JPS588514A - Preparation of composite separation film - Google Patents
Preparation of composite separation filmInfo
- Publication number
- JPS588514A JPS588514A JP56105620A JP10562081A JPS588514A JP S588514 A JPS588514 A JP S588514A JP 56105620 A JP56105620 A JP 56105620A JP 10562081 A JP10562081 A JP 10562081A JP S588514 A JPS588514 A JP S588514A
- Authority
- JP
- Japan
- Prior art keywords
- aromatic
- polyimide
- film
- heat
- membrane
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000926 separation method Methods 0.000 title claims abstract description 52
- 239000002131 composite material Substances 0.000 title claims abstract description 26
- 239000004642 Polyimide Substances 0.000 claims abstract description 57
- 229920001721 polyimide Polymers 0.000 claims abstract description 57
- 125000003118 aryl group Chemical group 0.000 claims abstract description 44
- 229920000642 polymer Polymers 0.000 claims abstract description 41
- 239000002904 solvent Substances 0.000 claims abstract description 16
- 229920005575 poly(amic acid) Polymers 0.000 claims abstract description 11
- 239000012528 membrane Substances 0.000 claims description 50
- 239000011247 coating layer Substances 0.000 claims description 9
- 238000001035 drying Methods 0.000 claims description 9
- 239000003960 organic solvent Substances 0.000 claims description 8
- 238000004519 manufacturing process Methods 0.000 claims description 7
- 238000000034 method Methods 0.000 abstract description 32
- -1 aromatic tetracarboxylic acid Chemical class 0.000 abstract description 20
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 abstract description 18
- 150000004984 aromatic diamines Chemical class 0.000 abstract description 7
- 229920002492 poly(sulfone) Polymers 0.000 abstract description 6
- 239000011248 coating agent Substances 0.000 abstract description 5
- 238000000576 coating method Methods 0.000 abstract description 5
- 229920002379 silicone rubber Polymers 0.000 abstract description 4
- 239000004945 silicone rubber Substances 0.000 abstract description 4
- 230000000379 polymerizing effect Effects 0.000 abstract description 3
- 239000004205 dimethyl polysiloxane Substances 0.000 abstract description 2
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 abstract description 2
- 239000000243 solution Substances 0.000 description 51
- 239000007789 gas Substances 0.000 description 29
- 239000012982 microporous membrane Substances 0.000 description 29
- 239000010408 film Substances 0.000 description 22
- 230000035699 permeability Effects 0.000 description 20
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 16
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 15
- 239000001257 hydrogen Substances 0.000 description 14
- 229910052739 hydrogen Inorganic materials 0.000 description 14
- 239000010410 layer Substances 0.000 description 13
- UGFAIRIUMAVXCW-UHFFFAOYSA-N Carbon monoxide Chemical compound [O+]#[C-] UGFAIRIUMAVXCW-UHFFFAOYSA-N 0.000 description 9
- 239000007788 liquid Substances 0.000 description 9
- 229910002091 carbon monoxide Inorganic materials 0.000 description 8
- 230000001112 coagulating effect Effects 0.000 description 8
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 7
- 239000010409 thin film Substances 0.000 description 7
- 230000015572 biosynthetic process Effects 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 6
- 150000003949 imides Chemical class 0.000 description 6
- 239000002798 polar solvent Substances 0.000 description 6
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 4
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 4
- 229910002090 carbon oxide Inorganic materials 0.000 description 4
- 235000019441 ethanol Nutrition 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 150000008065 acid anhydrides Chemical class 0.000 description 3
- 238000005345 coagulation Methods 0.000 description 3
- 230000015271 coagulation Effects 0.000 description 3
- 229910001873 dinitrogen Inorganic materials 0.000 description 3
- 239000012046 mixed solvent Substances 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 238000006116 polymerization reaction Methods 0.000 description 3
- 238000007363 ring formation reaction Methods 0.000 description 3
- WXNZTHHGJRFXKQ-UHFFFAOYSA-N 4-chlorophenol Chemical compound OC1=CC=C(Cl)C=C1 WXNZTHHGJRFXKQ-UHFFFAOYSA-N 0.000 description 2
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 2
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 2
- 229930194542 Keto Natural products 0.000 description 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 2
- OFBQJSOFQDEBGM-UHFFFAOYSA-N Pentane Chemical compound CCCCC OFBQJSOFQDEBGM-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 238000007605 air drying Methods 0.000 description 2
- 238000005266 casting Methods 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000012510 hollow fiber Substances 0.000 description 2
- 239000012456 homogeneous solution Substances 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 2
- BKIMMITUMNQMOS-UHFFFAOYSA-N nonane Chemical compound CCCCCCCCC BKIMMITUMNQMOS-UHFFFAOYSA-N 0.000 description 2
- TVMXDCGIABBOFY-UHFFFAOYSA-N octane Chemical compound CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 description 2
- 229940090668 parachlorophenol Drugs 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- 239000002243 precursor Substances 0.000 description 2
- 239000001294 propane Substances 0.000 description 2
- 238000002791 soaking Methods 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- GEYOCULIXLDCMW-UHFFFAOYSA-N 1,2-phenylenediamine Chemical compound NC1=CC=CC=C1N GEYOCULIXLDCMW-UHFFFAOYSA-N 0.000 description 1
- JBCUKQQIWSWEOK-UHFFFAOYSA-N 2-(benzenesulfonyl)aniline Chemical compound NC1=CC=CC=C1S(=O)(=O)C1=CC=CC=C1 JBCUKQQIWSWEOK-UHFFFAOYSA-N 0.000 description 1
- FYDMBFIJIQPURU-UHFFFAOYSA-N 2-[2-(2-aminophenyl)propan-2-yl]aniline Chemical compound C=1C=CC=C(N)C=1C(C)(C)C1=CC=CC=C1N FYDMBFIJIQPURU-UHFFFAOYSA-N 0.000 description 1
- MILSYCKGLDDVLM-UHFFFAOYSA-N 2-phenylpropan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)C1=CC=CC=C1 MILSYCKGLDDVLM-UHFFFAOYSA-N 0.000 description 1
- JRBJSXQPQWSCCF-UHFFFAOYSA-N 3,3'-Dimethoxybenzidine Chemical group C1=C(N)C(OC)=CC(C=2C=C(OC)C(N)=CC=2)=C1 JRBJSXQPQWSCCF-UHFFFAOYSA-N 0.000 description 1
- NDXGRHCEHPFUSU-UHFFFAOYSA-N 3-(3-aminophenyl)aniline Chemical group NC1=CC=CC(C=2C=C(N)C=CC=2)=C1 NDXGRHCEHPFUSU-UHFFFAOYSA-N 0.000 description 1
- UITKHKNFVCYWNG-UHFFFAOYSA-N 4-(3,4-dicarboxybenzoyl)phthalic acid Chemical compound C1=C(C(O)=O)C(C(=O)O)=CC=C1C(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 UITKHKNFVCYWNG-UHFFFAOYSA-N 0.000 description 1
- AVCOFPOLGHKJQB-UHFFFAOYSA-N 4-(3,4-dicarboxyphenyl)sulfonylphthalic acid Chemical compound C1=C(C(O)=O)C(C(=O)O)=CC=C1S(=O)(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 AVCOFPOLGHKJQB-UHFFFAOYSA-N 0.000 description 1
- HLBLWEWZXPIGSM-UHFFFAOYSA-N 4-Aminophenyl ether Chemical compound C1=CC(N)=CC=C1OC1=CC=C(N)C=C1 HLBLWEWZXPIGSM-UHFFFAOYSA-N 0.000 description 1
- IWXCYYWDGDDPAC-UHFFFAOYSA-N 4-[(3,4-dicarboxyphenyl)methyl]phthalic acid Chemical compound C1=C(C(O)=O)C(C(=O)O)=CC=C1CC1=CC=C(C(O)=O)C(C(O)=O)=C1 IWXCYYWDGDDPAC-UHFFFAOYSA-N 0.000 description 1
- KFDVPJUYSDEJTH-UHFFFAOYSA-N 4-ethenylpyridine Chemical compound C=CC1=CC=NC=C1 KFDVPJUYSDEJTH-UHFFFAOYSA-N 0.000 description 1
