformation under heating at room temperature). For example, when a molded product is in the form of a tube, it can be given heat-shrinkable properties if the molded product expands under heating and the strain remains at room temperature. Examples 1 to 5 show formulation examples of resin compositions for the molded products.

180℃における混合トルクは比較例1〜5の低密度ポ
リエチレンに同じカーボンブラックを配合した同じ様な
導電度をもつ配合物と較べると小さなトルクを示し混線
トルクが小さくなり、加工が容易になった。さらに内径
10m、肉厚2uLのチューブを押出し電子線を25m
rad照射する事により架橋させたのち、150℃で加
熱し、チューブ内部に圧力をかけ膨張した。実施例1〜
5の様に本発明を使用したものでは比較例1〜5の様に
同じ導電度をもつものにくらべて大きな膨張が可能であ
る事がわかる。(第1表、第2表) 又、樹脂としてポリカプロラクトンのみでなくエチレン
プロピレンコポリマーあるいはエチレン−酢酸ビニルコ
ポリマー等のポリオレフィン類ト混合したものを使用し
ても、実施例6〜8の様に一本発明の結果を期待する事
が出来る。しかしながらポリオレフィン類が50重量部
を起えると比較例6〜8の様にポリオレフィン類の性質
が主体になり混練りトルク、膨張倍率を実施例と同程度
をζする為のカーボン量では抵抗が大きくなるといった
問題が発生する為、本発明の効果が期待する事が出来な
くなる。(第3表) 架橋方法としては電子線照射、γ線照射といった高エネ
ルギー線照射架橋の他、あらかじめ有機過酸化物等の架
橋剤を配合しておき、成型時加熱を行なう化学架橋及び
水分と反応して架橋反応を起し様な反応基をあらかtめ
導入しておき、成型後水分に触れさせて架橋させる特公
昭48−1711米国特許3,075,948に記載さ
れた様な方法もとられる事が出来る。又、通常、劣化防
止、耐候性向上等の目的で添加される老化防止剤、紫外
線吸収剤や加工助剤、又は難燃剤等の添加によって、本
発明の効果はそこなわれる事はない。
The mixing torque at 180°C was smaller than Comparative Examples 1 to 5, which were low-density polyethylene mixed with the same carbon black and had similar conductivity, and the crosstalk torque was small, making processing easier. . Furthermore, a tube with an inner diameter of 10 m and a wall thickness of 2 uL was extruded and the electron beam was emitted for 25 m.
After being crosslinked by rad irradiation, the tube was heated at 150° C. and expanded by applying pressure inside the tube. Example 1~
It can be seen that the products using the present invention, such as No. 5, can be expanded to a greater extent than those having the same conductivity, such as Comparative Examples 1 to 5. (Tables 1 and 2) Furthermore, even if a mixture of not only polycaprolactone but also polyolefins such as ethylene propylene copolymer or ethylene-vinyl acetate copolymer is used as the resin, the results will be uniform as in Examples 6 to 8. The results of the present invention can be expected. However, when the amount of polyolefins is 50 parts by weight, the properties of the polyolefins become dominant as in Comparative Examples 6 to 8, and the resistance becomes large when the amount of carbon is used to maintain the same kneading torque and expansion ratio as in the examples. Therefore, the effects of the present invention cannot be expected. (Table 3) Crosslinking methods include high-energy ray irradiation crosslinking such as electron beam irradiation and gamma ray irradiation, chemical crosslinking in which a crosslinking agent such as an organic peroxide is mixed in advance, and heating is performed during molding, and water and moisture irradiation. A method such as that described in Japanese Patent Publication No. 48-1711, U.S. Pat. No. 3,075,948, in which a reactive group that reacts to cause a crosslinking reaction is introduced in advance, and after molding, it is exposed to moisture and crosslinked. It can also be taken away. Furthermore, the effects of the present invention are not impaired by the addition of anti-aging agents, ultraviolet absorbers, processing aids, flame retardants, etc., which are usually added for the purpose of preventing deterioration, improving weather resistance, etc.

) 第2表 WX−R:老化防止剤2.4  ジチオビスジフェノー
ル(住人化学製、商 品名) PE DFD2005   :低密度ポリエチレン(日
本ユニカー製、商品名) EVA D2011   :エチレン酢酸ビニル共重合
体(住人化学製、商品名) 混合トルク測定はブラベンダーにより180℃−4゜r
pmで行なった プラクセルH−7=ポリカプロラクトン分子量7万(ダ
イセル化学製、商品名) プラクセルH−4:ポリカプロラクトン分子量4万(ダ
イセル化学製、商品名) デンカブラック :アセチレンカーボン(電気化学部、
商品名) ジースト300   :HAFカーボン(東海電極部、
商品名)
) Table 2 WX-R: Anti-aging agent 2.4 Dithiobisdiphenol (manufactured by Sumitomo Chemical, trade name) PE DFD2005: Low density polyethylene (manufactured by Nippon Unicar, trade name) EVA D2011: Ethylene-vinyl acetate copolymer ( (manufactured by Juju Chemical, trade name) Mixing torque was measured at 180℃-4゜r using a Brabender.
Plaxel H-7 = Polycaprolactone molecular weight 70,000 (manufactured by Daicel Chemical, trade name) Plaxel H-4: Polycaprolactone molecular weight 40,000 (manufactured by Daicel Chemical, trade name) Denka Black: Acetylene carbon (Department of Electrochemistry,
Product name) Geest 300: HAF Carbon (Tokai Electrode Department,
Product name)

Claims (3)

【特許請求の範囲】[Claims] (1)ポリカプロラクトンを主体とするポリマー100
重量部に対して導電性カーボンブラックが10〜40 
重量部含有する樹脂組成物の架橋されに成型品であって
、加熱下での変形による歪が常温にて残留されているこ
とを特徴とする熱回復し得る半導電性成型品。
(1) Polymer 100 mainly composed of polycaprolactone
10 to 40 parts by weight of conductive carbon black
1. A heat-recoverable semiconductive molded article, which is a crosslinked molded article of a resin composition containing parts by weight, and is characterized in that distortion due to deformation under heating remains at room temperature.
(2)架橋が電子線又はγ−線の照射による架橋である
特許請求の範囲第(1)項記載の熱回復し得る半導電性
成型品。
(2) A heat-recoverable semiconductive molded article according to claim (1), wherein the crosslinking is performed by irradiation with electron beams or γ-rays.
(3)ポリカプロラクトンの分子量が4万以上である特
許請求の範囲第(1)項記載の熱回復し得る半導電性成
型品。
(3) The heat-recoverable semiconductive molded article according to claim (1), wherein the polycaprolactone has a molecular weight of 40,000 or more.
JP18429681A 1981-11-16 1981-11-16 Semiconductive molded article capable of thermally recovering Pending JPS5885210A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18429681A JPS5885210A (en) 1981-11-16 1981-11-16 Semiconductive molded article capable of thermally recovering

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18429681A JPS5885210A (en) 1981-11-16 1981-11-16 Semiconductive molded article capable of thermally recovering

Publications (1)

Publication Number Publication Date
JPS5885210A true JPS5885210A (en) 1983-05-21

Family

ID=16150842

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18429681A Pending JPS5885210A (en) 1981-11-16 1981-11-16 Semiconductive molded article capable of thermally recovering

Country Status (1)

Country Link
JP (1) JPS5885210A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5478619A (en) * 1990-08-09 1995-12-26 Fuji Photo Film Co., Ltd. Web takeup roll

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5478619A (en) * 1990-08-09 1995-12-26 Fuji Photo Film Co., Ltd. Web takeup roll

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