JPS5876126A - Method and apparatus for purifying gas - Google Patents

Abstract

PURPOSE:To carry out the purification of a gas in good efficiency, by a method wherein a gas to be treated is impinged to accelerated electron groups and ion group generated from a high voltage electric field to be ionized and the ionized gas is introduced into a reaction layer comprising a semiconductive filter material having a large surface area to repeat oxidation reaction. CONSTITUTION:A gas to be treated is introduced into a casing 2 through a conduit 1 and, while the speed thereof is made constant by a rectifying plate 3 to form a uniform stream, introduced into an electric field region (h) where high voltage discharge is generated by a discharge electrode 4. Accelerated electron groups and ion groups generated in this region (h) are impinged on harmful malodorous components or O2 in the gas to be treated to ionize the same as well as to sterilize living bacteria. In the next step, this ionized activated gas is contacted, impinged, stirred and made to stagnate in a reaction layer 6 constituted of a electrically semiconductive filler material 5 to be purified and the purified gas is exhausted while passed through the surface of an earthed electrode 9 having gas permeability closely contacted with the whole surface of the exhaust port of the reaction layer 6.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method and apparatus for purifying foul-smelling gases containing foul-smelling gases, harmful gases, or bacteria that are targets for pollution or public safety and health, and relates to wastewater treatment plants,
Fischmill Plant Exhaust gas from rendering plants, printing using organic solvents, painting, paint baking, rubber factories, etc. is mostly subject to odor pollution, and countermeasures include chemical cleaning methods, adsorption methods, and combinations of these methods. Ozone oxidation method, electrosorption absorption method, catalytic oxidation method (or catalytic combustion method), direct combustion method, etc. have been implemented, but the deodorizing effect, equipment cost, and operating cost have a mutually contradictory relationship, and it is difficult to achieve energy conservation. Currently, there are no satisfactory methods or equipment in existence, and aerobic aeration, anaerobic aeration, etc. are the mainstream in reduced sewage treatment plants and other organic wastewater treatment plants, and the exhaust gases from these systems have no effect on the human body. Contains a large amount of common bacteria that cause
Even if the foul-smelling gas is removed by passing it through a device that combines chemical cleaning method and adsorption method, general bacteria including E. coli etc.
The current situation is that almost no gas is removed and a large amount of gas is left in the atmosphere.

As described above, conventional deodorizing methods have advantages and disadvantages, and some methods may not be applicable depending on the components or properties of the harmful or malodorous gas. The present inventor investigated the current state of odor countermeasures, and
As a result of researching past documents, it was found that around 1900-1930
In this paper, we focused on the fact that research on ionization of inorganic and organic gases using the electron collision method at room temperature was being actively conducted. It has been virtually impossible to elucidate the various reaction processes from a production engineering perspective because molecular reactions are simple and cannot be quantified.

That is, in collisional activation by electrons, various gases undergo diversified reactions due to excited molecules, molecular ions, dissociated atoms, free radicals, dissociated atomic ions, etc.

That is, in collisional activation by electrons, various gases undergo diversified reactions due to excited molecules, molecular ions, dissociated atoms, free radicals, dissociated atomic ions, etc.

Note that if the product that completed the initial reaction was delayed in escaping from the discharge field, it would be exposed to the intense field of discharge, resulting in a complicated reprinting reaction.

One example is the production of hypertrophic molecules with adhesive properties due to multiple bonds.

Focusing on the fact that the gas targeted by the present invention usually contains several percent or more of oxygen, each component activated as described above is composed of molecular ions and dissociated atoms of oxygen. By creating an atmosphere that facilitates oxidation reactions or decomposition separation with the same ions, they have discovered a method to obtain decomposition separation or sterilization removal efficiency that could not be achieved with conventional electron collision methods. Therefore, the purpose of the present invention is to ionize the gas to be treated by colliding it with accelerated electrons and ions generated by a high-voltage electric field, and then ionize the gas to be treated by forming a semiconducting filler with a large surface area. It is an object of the present invention to provide a method and an apparatus for purifying the gas to be treated by introducing the gas into a reaction layer, improving the retention effect of the gas to be treated by stirring, contacting, and colliding, and mainly repeating the oxidation reaction. In addition, the same method and equipment are used to destroy the ecology of general bacteria, particularly spore-forming bacteria, and sterilize them in a high-voltage atmosphere. Electron energy in the reaction layer has the ability to violently collide with the semi-conducting filling that connects to the ground electrode, and as it passes through the layer, its energy is reduced and the energy is reduced until it reaches the ground electrode. Therefore, the main purpose of the present invention is to eliminate dust, mist, various types of polymer gases, pyrolysis gases, low molecular gases with strong bonding strength, or general bacteria in exhaust gas that has been used in conventional practice. It has been impossible to treat the malodorous gases and the like contained therein by a single type of deodorization method. However, according to the present invention, stable performance can be continuously maintained by not only fixing the filling of the reaction bed but also fluidizing, regenerating, and circulating the filling, and the function of the filling can be adjusted to the characteristics of the gas to be treated. Accordingly, it is easy to freely select the following. That is, adsorption,
The object of the present invention is to provide a method and apparatus that can perform a wide range of exhaust gas treatment by absorption, neutralization, oxidation, catalysis, etc., singly or in combination.