- JVERADGGGBYHNP-UHFFFAOYSA-N 5-phenylbenzene-1,2,3,4-tetracarboxylic acid Chemical compound OC(=O)C1=C(C(O)=O)C(C(=O)O)=CC(C=2C=CC=CC=2)=C1C(O)=O JVERADGGGBYHNP-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- 241000931705 Cicada Species 0.000 description 1
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 1
- SUAKHGWARZSWIH-UHFFFAOYSA-N N,N‐diethylformamide Chemical compound CCN(CC)C=O SUAKHGWARZSWIH-UHFFFAOYSA-N 0.000 description 1
- NIPNSKYNPDTRPC-UHFFFAOYSA-N N-[2-oxo-2-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)ethyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(CNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 NIPNSKYNPDTRPC-UHFFFAOYSA-N 0.000 description 1
- PMZURENOXWZQFD-UHFFFAOYSA-L Sodium Sulfate Chemical compound [Na+].[Na+].[O-]S([O-])(=O)=O PMZURENOXWZQFD-UHFFFAOYSA-L 0.000 description 1
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 150000007933 aliphatic carboxylic acids Chemical class 0.000 description 1
- 150000001338 aliphatic hydrocarbons Chemical class 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- 239000003849 aromatic solvent Substances 0.000 description 1
- 150000001555 benzenes Chemical class 0.000 description 1
- HFACYLZERDEVSX-UHFFFAOYSA-N benzidine Chemical compound C1=CC(N)=CC=C1C1=CC=C(N)C=C1 HFACYLZERDEVSX-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- 235000010290 biphenyl Nutrition 0.000 description 1
- 239000004305 biphenyl Substances 0.000 description 1
- TUQQUUXMCKXGDI-UHFFFAOYSA-N bis(3-aminophenyl)methanone Chemical compound NC1=CC=CC(C(=O)C=2C=C(N)C=CC=2)=C1 TUQQUUXMCKXGDI-UHFFFAOYSA-N 0.000 description 1
- ZLSMCQSGRWNEGX-UHFFFAOYSA-N bis(4-aminophenyl)methanone Chemical compound C1=CC(N)=CC=C1C(=O)C1=CC=C(N)C=C1 ZLSMCQSGRWNEGX-UHFFFAOYSA-N 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 150000001896 cresols Chemical class 0.000 description 1
- 150000004985 diamines Chemical class 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- CCAFPWNGIUBUSD-UHFFFAOYSA-N diethyl sulfoxide Chemical compound CCS(=O)CC CCAFPWNGIUBUSD-UHFFFAOYSA-N 0.000 description 1
- CZZYITDELCSZES-UHFFFAOYSA-N diphenylmethane Chemical compound C=1C=CC=CC=1CC1=CC=CC=C1 CZZYITDELCSZES-UHFFFAOYSA-N 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 150000004820 halides Chemical class 0.000 description 1
- 239000003779 heat-resistant material Substances 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- AJFDBNQQDYLMJN-UHFFFAOYSA-N n,n-diethylacetamide Chemical compound CCN(CC)C(C)=O AJFDBNQQDYLMJN-UHFFFAOYSA-N 0.000 description 1
- 150000004950 naphthalene Chemical class 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N phenylbenzene Natural products C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 229930195734 saturated hydrocarbon Natural products 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 150000003457 sulfones Chemical class 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 150000003568 thioethers Chemical class 0.000 description 1
- 150000003613 toluenes Chemical class 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 125000002256 xylenyl group Chemical class C1(C(C=CC=C1)C)(C)* 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D71/00—Semi-permeable membranes for separation processes or apparatus characterised by the material; Manufacturing processes specially adapted therefor
- B01D71/06—Organic material
- B01D71/58—Other polymers having nitrogen in the main chain, with or without oxygen or carbon only
- B01D71/62—Polycondensates having nitrogen-containing heterocyclic rings in the main chain
- B01D71/64—Polyimides; Polyamide-imides; Polyester-imides; Polyamide acids or similar polyimide precursors
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Separation Using Semi-Permeable Membranes (AREA)
- Manufacture Of Porous Articles, And Recovery And Treatment Of Waste Products (AREA)
Abstract
Description
【発明の詳細な説明】 この発明は、芳香族ポリイミド微多孔質膜に。[Detailed description of the invention] This invention relates to an aromatic polyimide microporous membrane.
前記ポリイミド不溶性の有機溶媒と他の耐熱性ポリマー
とからなる耐熱性ポリマー希薄溶液を塗布し、乾燥する
゛ことによって、耐熱性の複合分離膜を製造する方法に
係る。The present invention relates to a method for manufacturing a heat-resistant composite separation membrane by applying a dilute heat-resistant polymer solution consisting of the polyimide-insoluble organic solvent and another heat-resistant polymer and drying the solution.
この発明で製造されるポリイミド微多孔質層を有する複
合分離膜は、優れた耐熱性と機械的強度とを有し、ガス
透過性能、ガス分離性能が優れているのである。The composite separation membrane having a polyimide microporous layer manufactured by the present invention has excellent heat resistance and mechanical strength, and has excellent gas permeability and gas separation performance.
従来、耐熱性で高性能の分離膜であるポリイミド分離膜
の製造法として種々提案されており9例えば、特開昭4
9−45152号公報には、製膜用のドープ液として芳
香族ポリアミック酸の均一な溶液を使用して、そのドー
プ液の薄膜を形成し。In the past, various methods for producing polyimide separation membranes, which are heat-resistant and high-performance separation membranes, have been proposed9.
No. 9-45152 discloses that a homogeneous solution of aromatic polyamic acid is used as a dope solution for film formation, and a thin film of the dope solution is formed.
製膜用の凝固液として低級脂肪族カルボン酸と第6級ア
ミンとから本質的になるイミド環化組成物を含有する混
合溶媒を使用して、前記ポリアミック酸溶液(ドープ液
)の薄膜を湿式製膜法で凝固すると共にポリマーをイミ
ド環化して、ポリイミド非対称性膜を製造する方法が記
載されており。A thin film of the polyamic acid solution (dope solution) is wet-formed using a mixed solvent containing an imide cyclized composition consisting essentially of a lower aliphatic carboxylic acid and a 6th-class amine as a coagulating liquid for film formation. A method is described for producing an asymmetric polyimide membrane by coagulating the polymer by a membrane forming method and cyclizing the polymer with imide.
よく知られている。well known.
しかしながら、前述の公知の製膜方法では、製膜を凝固
液との接触による湿式製膜法で行い、凝固とイミド環化
とを同時に凝固液中で行うためにそれらのコントロール
が難しく安定したガス分離性能を有するポリイミド分離
膜を再現性よく製造・することが極めて困難であシ、し
たがって、ガス成分の分離性能が不安定でバラツキが大
きく、ガス成分の透過速度が充分に速くない非対称性膜
となってしまうことが、しばしば起るという問題があっ
た。However, in the above-mentioned known film forming method, the film is formed by a wet film forming method by contacting with a coagulating liquid, and coagulation and imide cyclization are simultaneously performed in the coagulating liquid, making it difficult to control them. It is extremely difficult to manufacture polyimide separation membranes with good separation performance with good reproducibility. Therefore, the separation performance of gas components is unstable and varies widely, and the permeation rate of gas components is not fast enough. The problem is that this often happens.
この発明者らは慶前述のような欠点のない耐熱性の分離
膜の新規な製造法について鋭意研究した結果、予め製造
された芳香族ポリイミド微多孔質膜の表面に、耐熱性ポ
リマーの希薄溶液を、塗布しtその塗布層を乾燥し溶媒
を徐々に除去することに′よって、高性能の耐熱性の複
合分離膜を安定的に製造できることを見出し、この発明
を完成した。The inventors conducted extensive research on a new method for producing a heat-resistant separation membrane that does not have the drawbacks mentioned above. As a result, a dilute solution of a heat-resistant polymer was applied to the surface of a pre-fabricated aromatic polyimide microporous membrane. It was discovered that a high-performance, heat-resistant composite separation membrane could be stably produced by coating the coating layer, drying the coated layer, and gradually removing the solvent, and completed the present invention.
