JPS5881069U - Solder blotting device - Google Patents
Solder blotting deviceInfo
- Publication number
- JPS5881069U JPS5881069U JP17490781U JP17490781U JPS5881069U JP S5881069 U JPS5881069 U JP S5881069U JP 17490781 U JP17490781 U JP 17490781U JP 17490781 U JP17490781 U JP 17490781U JP S5881069 U JPS5881069 U JP S5881069U
- Authority
- JP
- Japan
- Prior art keywords
- solder
- suction
- suction nozzle
- tip
- opened
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来の吸込ノズルを取付けた半田吸取装置を示
す一部縦断側面図、第２図は板状端子群を例示する斜視
図、第３図は従来装置による場合の吸取状況を示す図、
第４図は本考案！と係る装置の要部を示す具体例の縦断
面図、第５図は第４図の左側面図、第６図は本考案に係
る装置の使用状態を示す図である。
１・・・・・・本体、４・・・・・・真空吸引スイッチ
、６・・・・・・タンク、７・・・・・・発熱体、８・
・・・・・加熱芯、１２・・・・・・吸込ノズル、１３
・・・・・・先端フラット面、１４・・・・・・半田吸
込孔、１５・・・・・・平坦面、１６・・・・・・半田
吸込孔。Fig. 1 is a partially longitudinal side view showing a conventional solder suction device equipped with a suction nozzle, Fig. 2 is a perspective view illustrating a group of plate terminals, and Fig. 3 is a diagram showing a suction situation using the conventional device. ,
Figure 4 is this invention! FIG. 5 is a left side view of FIG. 4, and FIG. 6 is a diagram showing the device according to the present invention in use. 1...Body, 4...Vacuum suction switch, 6...Tank, 7...Heating element, 8...
... Heating core, 12 ... Suction nozzle, 13
...Flat surface at the tip, 14 ... Solder suction hole, 15 ... Flat surface, 16 ... Solder suction hole.
Claims (2)
の溶融半田をスイッチ操作で吸込ノズルの半田吸込孔か
ら内部の真空タンクへ吸引するようにした装置において
、吸込ノズル先端部に先端へ開口する１個の半田吸込孔
を形成すると共に先端部両側へ開口する２個の半田吸込
孔を形成したことを特徴とする半田吸取装置。(1) In a device that melts solder with a heated suction nozzle and sucks the molten solder from the solder suction hole of the suction nozzle into an internal vacuum tank by operating a switch, an opening is opened at the tip of the suction nozzle. A solder sucking device characterized in that one solder suction hole is formed and two solder suction holes opening on both sides of the tip are formed.
ズルの側周面を１８０度の対向位置で各々削り取ること
により形成された平坦面に開口している実用新案登録請
求の範囲第１項記載の半田吸取装置。(2) The two solder suction holes opening on both sides of the tip are opened on a flat surface formed by scraping the side peripheral surface of the suction nozzle at 180 degrees opposite positions.Claims of Utility Model Registration The solder sucking device according to item 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17490781U JPS5881069U (en) | 1981-11-24 | 1981-11-24 | Solder blotting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17490781U JPS5881069U (en) | 1981-11-24 | 1981-11-24 | Solder blotting device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5881069U true JPS5881069U (en) | 1983-06-01 |
Family
ID=29967039
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17490781U Pending JPS5881069U (en) | 1981-11-24 | 1981-11-24 | Solder blotting device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5881069U (en) |
-
1981
- 1981-11-24 JP JP17490781U patent/JPS5881069U/en active Pending
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