Another object of the present invention is to ionize the gas to be treated, which is relatively easily absorbed, neutralized, or oxidized and decomposed with water, chemical solutions, etc., and then to apply water or In this case, the residual accelerated electrons and ions passing along with the ionized gas ionize the molecules in the liquid film, causing gas Activation of both the liquid and gas increases the mass transfer coefficient at the gas-liquid interface, greatly improving the efficiency of absorption, neutralization, and oxidative decomposition. Therefore, it is an object of the present invention to provide a method and apparatus that can improve removal efficiency, simplification of the apparatus, corrosion resistance, etc. over the conventionally known wet cleaning method and high voltage wet absorption method.

Another object of the present invention is to provide a method and apparatus for use in combination with a pre-treatment scrubber, etc., for dust-containing gas and ammonia-containing tank gas such as from a fish mill plant containing a large amount of moisture.

The overall purpose of the present invention is to provide the most efficient deodorizing device in the current technology, such as the catalytic oxidation method used in the printing and painting industries, or the combination of the chemical cleaning method and adsorption method, which are often used in human waste treatment plants. On the other hand, based on the same processing efficiency, the equipment cost will be reduced by about 20-30%, and the operating cost will be reduced by ~
Therefore, the objective is to provide a method and apparatus for obtaining an ``economical and highly efficient deodorizing technique'' that has been desired for many years.

Further objects, configurations, functions, and effects of the present invention will become clearer from the following detailed description.

Hereinafter, the implementation device of the present invention will be explained in detail.

In the embodiment shown in FIG. 1, a harmful gas to be treated having an odor is introduced into a casing 2 through nine conduits 1, and flows into an electric field region for adjusting the flow to a constant velocity and uniformity. The transformer 8 is insulated and sealed at the casing penetration part.
The transformer 8 is connected to one end of the secondary side, and the other end of the secondary side is connected to the ground 7. The primary power of the transformer 8 may be commercial power, but high frequency power may also be applied. .

Also, depending on the electrical characteristics, since the purpose of the present invention is collisions between high-speed free electron groups and ion groups, it is basically a direct current, but it can be either an alternating current or a direct current, or a direct current of either positive or negative polarity. However, the negative case is more effective in terms of voltage characteristics, but its selection depends on the characteristics of the gas to be treated, equipment conditions, etc. The gas to be treated or the mixed gas of general bacteria and air that has flowed into the electric field region flows into the spatial region, that is, the region where the activity of fast free electrons and ions is intense, before flowing into the reaction layer 6 formed by the semiconducting filler 5. In the space, the gas to be treated is ionized and ionized by collision, or the ecosystem of bacteria is destroyed in the atmosphere of high electric field, and in this state, the activated gas or strong vitality reaches the entrance of the reaction layer 6. The number of spore bacteria is forced to stay between the layers of the semiconducting packing 5 having a large surface area while undergoing collision, contact, and agitation in the narrow gaps between the packings 6, and free electrons are forced to remain between the layers of the semiconducting packing 5, which has a large surface area. While repeating inelastic collisions, the stain level is lowered due to conduction to the ground electrode 9, and an intense oxidation reaction occurs inside the reaction hII 6 due to the oxygen contained in the gas to be treated. In some cases, ring element polymerization reactions also occur. Furthermore, although dioscin is generated due to electric discharge, its generation rate is relatively low, and the contribution rate of oxidative decomposition or sterilization is small, and the ionization region and the reaction region H, which mainly causes oxidation reactions, are closely related to each other. In particular, reaction region H forms the gist of the present invention.

At the outlet of the reaction layer 6, there is a closely grounded mesh, lattice,
Alternatively, a single porous ground electrode 9 or a combination of a plurality of porous electrodes 9 are attached, and all the gases to be treated pass through the ground electrode 9 while being perpendicular to the entire surface thereof, and the residual potential of free electrons becomes zero when passing through.

In addition, harmful substances and malodorous substances that cannot be removed in one step due to the characteristics and concentration of the gas to be treated, or bacteria that cannot be destroyed in a high-potential atmosphere are treated by forming a plurality of reaction layers 6 as shown in the figure. By doing this, you can cleanse the debris.