すなわち、この発明は、芳香族ポリイミド微多孔質膜に
。That is, this invention relates to an aromatic polyimide microporous membrane.
一前記ポリイミド不溶性の有機溶媒100重量部およ゛
び・芳香族ポリイミドまたはポリアミック酸’ )以外
の耐熱性ポリマー0.01〜7重量部からなる耐熱性ポ
リマ′−希薄溶液を、塗布し。A dilute solution of a heat-resistant polymer consisting of 100 parts by weight of an organic solvent insoluble in the polyimide and 0.01 to 7 parts by weight of a heat-resistant polymer other than aromatic polyimide or polyamic acid is applied.
その塗布層を乾燥し溶媒を徐々に除去することを特徴と
する複合分離膜の製造法に関する。The present invention relates to a method for producing a composite separation membrane, which is characterized by drying the coating layer and gradually removing the solvent.
この発明の方法は・芳香族ポリイミド微多孔質膜に、前
記ポリイミド(またはポリアミック酸)以外の耐熱性ポ
リマーの希薄溶液を塗布し、その塗布層を乾燥して、ポ
リイミド微多孔質膜の表面に耐熱性ポリマー均質層(緻
密層)の極めて薄い層を形成するという単純な工程で耐
熱性の複合分離膜を製造するので、高性能の複合分離膜
i再現性よく安定的に製造できる新規な方法である。The method of this invention is to apply a dilute solution of a heat-resistant polymer other than the polyimide (or polyamic acid) to the aromatic polyimide microporous membrane, dry the coated layer, and apply it to the surface of the polyimide microporous membrane. A heat-resistant composite separation membrane is manufactured through a simple process of forming an extremely thin layer of a heat-resistant polymer homogeneous layer (dense layer), so it is a new method that can stably manufacture a high-performance composite separation membrane with good reproducibility. It is.
また、この発明の方法によって製造される複合分離膜は
、芳香族ポリイミドからなる多孔質層と耐熱性ポリマー
からなる均質層(緻密層)とで一体に形成されているの
でt優れた耐熱性と機−高強度とを有しておシ、シかも
、出発材料である芳香族ポリイミド微多孔質膜と比較し
て、ガス分離性能が著しく改善されるのでろって2例え
ば、水素と一酸化炭素との分離性能(水素と一酸化炭素
との透過度Pの比; PH!/ Pco )が前記微
多孔質膜の分離性能(PH27PCO)の4倍以上、特
に5倍以上であっで伽ガスの透過速度も大き′いのであ
る。In addition, the composite separation membrane produced by the method of the present invention has excellent heat resistance because it is integrally formed with a porous layer made of aromatic polyimide and a homogeneous layer (dense layer) made of heat-resistant polymer. The gas separation performance is significantly improved compared to the starting material aromatic polyimide microporous membrane, which has high strength and high strength, for example, hydrogen and monoxide. The separation performance with carbon (ratio of permeability P between hydrogen and carbon monoxide; PH!/Pco) is 4 times or more, especially 5 times or more, the separation performance (PH27PCO) of the microporous membrane. The permeation rate is also high.
以下、この発明の方法について、さらに詳しく説明する
。The method of the present invention will be explained in more detail below.
この発明の方法で使用する芳香族ポリイミド微多孔質膜
ハ、 一般式fN<::>R<::>N−R’−)(I
)(ただし、Rは芳香族テトラカルボン酸成分に係る
芳香族残基であり pt/は芳香族ジアミン成分に係る
芳香族残基である)で示される反復単位から微多孔質膜
でありp後述するガス透過テストにおいて1例えば、水
素ガスの透過度(PH2)が約I X 10〜5 X
10 crA/ctA ・Sec”c@Hgl好ましく
は5×10〜1X10ctVaA−eec−crnHg
であって、水素と一酸化炭素との透過度Pの比(PH2
/PC!O)が2〜25.好ましくは2.5〜20程度
であればよい。The aromatic polyimide microporous membrane used in the method of this invention has the general formula fN<::>R<::>N-R'-) (I
) (where, R is an aromatic residue related to the aromatic tetracarboxylic acid component, and pt/ is an aromatic residue related to the aromatic diamine component). In a gas permeation test, for example, hydrogen gas permeability (PH2) is about I x 10 to 5 x
10 crA/ctA ・Sec”c@Hgl Preferably 5×10 to 1×10ctVaA-eec-crnHg
, the ratio of permeability P between hydrogen and carbon monoxide (PH2
/PC! O) is 2-25. Preferably it is about 2.5 to 20.
前記の芳香族ポリイミド微多孔質膜は、芳香族テトラカ
ルボン酸成分と芳香族ジアミン成分とを重合して得られ
る芳香族ポリアミック酸あるいは芳香族ポリイミドを9
有機極性溶媒に均一に溶解した溶液をドープ液として使
用して、乾式製膜法あるいは湿式製膜法によって、製造
することができる。The aromatic polyimide microporous membrane described above is made of aromatic polyamic acid or aromatic polyimide obtained by polymerizing an aromatic tetracarboxylic acid component and an aromatic diamine component.
It can be produced by a dry film forming method or a wet film forming method using a solution uniformly dissolved in an organic polar solvent as a dope liquid.
この発明者らは、芳香族ポリイミド微多孔質膜の製造方
法について2種々の方法を、特願昭55−59472号
、特願昭56−54965号p特願昭56−54966
号および特願昭56−54967号として特許出願した
。The inventors have proposed two different methods for producing aromatic polyimide microporous membranes in Japanese Patent Application No. 55-59472 and Japanese Patent Application No. 54965-1983.
A patent application was filed as No. 56-54967 and Japanese Patent Application No. 56-54967.
それらの発明は、大略、芳香族テトラカルボン酸成分と
芳香族ジアミン成分とから重合反応で得られたポリアミ
ック酸、あるいはポリイミドが。These inventions generally involve polyamic acids or polyimides obtained through a polymerization reaction from an aromatic tetracarboxylic acid component and an aromatic diamine component.
各ポリマー可溶性の有機極性溶媒とその各ポリマー不溶
性の有機極性溶媒との特定の混合溶媒に。in a specific mixed solvent of each polymer-soluble organic polar solvent and its respective polymer-insoluble organic polar solvent.
適当なポリマニ濃度で均一に溶解しているポリマー組成
物を、製膜用のドープ液として使用して。A polymer composition uniformly dissolved at an appropriate polymer concentration is used as a dope solution for film formation.
そのドープ液の薄膜(平膜状、中空糸状)を形成し、加
熱乾燥による乾式法で、必要であればイミド環化を行い
、ポリイミド微多孔質膜を製造する方法である。In this method, a thin film (flat film shape, hollow fiber shape) of the dope liquid is formed, and a dry method is performed by heating and drying, and if necessary, imide cyclization is performed to produce a polyimide microporous membrane.
また、芳香族ポリイミド微多孔質膜は、芳香族テトラカ
ルボン酸成分と芳香族ジアミン成分トラ。In addition, the aromatic polyimide microporous membrane contains an aromatic tetracarboxylic acid component and an aromatic diamine component.
有機極性溶媒中、低温で重合して得られる芳香族ポリア
ミック酸または芳香族ポリイミドの均一な溶液をドープ
液として使用して、そのドープ液の薄膜(平膜状・中空
糸状)を形成しり特定の水。A homogeneous solution of aromatic polyamic acid or aromatic polyimide obtained by polymerization at low temperature in an organic polar solvent is used as a dope solution, and a thin film (flat film shape/hollow fiber shape) of the dope solution is formed. water.
