JPS587788A - High frequency deicing device - Google Patents

High frequency deicing device

Info

Publication number
JPS587788A
JPS587788A JP10579381A JP10579381A JPS587788A JP S587788 A JPS587788 A JP S587788A JP 10579381 A JP10579381 A JP 10579381A JP 10579381 A JP10579381 A JP 10579381A JP S587788 A JPS587788 A JP S587788A
Authority
JP
Japan
Prior art keywords
parallel
high frequency
capacitor
circuit
frequency
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10579381A
Other languages
Japanese (ja)
Inventor
一夫 西田
木内 光幸
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP10579381A priority Critical patent/JPS587788A/en
Publication of JPS587788A publication Critical patent/JPS587788A/en
Pending legal-status Critical Current

Links

Landscapes

  • Constitution Of High-Frequency Heating (AREA)
  • Freezing, Cooling And Drying Of Foods (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】 本発明は高周波発振回路の共振回路に複合共振IZi孟
菖の 回路を用いた高周波解凍装置6Q  KQm’@である
DETAILED DESCRIPTION OF THE INVENTION The present invention is a high-frequency decompression device 6QKQm'@ that uses a complex resonance IZi Mengyo circuit as a resonance circuit of a high-frequency oscillation circuit.

従来の高周波発振装置において、加熱電極に加える高周
波高電圧を発生する高周波発振回路の共振回路には、共
振用コンデンサと共振用コイルを直列関係に接続し、直
列共振回路を形成する方法があった。この方法は共振回
路の形成が簡単になる半面、共振回路のQ値を高くとれ
ず高周波発振回路の発振動作が不安定になシ易いという
欠点があった。
In conventional high-frequency oscillators, the resonant circuit of the high-frequency oscillation circuit that generates the high-frequency high voltage applied to the heating electrode involves connecting a resonant capacitor and a resonant coil in series to form a series resonant circuit. . Although this method simplifies the formation of a resonant circuit, it has the disadvantage that the Q value of the resonant circuit cannot be set high and the oscillation operation of the high frequency oscillation circuit tends to become unstable.

本発明は高周波発振回路の共振回路に複合共振回路を用
い、上記欠点を解消した高周波解凍装置を提供するもの
である。
The present invention uses a composite resonant circuit as a resonant circuit of a high-frequency oscillation circuit, and provides a high-frequency decompression device that eliminates the above-mentioned drawbacks.

以下本発明の一実施例を図面を用いて説明する。An embodiment of the present invention will be described below with reference to the drawings.

高周波解凍装置の筐体1は、金属製で接地されたオーブ
ンキャビティ2と高周波発振回路室3とからなる。オー
ブンキャビティ2内には、下部の固定の加熱電極4と、
その上方の上下に移動可能3 1、−、’ な移動の加熱電極6とが互いに平行関係で対向している
。上記加熱電極4,6はそれぞれ高周波発振回路6に接
続される。加熱電極6には電極表面の保護等を目的とし
て非金属製で誘電体損失の小さい(tanδの小さい)
保護板7が装着される。
A casing 1 of the high-frequency thawing device includes an oven cavity 2 made of metal and grounded, and a high-frequency oscillation circuit chamber 3. Inside the oven cavity 2, there is a lower fixed heating electrode 4;
Above the heating electrodes 6, which are movable up and down, the heating electrodes 6 are opposed to each other in a parallel relationship. The heating electrodes 4 and 6 are each connected to a high frequency oscillation circuit 6. The heating electrode 6 is made of non-metallic material with low dielectric loss (small tan δ) for the purpose of protecting the electrode surface, etc.
A protection plate 7 is attached.

また加熱電極4の上部にも同じく非金属製で誘電体損失
の小さい載置板8が置かれる。
Also placed above the heating electrode 4 is a mounting plate 8 which is also made of non-metal and has low dielectric loss.

第2図は、上記高周波発振回路6とその加熱電極4,5
への接続の実施例を示している。直流電源9の出力端子
には、チョークコイル1oと信号増幅素子の一つである
電界効果トランジスタ11が直列関係に接続され、また
、この電界効果トランジスタ11に並列関係にコンデン
サ12が接続される。電界効果トランジスタ11の入力
端子であるゲート端子13とソース端子14間にはバイ
パスコンデンサ16が、ドレイン端子16とゲート端子
13間には共振回路がそれぞれ接続される。
FIG. 2 shows the high frequency oscillation circuit 6 and its heating electrodes 4 and 5.
An example of connection to is shown. A choke coil 1o and a field effect transistor 11, which is one of the signal amplification elements, are connected in series to the output terminal of the DC power supply 9, and a capacitor 12 is connected in parallel to the field effect transistor 11. A bypass capacitor 16 is connected between the gate terminal 13 and the source terminal 14, which are input terminals of the field effect transistor 11, and a resonant circuit is connected between the drain terminal 16 and the gate terminal 13.