低級アルコール系の凝固液を使用する湿式法でシボリア
ミック酸またはポリイミドの凝固膜を形成し、その凝固
膜を乾燥し、必要キあれば高温に加熱してポリマーをイ
ミド環化する方法で、製造することができる。Manufactured by forming a coagulated film of siboriamic acid or polyimide using a wet method using a lower alcohol-based coagulating liquid, drying the coagulated film, and if necessary, heating the polymer to a high temperature to imide cyclize the polymer. be able to.
前述の一般式(I)を構成することになる芳香族残基R
に係る芳香族テトラカルボン酸成分としてはp例えば+
313’、414’−ビフェニルテトラカルボン酸
。Aromatic residue R that will constitute the above general formula (I)
As the aromatic tetracarboxylic acid component related to p, for example, +
313',414'-biphenyltetracarboxylic acid.
2+3+314’−ビフェニルテトラカルボン酸y j
3<4,4’−ペンゾフエノンテトラ力ルポン酸j 2
,2−ビス(314−ジカルボキシフェニル)プロパン
ν ビス(3,4−ジカルボキシフェニル)メタン、ビ
ス(3,4−ジカルボキシフェニル)スルホン、ビス(
3,4−ジカルボキシフェニル)ニーデル、ビス(3,
4−ジカルボキシフェニル)チオニーデルtピロメリッ
ト酸、あるいはそれらの酸無水物、塩またはエステル化
誘導体を挙げることができる。2+3+314'-biphenyltetracarboxylic acid y j
3<4,4'-penzophenonetetraluponic acid j 2
, 2-bis(314-dicarboxyphenyl)propane ν bis(3,4-dicarboxyphenyl)methane, bis(3,4-dicarboxyphenyl)sulfone, bis(
3,4-dicarboxyphenyl)needle, bis(3,
Mention may be made of 4-dicarboxyphenyl)thionidel-t-pyromellitic acid, or acid anhydrides, salts, or esterified derivatives thereof.
基R′に係る芳香族ジアミン成分としては?例えばt4
.4′−ジアミノジフェニルエーテルl 3,3’−
’))1チル−4,4′−ジアミノジフェニルエーテル
* 3,3’−ジメトキシ−4,4′−ジアミノジフ
ェニルエーテルp j3’−ジアミノジフェニルエーテ
ル+3.4’−ジアミノジフェニルエーテルなどのジフ
ェニルエーテル系ジアミン、4,4′−ジアミノジフェ
ニルチオエーテル* 3,3’−ジメチル−4,4′
−ジアミノジフェニルチオエーテル# 3,3’−ジア
ミノジフェニルチオエーテルなどのジフェニルチオエー
テル系ジアミンs 4,4’−ジアミノベンゾフェノ
ンp 595’−ジメチル−4,4′−ジアミノベンゾ
フェノ石3.3′−ジアミノベンゾフェノンなどのベン
ゾフェノン系ジアミンy 4,4’−ジアミノジフェ
らルメタン、 3.3’−ジメトキシ−4,4′−ジア
ミ)ジフェニルメタン、 3.3’−ジアミノジフェニ
ルメタンなどのジフェニルメタン系ジアミン、2,2−
ビス−(4−アミノ7エ、ニル)プロパン、2,2−ビ
ス(6−アミノフェニル)プロパンなどのビスフェニル
プロパン系シアミン、 4.4’−ジアミノジフェニル
スルホン、 3.3’−ジ′アミノジフェニルスルホ
ンナトノシフェニルスルホン系ジアミン、ベンチジン。What about the aromatic diamine component related to group R'? For example t4
.. 4'-diaminodiphenyl ether l 3,3'-
')) 1 thyl-4,4'-diaminodiphenyl ether* 3,3'-dimethoxy-4,4'-diaminodiphenyl ether p j3'-diaminodiphenyl ether + 3.4'-Diphenyl ether diamines such as 4,4'-diaminodiphenyl ether '-Diaminodiphenylthioether* 3,3'-dimethyl-4,4'
-Diamino diphenyl thioether # Diphenyl thioether diamines such as 3,3'-diaminodiphenyl thioether 4,4'-diaminobenzophenone p 595'-dimethyl-4,4'-diaminobenzophenostone 3,3'-diaminobenzophenone, etc. benzophenone diamines such as 4,4'-diaminodipheralmethane, 3.3'-dimethoxy-4,4'-diami)diphenylmethane, and diphenylmethane diamines such as 3.3'-diaminodiphenylmethane, 2,2-
Bisphenylpropane-based cyamines such as bis-(4-amino-7ethyl)propane and 2,2-bis(6-aminophenyl)propane, 4.4'-diaminodiphenylsulfone, 3.3'-di'amino Diphenylsulfone natonosyphenylsulfone diamine, benzidine.
3.3′−ジメチルベンチジンl 3,3’−ジメトキ
シベ、ンチジンj 3,3’−ジアミノビフェニルな
どのビフェニル系ジアミン、または1 m + p
”−+ O−フェニレンジアミンなどを挙げることがで
きる。3.3'-dimethylbenzidine l 3,3'-dimethoxybe, thidine j 3,3'-diaminobiphenyl, or other biphenyl diamines, or 1 m + p
"-+ O-phenylenediamine, etc. can be mentioned.
前述の芳香族ポリイミド微多孔質膜の製造法において、
芳香族テトラカルボン酸成分として、ビフェニルテトラ
カルボン酸、またはその酸無水物。In the method for producing the aromatic polyimide microporous membrane described above,
Biphenyltetracarboxylic acid or its acid anhydride as the aromatic tetracarboxylic acid component.
6るいはベンゾフェノンテトラカルボン酸、またはその
酸無水物、を使用し、芳香族ジアミン成分として、2個
のベンゼン核を有するジアミン化合物を使用してt両成
分を略等モル重合して得られた芳香族ポリイミドは、フ
ェノール系溶媒9例えばフェノ−ルミクレゾール、キシ
レノール、ハロゲン化フェノール、ノ・ロゲン化クレゾ
ールなどに溶解するので、これらの溶液を製膜用ドープ
液として使用し、その薄膜を凝固液で凝固して多孔質膜
を製造で′きるし、あるいは、そのポリイミドを前記フ
ェノール系溶媒とポリイミド不溶性の芳香族系溶媒との
混合溶媒に溶解したポリイミド溶液を製膜用のドープ液
として使用して、微多孔質膜を乾式法で製造することが
できる。6 or benzophenone tetracarboxylic acid, or its acid anhydride, and a diamine compound having two benzene nuclei as the aromatic diamine component, obtained by polymerizing approximately equimolar amounts of both components. Aromatic polyimides are soluble in phenolic solvents9 such as phenolmicresol, xylenol, halogenated phenols, and non-halogenated cresols, so these solutions are used as dope solutions for film formation, and the thin film is made into a coagulating solution. Alternatively, a polyimide solution prepared by dissolving the polyimide in a mixed solvent of the above-mentioned phenolic solvent and an aromatic solvent insoluble in polyimide is used as a dope solution for film formation. A microporous membrane can be produced by a dry method.
また2通常、有機極性溶媒に実質的に溶解することがな
い芳香族ポリイミドでは、その芳香族ポリイミドの前駆
体であるポリアミック酸をν適当な有機極性溶媒に均一
に溶解して得られるポリアミック酸の溶液金製膜用のド
ープ液として使用してt微多孔質膜を製造することがで
きる。In addition, 2. Normally, aromatic polyimides that are not substantially soluble in organic polar solvents can be obtained by uniformly dissolving polyamic acid, which is a precursor of the aromatic polyimide, in a suitable organic polar solvent. It can be used as a dope solution for solution gold film formation to produce a microporous film.
この発明の方法で使用する芳香族ポリイミド微多孔質膜
は、少なくとも200°Cの温度においてガス成分の透
過性能が悪化することがなく、シかも約100Kg/c
rA程度までの圧力でガス透過性能が悪化することがな
いものであることが好ましい。The aromatic polyimide microporous membrane used in the method of this invention does not deteriorate in permeability of gas components at a temperature of at least 200°C, and has a permeability of about 100 kg/cm.
It is preferable that the gas permeability is not deteriorated at pressures up to about rA.
前記芳香族ポリイミド微多孔質膜は、充分に使用に耐え
得る機械的強度を示すような膜厚であればどのような膜
厚のものであってもよいがり特にり2〜500μ、さら
に好ましくは5〜300μ程度であることが好ましい。The aromatic polyimide microporous membrane may have any thickness as long as it exhibits sufficient mechanical strength to withstand use, particularly from 2 to 500 μm, more preferably from 2 to 500 μm. The thickness is preferably about 5 to 300μ.
この発明の方法において、耐熱性ポリマー希薄溶液は、
芳香族ボ1yイミド微多孔質膜を形成しているポリイミ
ド不溶性の有機溶媒100重量部。In the method of this invention, the dilute solution of heat-resistant polymer is
100 parts by weight of an organic solvent insoluble in the polyimide forming the aromatic boimide microporous membrane.
および、芳香族ポリイミドまたはそのポリイミドの前駆
体である芳香族ポリアミック酸以外の耐熱性ポリマー0
.01〜7重量部、好ましくは0.05〜5重量部から
なる耐熱性ポリマー希薄溶液である。and 0 heat-resistant polymers other than aromatic polyimide or aromatic polyamic acid which is a precursor of the polyimide.
.. 0.01 to 7 parts by weight, preferably 0.05 to 5 parts by weight.
前記耐熱性ポリマーは、約100’C以下の温度で軟化
してしまうことがなく、ガス分離性能を有するものであ
って、適当な有機溶媒(芳香族ポリイミド不溶性の溶媒
)に均一に0.01〜5N量チの濃度で溶解しうるもの
であればどのような種類のものであってもよい。The heat-resistant polymer does not soften at temperatures below about 100'C, has gas separation performance, and is uniformly dispersed in a suitable organic solvent (a solvent in which the aromatic polyimide is insoluble) at 0.01°C. Any type of material may be used as long as it can be dissolved at a concentration of ~5N.
その耐熱性ポリマーとしては1例えば、ポリ(2,6−
シフエニルフエニレンオキシド)pポリ(2,,6−シ
メチルフエニレンオキシド)、ポリスルホン2シリコー
ンゴム(ポリジメチルシロキサン)Iポリ(4−ビニル
ヒリジン)、1.2−シンジオククチックポリプタジェ
ンなどを好適に挙げることかできる。Examples of the heat-resistant polymer include poly(2,6-
Siphenylphenylene oxide) p poly(2,,6-dimethylphenylene oxide), polysulfone 2 silicone rubber (polydimethylsiloxane) I poly(4-vinylhyridine), 1,2-syndiocuctic polyptadiene, etc. It is possible to mention it suitably.
前記の耐熱性ポリマー希薄溶液に使用する有機溶媒は、
芳香族ポリイミドを6重量%以上、特に2重量%以上溶
解することがない溶媒であって。The organic solvent used in the heat-resistant polymer dilute solution is
A solvent that does not dissolve aromatic polyimide in an amount of 6% by weight or more, particularly 2% by weight or more.
前述の耐熱性ポリマーを0.01〜5x量チ溶解しうる
ものであればどのような種類の有機溶媒であってもよい
。この発明では、前記有機溶媒は、融点が100°C以
下、特に80゛C以下であり、沸点(常圧)が600°
C以下、特に250°C以下、さらに好ましくは200
°C以下であることが好ましい。Any type of organic solvent may be used as long as it is capable of dissolving 0.01 to 5x the above-mentioned heat-resistant polymer. In this invention, the organic solvent has a melting point of 100°C or less, particularly 80°C or less, and a boiling point (normal pressure) of 600°C.
C or less, especially 250°C or less, more preferably 200°C or less
The temperature is preferably below °C.
前記溶媒としては1例えば、ベンゼン、トルエン、キシ
レン、ハロゲン化ベンゼン、ハロゲンイヒトルエン、ハ
ロゲン化キシレン、ハロゲン化ナフタリンなどの芳香族
炭化水素またはそのハロゲン化物、メチルアルコール、
エチルアルコール、フロビルアルコール、メチルアルコ
ー)L/、エチレングリコール、プロピレングリコール
などの低級アルコールマタハグリコール、アセトン、メ
チルエチルケトン、メチル・イソブチルケト/、エチル
・イソブチルケト/、シクロヘキサンなどのケトン化合
物−n−へキサン、n−ペンタン、n−オクタン、n−
ノナン、シクロヘキサンなどの飽和炭化水素+ N、
N−ジメチルアセトアミドe N、N−ジエチルアセト
アミドr N+N−ジメチルホルムアミド、 N、N
−ジエチルホルムアミドなどのアミド化合物、ジメチル
スルホキシド、ジエチルスルホキシドなどのスルホキシ
ド化合物などを挙げることができる。Examples of the solvent include aromatic hydrocarbons or their halides such as benzene, toluene, xylene, halogenated benzene, halogenated toluene, halogenated xylene, and halogenated naphthalene, methyl alcohol,
Ethyl alcohol, furoyl alcohol, methyl alcohol) L/, lower alcohols such as ethylene glycol and propylene glycol, acetone, methyl ethyl ketone, methyl isobutyl keto/, ethyl isobutyl keto/, and ketone compounds such as cyclohexane -n- xane, n-pentane, n-octane, n-
Saturated hydrocarbons such as nonane and cyclohexane + N,
N-dimethylacetamide e N,N-diethylacetamide r N+N-dimethylformamide, N,N
-Amide compounds such as diethylformamide; sulfoxide compounds such as dimethyl sulfoxide and diethyl sulfoxide; and the like.
この発明め方法において、前記耐熱性ポリマー希薄溶液
は、耐熱性ポリマー濃度が余シ小さくなり過ぎると芳香
族ポリイミド微多孔質膜の表面に全面的に安定した耐漏
性ポリマー均質層を形成することができなくなりt最終
的に得られる分離膜のガス分離性能が改善されないので
適当ではなく。In this inventive method, the heat-resistant polymer dilute solution may not form a stable leak-proof polymer homogeneous layer on the entire surface of the aromatic polyimide microporous membrane when the heat-resistant polymer concentration becomes too small. This is not appropriate because the gas separation performance of the separation membrane ultimately obtained will not be improved.
一方針熱性ポリマー濃度が余りに大きくなり過ぎると、
ポリマー均質層が厚くなってしまい、最終的に得られる
分離膜がガス透過性能の悪化したものとなるので適当で
はない。On the other hand, if the needle thermophilic polymer concentration becomes too large,
This is not suitable because the polymer homogeneous layer becomes thick and the ultimately obtained separation membrane has poor gas permeability.
前述の耐熱性ポリマー希薄溶液は、余り粘稠でないもの
が好ましく、その回転粘度(30°C)が1〜50万セ
ンチポアズ、特に5〜1万センチポアズ程度であればよ
い。The above-mentioned dilute solution of the heat-resistant polymer is preferably not very viscous, as long as its rotational viscosity (at 30° C.) is about 1 to 500,000 centipoise, particularly about 50,000 to 10,000 centipoise.
この発明では1芳香族ポリイミド微多孔質膜の表面に耐
熱性ポリマー希薄溶液を塗布する温度は・前記希薄溶液
の溶媒が蒸発して急速になくなづてしまわない温度であ
って、希薄溶液が一部固化したシ、その各成分”(ポリ
マー)が析出しない温度であればよく2例えば、0〜1
00°C9特に5〜80°C程度であればよい。In this invention, the temperature at which the dilute solution of the heat-resistant polymer is applied to the surface of the aromatic polyimide microporous membrane is: - A temperature at which the solvent of the dilute solution does not evaporate and disappear rapidly; For example, 0 to 1 may be used as long as the temperature does not precipitate the partially solidified polymer.
00°C9, especially about 5 to 80°C.