この共振回路は、共振用コンデンサを兼用した加熱電極
4,6に並列関係に容量安定用コンデンサ17が接続さ
れ、さらに上記加熱電極4,6と容量安定用コンデンサ
17との並列接続体に直列関係に共振用コイル18が接
続され、さらに上記平行加熱電極4.5と容量安定用コ
ンデンサ17との並列接続体に上記共振用コイル18を
直列接続した並直列接続体に並列関係に発振安定用コン
デンサ19が接続されたものである。こうして電界効果
トランジスタ11のドレイン端子16とゲート端子13
間に複合共振回路を設け、全体として電界効果トランジ
スタ11を中心に周波数6MHz程度の発振回路を形成
している。直流電源の出力端子はコンデンサ20.21
で高周波解凍装置本体1と接続され交流的には接地に近
い状態にしている。
In this resonant circuit, a capacity stabilizing capacitor 17 is connected in parallel to the heating electrodes 4 and 6 which also serve as resonance capacitors, and a capacitor 17 is connected in series to the parallel connection of the heating electrodes 4 and 6 and the capacitance stabilizing capacitor 17. A resonance coil 18 is connected to the parallel heating electrode 4.5 and a capacitor 17 for stabilizing the capacitance, and a capacitor for stabilizing oscillation is connected in parallel to the parallel series connection body in which the resonance coil 18 is connected in series to the parallel connection body of the parallel heating electrode 4.5 and the capacitor 17 for stabilizing the capacitance. 19 are connected. In this way, the drain terminal 16 and gate terminal 13 of the field effect transistor 11
A composite resonant circuit is provided between them, and as a whole, an oscillation circuit with a frequency of about 6 MHz is formed around the field effect transistor 11. The output terminal of the DC power supply is a capacitor 20.21
It is connected to the high frequency thawing device main body 1, and is in a state close to grounding in terms of alternating current.

上記のような構成で載置板8の上に被解凍食品22を置
き、その上から加熱電極5を上下に動かし被解凍食品2
2の上面と保護板7の下面が接触するよう加熱電極6の
位置を設定する。こうして後、直流電源9を始動させる
と、電界効果トランジスタ11を用いた上記高周波発振
回路6は発振動作を開始し、加熱電極4と加熱電極6の
間には6 ベー; 高周波高電圧が誘起される。被解凍食品22−は、上記
高周波高電圧により生ずる電界に対する誘電体損失のた
め加熱される。ここで被解凍食品22が加熱されて行く
と、被解凍食品22の誘電体損失の大きさが変化し、加
熱電極4.6のキャノくシタンス及びQ値が変化する。
With the above configuration, the food to be thawed 22 is placed on the placing plate 8, and the heating electrode 5 is moved up and down from above to thaw the food 22.
The position of the heating electrode 6 is set so that the top surface of the heating electrode 2 and the bottom surface of the protection plate 7 are in contact with each other. Thereafter, when the DC power supply 9 is started, the high frequency oscillation circuit 6 using the field effect transistor 11 starts oscillating, and a high frequency high voltage is induced between the heating electrode 4 and the heating electrode 6. Ru. The food to be thawed 22- is heated due to dielectric loss due to the electric field generated by the high frequency and high voltage. As the food 22 to be thawed is heated, the magnitude of the dielectric loss of the food 22 to be thawed changes, and the capacitance and Q value of the heating electrode 4.6 change.

本実施例の発振方式であるコルピッツ発振回路では共振
回路のQ値の高い時に発振が安定するので、本実施例の
共振回路はQ値の変化する加熱電極にQ値の高いコンデ
ンサを組み合わせて共振回路全体のQ値を高く設定して
いる。
In the Colpitts oscillation circuit, which is the oscillation method used in this example, oscillation is stable when the Q value of the resonant circuit is high. Therefore, the resonant circuit in this example combines a heating electrode with a variable Q value with a capacitor with a high Q value to resonate. The Q value of the entire circuit is set high.

この複合共振回路の交流角周波数とりアクタンスの関係
を第3図に示す。図より、リアクタンスが0になる角周
波数ω1とリアクタンスが極大または極小になる角周波
数ω2とが存在することがわかる。本実施例の高周波発
振回路はコルピッツ発振回路であシ、この方式は共振回
路部のリアクタンスが正、すなわち第3図の特性図の横
軸よりも上の部分で発振する。よってこの高周波発振回
路は角周波数ω1とω2との間の比較的狭い周波数帯で
発振動作をする。
The relationship between AC angular frequency and actance of this composite resonant circuit is shown in FIG. From the figure, it can be seen that there is an angular frequency ω1 at which the reactance becomes 0 and an angular frequency ω2 at which the reactance becomes maximum or minimum. The high frequency oscillation circuit of this embodiment is a Colpitts oscillation circuit, and in this system, the reactance of the resonant circuit section is positive, that is, the oscillation occurs in a portion above the horizontal axis of the characteristic diagram of FIG. Therefore, this high frequency oscillation circuit operates in a relatively narrow frequency band between angular frequencies ω1 and ω2.