前記耐熱性ポリマー希薄溶液を微多孔質膜に塗布する方
法は2種々の方法で塗布することができるが2例えば、
微多孔質膜の表面に希薄溶液を流延して均一な厚さで塗
布する方法、微多孔質膜の表面に希薄溶液をスプレー(
噴霧)して塗布する方法、微多孔質膜をポリマー希薄溶
液で濡らされたロールと接触させて塗布する方法、さら
に微多孔質膜を希薄溶液に浸漬して塗布する方法などを
挙げることができる。The dilute solution of the heat-resistant polymer can be applied to the microporous membrane in two different ways, for example:
A method of casting a dilute solution onto the surface of a microporous membrane to coat it with a uniform thickness, and a method of spraying a dilute solution onto the surface of a microporous membrane (
Examples include a method of applying by spraying), a method of applying by contacting a microporous membrane with a roll wetted with a dilute polymer solution, and a method of applying by immersing the microporous membrane in a dilute solution. .
前述のようにして微多孔質膜の表面に塗布された希薄溶
液の塗布層の厚さは、約0.1〜200μ。The thickness of the dilute solution coating layer applied to the surface of the microporous membrane as described above is about 0.1 to 200 μm.
特に1〜100μ、さらに好ましくは2〜80μ程度で
あることが好ましい。In particular, it is preferably about 1 to 100μ, more preferably about 2 to 80μ.
なお、前述の希薄溶液の塗布に先立って、芳香族ポリイ
ミド微多孔質膜を、低級アルコール、低分子量ケトンp
ベンゼン系溶媒、低分子量の脂肪酸エステル、脂肪族炭
化水素、脂環族炭化水素などの溶媒に、浸漬させて、膜
の表面のみの溶媒を除去し、それらの溶媒を内部に含浸
させた後、前述の塗布操作を行うと、耐熱性ポリマー希
薄溶液が微多孔質膜の表面層にだけ薄く塗布できるので
好適である。In addition, prior to applying the dilute solution mentioned above, the aromatic polyimide microporous membrane was coated with lower alcohol and low molecular weight ketone p.
After immersing the membrane in a solvent such as a benzene solvent, a low molecular weight fatty acid ester, an aliphatic hydrocarbon, or an alicyclic hydrocarbon to remove the solvent only from the surface of the membrane and impregnating the inside with the solvent, The above-described coating operation is preferred because the dilute solution of the heat-resistant polymer can be applied thinly only to the surface layer of the microporous membrane.
この発明の方法において、前述のようにして。In the method of this invention, as described above.
芳香族ポリイミド微多孔質膜の表面に、耐熱性ポリマー
希薄溶液を塗布し、その塗布層を乾燥し溶媒を徐々に除
去することを行って、耐熱性の複合分離膜を製造するの
である。A heat-resistant composite separation membrane is manufactured by applying a dilute solution of a heat-resistant polymer to the surface of a microporous aromatic polyimide membrane, drying the applied layer, and gradually removing the solvent.
前述の塗布層の乾燥は26〜600°C2特に25〜2
50°Cの加温または加熱下で、不活性気体の流通下に
行うことが好適であり、さらに前述の塗布層の乾燥によ
って溶媒を完全に除去じてしまう必要は力<、溶媒の一
部(微量)の残留があっても塗布層が凝固または固化し
てガス分離膜として使用できる状態であればよい。The above-mentioned coating layer is dried at 26-600°C2, especially at 25-200°C.
It is preferable to carry out the heating at 50°C or under heating under the flow of an inert gas, and it is not necessary to completely remove the solvent by drying the coating layer as described above. Even if a small amount remains, it is acceptable as long as the coating layer is solidified or solidified and can be used as a gas separation membrane.
この発明において塗布層の乾燥によって溶媒を徐々に除
去するため蝉は、乾燥を低温から高温へ段階的に行うこ
とが好ましく9例えば、20〜80°C1特に25〜6
0°C程度の温度で、不活性気体(例えば、乾燥空気、
乾燥窒素ガスなど)の流通下に、0.1〜50時間、特
に0.5〜30時間。In this invention, in order to gradually remove the solvent by drying the coating layer, it is preferable to dry the cicada in stages from a low temperature to a high temperature.
At a temperature of about 0°C, inert gas (e.g. dry air,
dry nitrogen gas, etc.) for 0.1 to 50 hours, especially 0.5 to 30 hours.
風乾を行い2次いで、80〜150°C2特に85〜1
40°C程度の温度で0.1〜10時間、特に0.2〜
5時間、加熱乾燥し、さらに必要であれば。Air dry at 80-150°C, especially at 85-1
0.1 to 10 hours, especially 0.2 to 10 hours at a temperature of about 40°C
Heat and dry for 5 hours, if needed.
150〜600°C1特に160〜250°Cの温度で
t o、1〜20時間、特に0.2〜10時間程度。at a temperature of 150 to 600°C, especially 160 to 250°C, for about 1 to 20 hours, especially about 0.2 to 10 hours.
加熱乾燥することが好ましい。この発明の方法では、塗
布層の乾燥を、上述以上にさらに多段階で昇温しながら
乾燥することができる。It is preferable to dry by heating. In the method of the present invention, the coating layer can be dried while increasing the temperature in more steps than described above.
この発明の方法によって製造されるポリイミド複合分離
膜は、芳香族ポリイミド多孔質膜(厚さ2〜500μ9
%に5〜′500μ)と、ポリイミド均質層(厚さ5μ
以下、特に1μ以下)とが一体に接合されている複合分
離膜であり、1合分離膜全体が芳香族ポリイミドという
耐熱性の素材で構成されているので、ガス分離に用いる
際の使用温度が常温から約200°Cまでと広範囲であ
る。The polyimide composite separation membrane produced by the method of this invention is an aromatic polyimide porous membrane (thickness 2 to 500 μ9
% to 500μ) and a polyimide homogeneous layer (thickness 5μ
This is a composite separation membrane in which the membranes (hereinafter referred to as 1μ or less) are integrally joined together, and the entire one-coat separation membrane is made of a heat-resistant material called aromatic polyimide, so the operating temperature when used for gas separation is It has a wide range from room temperature to about 200°C.
一方、この発明の方法で製造される芳香族ポリイミド複
合分離膜は、ガス透過テストにおいて。On the other hand, the aromatic polyimide composite separation membrane produced by the method of the present invention showed excellent results in gas permeation tests.
優れたガス透過速度とガス分離性能とを同時に有してお
シ2例えば、水素ガス透過度(PHz )が5 X 1
0−’ ah/crll ・BeC・cmHg以上であ
って、水素と一酸化炭素との分離性能(PH2/POO
で示す)が25以上と高いのである。It has excellent gas permeation rate and gas separation performance at the same time.For example, hydrogen gas permeability (PHZ) is 5 x 1.
0-' ah/crll ・BeC・cmHg or more, and the separation performance between hydrogen and carbon monoxide (PH2/POO
) is high at 25 or more.
以下2次に参考例、実施例を示す。Reference examples and examples will be shown below.
実施例において、ガス透過テストは2面積14.65−
のステンレス製セルに分離膜を設置し、水素。In the example, the gas permeation test was performed on two areas 14.65-
A separation membrane is installed in a stainless steel cell to remove hydrogen.
−酸化炭素を各々065〜1にり/cIAに加圧して2
分離膜を透過して来るガス量を流量計で測定した。- Carbon oxide is pressurized to 065 to 1/cIA, respectively, to 2
The amount of gas passing through the separation membrane was measured with a flowmeter.
各ガスの透過度は2次の式で算出した。The permeability of each gas was calculated using the following equation.
なお2分離膜の分離性能は、水素の透過度(PHz)と
−酸化炭素の透過度(pco)との比(PH2/POO
)で示す。2 The separation performance of the separation membrane is determined by the ratio of hydrogen permeability (PHz) to -carbon oxide permeability (pco) (PH2/POO
).
参考例1
3;3’、4.4’−ピフエ巨ルテトラカルボン酸二無
水物40 mmotl a、4’−ジアミノジフェニ
ルエーテル40mm0Lおよびパラクロルフェノール1
65tをp攪拌機と窒素ガス導入管とが付設されたセノ
くラブルフラスコに入れて、窒素ガスを流通しながら1
反応液を常温から180°Cまで約50分間で昇温し、
さらにその反応液を180°Cに8時間保持して9重合
およびイミド環化を1段で行って粘稠なポリイミド溶液
を得た。Reference Example 1 3; 3', 4'-Pifue megatetracarboxylic dianhydride 40 mmotl a, 4'-diaminodiphenyl ether 40 mm0L and parachlorophenol 1
65 tons was placed in a rubber flask equipped with a stirrer and a nitrogen gas inlet pipe, and the mixture was heated for 1 hour while flowing nitrogen gas.
The reaction solution was heated from room temperature to 180°C in about 50 minutes,
Further, the reaction solution was held at 180°C for 8 hours to perform 9 polymerization and imide cyclization in one stage to obtain a viscous polyimide solution.
そのポリイミド溶液は、ポリマー濃度が10重量%であ
り、ポリマーのイミド化率が95チ以上であシ、さらに
ポリマーの対数粘度(50°C20,5f/100罰パ
ラクロルフエノール)が2.2であった。The polyimide solution has a polymer concentration of 10% by weight, a polymer imidization rate of 95% or more, and a polymer logarithmic viscosity (50°C 20,5f/100% parachlorophenol) of 2.2. there were.
前述のようにして製造したポリイミド溶液を。Polyimide solution prepared as described above.
ガラス板上に25°Cで流延し厚さ0.2■の液状の薄
膜を形成し、その液状の薄膜を室温(25°C)でメタ
ノール凝固液に約20時間浸漬し、凝固させて凝固膜を
形成し、その凝固膜をメタノール凝固液から取シ出し、
さらにその凝固膜をn−へキサン中に25°Cで20時
間浸漬した後、空気流通下、25°Cで5時間風乾し1
次いで100°C1時間乾燥し、さらに200°Cで6
時間加熱処理して。A thin liquid film with a thickness of 0.2 cm was formed by casting on a glass plate at 25°C, and the liquid thin film was immersed in a methanol coagulation solution at room temperature (25°C) for about 20 hours to solidify it. Form a coagulated film, remove the coagulated film from the methanol coagulation solution,
Further, the coagulated film was immersed in n-hexane at 25°C for 20 hours, and then air-dried for 5 hours at 25°C under air circulation.
Next, dry at 100°C for 1 hour, and then dry at 200°C for 6 hours.
Heat treated for some time.
ポリイミド多孔質膜を得た。A polyimide porous membrane was obtained.
そのポリイミド多孔質膜は、膜厚が約25μであり、2
5°Cにおけるガス透過テストによる水素の透過度(P
H2)が7.1文10′″” ” / m” 8 e
Q 、c@11 gであり、水素と一酸化炭素との透過
度の比(PHa/pao )が2.8であった。The polyimide porous membrane has a thickness of about 25 μm and 2
Hydrogen permeability (P) by gas permeation test at 5°C
H2) is 7.1 sentences 10′″” ” / m” 8 e
Q, c@11 g, and the hydrogen to carbon monoxide permeability ratio (PHa/pao) was 2.8.
実施例1
参考例1で得られた芳香族ポリイミド微多孔質膜ヲ、ポ
リ(2,6°−ビフェニルフェニレンオキサイド〔対数
粘度(25°C,0,5r/100ジクロロホルム)が
0.93である〕が1重量%の濃度でベンゼンに溶解し
ている耐熱性ポリマー希薄溶液に、25°Cで20分間
浸漬して、微多孔質膜に前記希薄溶液を塗布し、その塗
布膜を、空気流通下に、25°Cで15時間、風乾して
、複合分離膜を製造した。Example 1 The aromatic polyimide microporous membrane obtained in Reference Example 1 was made of poly(2,6°-biphenylphenylene oxide [logarithmic viscosity (25°C, 0.5r/100 dichloroform) of 0.93]. The microporous membrane was immersed in a dilute solution of a heat-resistant polymer dissolved in benzene at a concentration of 1% by weight at 25°C for 20 minutes, the dilute solution was applied to the microporous membrane, and the coated membrane was exposed to air. A composite separation membrane was manufactured by air drying at 25° C. for 15 hours under continuous flow.
その複合分離膜について、第1表に示す温度でガス透過
テストを行った結果を第1表に示す。Table 1 shows the results of a gas permeation test conducted on the composite separation membrane at the temperatures shown in Table 1.
なお、上記複合分離膜に100°Cで10時間−酸化炭
素を流通させ続けた後に、再びガス透過テストを行った
が、ガス分離性能の低下はなかった。Note that after continuing to flow carbon oxide through the composite separation membrane at 100° C. for 10 hours, a gas permeation test was conducted again, and there was no decrease in gas separation performance.
実施例2
希薄溶液として、シリコンゴム(ダウ・コーニング社製
・商品名;シルガード184)が1.1重量%の濃度で
ベンゼンに溶解している希薄溶液を使用したほかは、実
施例1と同様にして、複合分離膜を製造した。Example 2 Same as Example 1 except that a dilute solution in which silicone rubber (manufactured by Dow Corning, trade name: Sylgard 184) was dissolved in benzene at a concentration of 1.1% by weight was used as the dilute solution. A composite separation membrane was manufactured.
その複合分離膜のガス透過テストの結果を第1表に示す
。Table 1 shows the results of the gas permeation test for the composite separation membrane.
なお、その複合分離膜を、98°Cで一酸化炭素を10
時間流した後ガス透過テストを行ったが。In addition, the composite separation membrane was heated to 98°C with 10% carbon monoxide.
I did a gas permeation test after running it for a while.
ガス分離性能の低下はなかつ泥。There is no decrease in gas separation performance.
参考例2
ポリスルホン(ニー−シー・シー社製、ボ!jスールホ
ンP−35−00)の25重量%ジメチルホルムアミド
溶液を、ガラス板上に25°Cで流延し厚さ0.211
1IIの液状の薄膜を形成し、その液状の薄膜を、濃度
2重量%のジメチルホルムアミドと濃度0.5重量−の
2ウリルサルフエートナトリウム塩とを含む水溶液の凝
固液に、25°Cで20時間浸漬し、凝固させ、その凝
固膜を水で洗浄した後。Reference Example 2 A 25% by weight dimethylformamide solution of polysulfone (manufactured by NCC Co., Ltd., Bo!j Sulfone P-35-00) was cast onto a glass plate at 25°C to a thickness of 0.211 mm.
1II was formed, and the liquid thin film was added to a coagulating solution of an aqueous solution containing dimethylformamide at a concentration of 2% by weight and diuryl sulfate sodium salt at a concentration of 0.5% by weight at 25°C for 20 hours. After soaking for an hour, coagulating, and washing the coagulated film with water.
25°Cで、空気流通下に20時間風乾し、さらに10
0°Cで30分間加熱処理してpポリスルホン多孔質膜
を製造した。Air dry at 25°C for 20 hours under air circulation, then dry for another 10 hours.
A p-polysulfone porous membrane was prepared by heat treatment at 0°C for 30 minutes.
そのポリスルホン多孔質膜は、25°Cにおいて水素透
過度PH,が6J X 10 cIA/crA・ee
c・3Hgであり、水素と一酸化炭素との透過度の比(
paw/PCO)が3.7であった〇
比較例1
前記ポリスルホン多孔質膜(参考例2)を、実施例で使
用したシリコンゴムが1重量%の濃度エリグロインに均
一に溶解している希薄溶液に。The polysulfone porous membrane has a hydrogen permeability PH of 6J x 10 cIA/crA・ee at 25°C.
c・3Hg, and the ratio of permeability between hydrogen and carbon monoxide (
paw/PCO) was 3.7 Comparative Example 1 The polysulfone porous membrane (Reference Example 2) was prepared in a dilute solution in which the silicone rubber used in the example was uniformly dissolved in erigroin at a concentration of 1% by weight. To.