以上のように、本発明の高周波解凍装置は、共振回路部
にコンデンサ3個とコイル1個からなる複合共振回路を
用いたことにより、負荷である被解凍物の変化にも安定
に高周波高電圧を供給する高周波発振回路を持つもので
あり、実用上効用の高いものである。
As described above, the high frequency thawing device of the present invention uses a composite resonant circuit consisting of three capacitors and one coil in the resonant circuit section, so that it can stably generate high frequency and high voltage even when the load to be thawed changes. It has a high-frequency oscillation circuit that supplies high-frequency signals, and is highly effective in practice.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本発明の一実施例における高周波解凍装置の透
視正面図、第2図は同じく高周波解凍装置の電気回路図
、第3図は同じく高周波解凍装置の高周波発振回路の複
合共振回路部のりアクタンス特性図である。 2・・・・・・オーブンキャビティ、4・・・・・・固
定の加熱電極、6・・・・・・移動の加熱電極、6・・
・・・・高周波発振回路、9・・・・・・直流電源、1
o・・・・・・チョークコイル、11・・・・・・電界
効果トランジスタ、12・・・・・・コンデンサ、16
・・・・・・バイパスコンデンサ、17・・・・・・容
量安定用コ゛ンデンサ、18・・・・・・共振用コイル
、19・・・・・・発振安定用コンデンサ、22・・・
・・・被解凍ケラ。。a−s *m工やイ、ヵ1,71
,4 ′III
FIG. 1 is a perspective front view of a high-frequency thawing device according to an embodiment of the present invention, FIG. 2 is an electric circuit diagram of the same high-frequency thawing device, and FIG. 3 is a composite resonant circuit section glue of a high-frequency oscillation circuit of the high-frequency thawing device It is an actance characteristic diagram. 2... Oven cavity, 4... Fixed heating electrode, 6... Moving heating electrode, 6...
...High frequency oscillation circuit, 9...DC power supply, 1
o...Choke coil, 11...Field effect transistor, 12...Capacitor, 16
......Bypass capacitor, 17...Capacitance stabilization capacitor, 18...Resonance coil, 19...Oscillation stabilization capacitor, 22...
...Thawing mole. . a-s *m-work, i, ka1,71
,4'III

Claims (1)

【特許請求の範囲】[Claims] 高周波高電圧を発生させる高周波発振回路と、上記高周
波発振回路に接続された平行な加熱電極と、上記加熱電
極を収納したオーブンキャビティよシなシ、上記高周波
発振回路は、直流電源と直列関係に接続されたチロ−ク
コイルと信号増幅素子と、上記信号増幅素子の入力端子
間に接続されたバイパスコンデンサと、上記信号増幅素
子と並列関係に接続されたコンデンサと、上記信号増幅
素子の出力端子と入力端子間に接続された共振回路よシ
なシ、上記共振回路は、共振コンデンサを兼用する平行
な加熱電極と並列関係に容量安定用コンデンサを接続し
、上記並列接続体と直列関係に共振用コイルを接続し、
さらに上記並列接続体と並列関係に発振安定用コンデン
サを接続した複合共振回路を用いたことを特徴とする高
周波解凍装置。
A high frequency oscillation circuit that generates high frequency and high voltage, a parallel heating electrode connected to the high frequency oscillation circuit, and an oven cavity that houses the heating electrode. a bypass capacitor connected between the input terminal of the signal amplification element, a capacitor connected in parallel with the signal amplification element, and an output terminal of the signal amplification element connected to each other. The resonant circuit connected between the input terminals has a capacitance stabilizing capacitor connected in parallel with parallel heating electrodes that also serve as resonant capacitors, and a resonant capacitor connected in series with the parallel connected body. Connect the coil,
Furthermore, a high frequency decompression device is characterized in that it uses a composite resonant circuit in which an oscillation stabilizing capacitor is connected in parallel with the parallel connection body.
JP10579381A 1981-07-06 1981-07-06 High frequency deicing device Pending JPS587788A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10579381A JPS587788A (en) 1981-07-06 1981-07-06 High frequency deicing device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10579381A JPS587788A (en) 1981-07-06 1981-07-06 High frequency deicing device

Publications (1)

Publication Number Publication Date
JPS587788A true JPS587788A (en) 1983-01-17

Family

ID=14417003

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10579381A Pending JPS587788A (en) 1981-07-06 1981-07-06 High frequency deicing device

Country Status (1)

Country Link
JP (1) JPS587788A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6246040B1 (en) * 1999-01-29 2001-06-12 Bradley R. Gunn Solid state RF generator for dielectric heating of food products
JP2022182349A (en) * 2021-05-28 2022-12-08 山本ビニター株式会社 High frequency heating device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6246040B1 (en) * 1999-01-29 2001-06-12 Bradley R. Gunn Solid state RF generator for dielectric heating of food products
JP2022182349A (en) * 2021-05-28 2022-12-08 山本ビニター株式会社 High frequency heating device

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