25°Cで20分間浸漬して、多孔質膜に希薄溶、液を
塗布し、その塗布膜を、25°Cで空気流通下に約15
分間、風乾して、複合分離膜を製造した。The dilute solution is applied to the porous membrane by soaking at 25°C for 20 minutes, and the coated film is soaked at 25°C for about 15 minutes under air circulation.
A composite separation membrane was prepared by air drying for 1 minute.
その複合分離膜のガス透過テストの結果を第1表に示す
。Table 1 shows the results of the gas permeation test for the composite separation membrane.
なお、その複合分離膜に・98°Cで10時間−酸化炭
素を流通させ続けた後に、再びガス透過テストを行った
結果、水素透過度PH,が2.I X 10cIA/−
・sec”cm)Ig であり、水素と一酸化炭素と
の透過度の比(P)l、/PCO)が9.5であった。In addition, after continuing to flow carbon oxide through the composite separation membrane at 98°C for 10 hours, a gas permeation test was conducted again, and as a result, the hydrogen permeability PH was 2. IX 10cIA/-
・sec"cm)Ig, and the hydrogen to carbon monoxide permeability ratio (P)l,/PCO) was 9.5.
第 1 表
実施例3
希薄溶液として、ポリ−4−ビニルピリジン(平均分子
量約10万)が4.7重量−の濃度でメタノールに均一
に溶解している希薄溶液を使用したほかは、実施例1と
同様にして、複合分離膜を製造した。その複合分離膜は
、25°COガス透過テストの結果、水素透過度がi、
o x 1o−’ aA/−・sec’m)Ig で
あシ、水素と一酸化炭素との透過度の比(PH2/PO
O)が23であって、100°Cまでその性能がほとん
ど変わらなかった。Table 1 Example 3 Example 3 except that a dilute solution in which poly-4-vinylpyridine (average molecular weight approximately 100,000) was uniformly dissolved in methanol at a concentration of 4.7% by weight was used. A composite separation membrane was manufactured in the same manner as in Example 1. As a result of the 25° CO gas permeation test, the composite separation membrane showed a hydrogen permeability of i,
ox 1o-'aA/-・sec'm)Ig, hydrogen to carbon monoxide permeability ratio (PH2/PO
O) was 23, and its performance remained almost unchanged up to 100°C.
特許出願人 宇部興産株式会社Patent applicant Ube Industries Co., Ltd.
Claims (1)
芳香族ポリイミドまたはポリアミック酸以外の耐熱性ポ
リマー0.01〜7重量部からなる耐熱性ポリマー希薄
溶液を、塗布し。 その塗布層を乾燥し溶媒を徐々に除去することを特徴と
する複合分離膜の製造法。[Claims] A microporous aromatic polyimide membrane. 100 parts by weight of the polyimide-insoluble organic solvent;
A dilute solution of a heat-resistant polymer consisting of 0.01 to 7 parts by weight of a heat-resistant polymer other than aromatic polyimide or polyamic acid is applied. A method for producing a composite separation membrane characterized by drying the coating layer and gradually removing the solvent.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP56105620A JPS588514A (en) | 1981-07-08 | 1981-07-08 | Preparation of composite separation film |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP56105620A JPS588514A (en) | 1981-07-08 | 1981-07-08 | Preparation of composite separation film |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS588514A true JPS588514A (en) | 1983-01-18 |
JPS6153090B2 JPS6153090B2 (en) | 1986-11-15 |
Family
ID=14412530
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP56105620A Granted JPS588514A (en) | 1981-07-08 | 1981-07-08 | Preparation of composite separation film |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS588514A (en) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5955313A (en) * | 1982-09-22 | 1984-03-30 | Agency Of Ind Science & Technol | Production of composite separation membrane |
JPS5955306A (en) * | 1982-09-22 | 1984-03-30 | Agency Of Ind Science & Technol | Preparation of composite separation membrane |
JPS59225705A (en) * | 1983-06-07 | 1984-12-18 | Nitto Electric Ind Co Ltd | Composite membrane and preparation thereof |
JPS6094106A (en) * | 1983-10-27 | 1985-05-27 | Nitto Electric Ind Co Ltd | Manufacture of compound membrane |
JPH0736193U (en) * | 1993-12-20 | 1995-07-04 | ヤマハ株式会社 | Woodwind key mechanism |
ES2137112A1 (en) * | 1997-12-26 | 1999-12-01 | Consejo Superior Investigacion | Process for preparing asymmetric carbon membranes |
US7811359B2 (en) | 2007-01-18 | 2010-10-12 | General Electric Company | Composite membrane for separation of carbon dioxide |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62240185A (en) * | 1986-04-14 | 1987-10-20 | Mitsubishi Electric Corp | Laser beam processing method |
JPH02108490A (en) * | 1988-10-14 | 1990-04-20 | Komatsu Ltd | Laser beam machining method |
JPH034393U (en) * | 1989-06-06 | 1991-01-17 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4945152A (en) * | 1972-07-20 | 1974-04-30 | ||
US3822202A (en) * | 1972-07-20 | 1974-07-02 | Du Pont | Heat treatment of membranes of selected polyimides,polyesters and polyamides |
US4071590A (en) * | 1974-11-02 | 1978-01-31 | Forschungsinstitute Bergof Gmbh | Composite asymmetrical membranes |
JPS5386684A (en) * | 1976-11-15 | 1978-07-31 | Monsanto Co | Multiicomponent membrane for gas separation |
US4240914A (en) * | 1977-11-18 | 1980-12-23 | Nitto Electric Industrial Co., Ltd. | Selective permeable membrane and process for preparing the same |
-
1981
- 1981-07-08 JP JP56105620A patent/JPS588514A/en active Granted
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4945152A (en) * | 1972-07-20 | 1974-04-30 | ||
US3822202A (en) * | 1972-07-20 | 1974-07-02 | Du Pont | Heat treatment of membranes of selected polyimides,polyesters and polyamides |
US4071590A (en) * | 1974-11-02 | 1978-01-31 | Forschungsinstitute Bergof Gmbh | Composite asymmetrical membranes |
JPS5386684A (en) * | 1976-11-15 | 1978-07-31 | Monsanto Co | Multiicomponent membrane for gas separation |
US4240914A (en) * | 1977-11-18 | 1980-12-23 | Nitto Electric Industrial Co., Ltd. | Selective permeable membrane and process for preparing the same |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5955313A (en) * | 1982-09-22 | 1984-03-30 | Agency Of Ind Science & Technol | Production of composite separation membrane |
JPS5955306A (en) * | 1982-09-22 | 1984-03-30 | Agency Of Ind Science & Technol | Preparation of composite separation membrane |
JPS6254043B2 (en) * | 1982-09-22 | 1987-11-13 | Kogyo Gijutsuin | |
JPS6321521B2 (en) * | 1982-09-22 | 1988-05-07 | Kogyo Gijutsuin | |
JPS59225705A (en) * | 1983-06-07 | 1984-12-18 | Nitto Electric Ind Co Ltd | Composite membrane and preparation thereof |
JPH0323208B2 (en) * | 1983-06-07 | 1991-03-28 | Nitto Denko Corp | |
JPS6094106A (en) * | 1983-10-27 | 1985-05-27 | Nitto Electric Ind Co Ltd | Manufacture of compound membrane |
JPH0317533B2 (en) * | 1983-10-27 | 1991-03-08 | Nitto Denko Corp | |
JPH0736193U (en) * | 1993-12-20 | 1995-07-04 | ヤマハ株式会社 | Woodwind key mechanism |
ES2137112A1 (en) * | 1997-12-26 | 1999-12-01 | Consejo Superior Investigacion | Process for preparing asymmetric carbon membranes |
US7811359B2 (en) | 2007-01-18 | 2010-10-12 | General Electric Company | Composite membrane for separation of carbon dioxide |
Also Published As
Publication number | Publication date |
---|---|
JPS6153090B2 (en) | 1986-11-15 |
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