In addition, if the gas to be treated contains fine dust and decomposition products or polymerization reaction products accumulate on the ground electrode 9, its performance will deteriorate, so it should be periodically taken out to the outer door and cleaned when the operation is stopped. is necessary. In the figure, 7 is a high voltage line, IO is an electrode support plate, and ν is a door that can be opened and closed without holding the reaction layer 6 together with the case.

The applied voltage in the present invention is 3 to 40y1, preferably 5 to 40y1.
20KV, the current waveform can be either AC or DC, and in the case of DC, the polarity can be positive or negative, but preferably it is a DC negative electrode, and in the case of AC, the frequency may be changed, but Power cycle may be used, and the thickness of the ionization region (h) is between 20 and 30 gQIm, preferably between 30 and 50 gQIm.
The thickness of the reaction area is 20~80111Ef'
tL (is 9 to 5011 m, and varies depending on the applied voltage and the characteristics of the gas to be treated, but it is preferable that the total thickness of both is at most 100 m, and the filling that constitutes the reaction area H is Particle size 2-5
1111! One or more types of semiconducting materials that have a resistance value of electrical semiconductivity using ffi ceramic or noncombustible resin as a base material, or semiconducting materials that have a metal core coated with a noncombustible resin film. It is a mixture, and the electrical resistance value is 11
The electrical resistance value is preferably 00a or less, but the electrical resistance value is determined by the applied voltage, effective electric field area, decomposition efficiency of the reaction layer, etc. Macroscopically, the surface of the filler is preferably highly porous or rough to improve adsorption properties, and the gas to be treated or bacteria contained in the gas to be treated are temporarily transferred to the surface of the filler. If the packing of the P1 reaction layer is used as an oxidation catalyst, the catalytic substances such as nickel, manganese, and platinum are replaced with alumina oxide and other substances. Particles attached to a core material having a large electric resistance value or mixed particles obtained by mixing such particles with particles having good conductivity, and having the above-mentioned known electric resistance value, are used.

Table 1 shows the results of treating the foul-smelling gas generated in the crosstalk process at a rubber factory using the above-mentioned example.

Table-1 Note 1. Electrical specifications DC 81V 2 Gas to be treated 3 Flow rate 5mm Atmosphere 25 55-
RHλ Number of reaction layers 3 4, Odor quality Inlet Aversive gas outlet containing rubber odor There is a slight odor, but it is so weak that the quality of the odor cannot be determined 1 Three-point comparison method Odor Bag Law Company's current odor judgment 1. This is the most authoritative method, developed by the Tokyo Metropolitan Government, and has been used by local governments throughout the country for a long time.

Odorless air - TSOO is a 300% odorless air generator that uses odorless air to collect gas.
This is the strictest guaranteed value for the degree of odor at the outlet of the deodorizer, as more than half of the odor testers will not be able to detect the odor at 9 times the odor.

7. The odor level at exhaust outlets in Tokyo is regulated by ordinance as follows.

Residential area 300 or less Heavy industry area Woo or less Industrial area 100 or less Table 2 shows the results of conducting the same method as above for the F-floor exhaust gas from a human waste treatment plant for malodorous gas containing bacteria.

Table 2 Note: Electrical specifications DC 12D AC 12Kv (2) Values in () Amount of gas to be treated 5 Houho 9℃ 97chi RH3, Number of reaction layer stages 3 Actual inlet Aversive human urine odor Outlet Actual 1F 4 JWR cannot be done 1 degree soft odor &
The gas flow at the inlet and outlet of the bacterial collection method is sucked through a tube into the saline collection air, and the exhaust gas is discharged via a vacuum pump.

1 Indoor Product Hygiene Inappropriate Standards OII Soryohiro 3
It is 00 rice cake 9.

FIG. 2 shows another embodiment of the present invention, in which the gas to be treated flows horizontally and is transferred from the upper side to the lower side of the reaction layer 6, and the gas to be treated is wetted before the dew point. One or more types of dust, tarnst, etc. contained in the process gas, or organic precipitates precipitated in the reaction layer 6, inorganic products, sticky substances generated by multi-species combinations, etc., pass through the device. In particular, the surface of the semiconductive filler 5 and the ground electrode 9 in the flowing reaction layer 6 is contaminated and the functions of each are inhibited, so that the purification efficiency of the gas to be treated is significantly reduced. Since long-term continuous operation is not possible, plants that require continuous operation should either install a bypass duct to release the contaminated gas into the atmosphere during the cleaning period, or shut down the plant, or replace the same equipment. This is a device to eliminate the disadvantage of having to install the gas in parallel and switch between them.The gas to be treated is introduced into the casing 2 by an exhaust fan, the flow is made low at a low speed by the rectifying plate 3, and a high voltage is applied. As described in detail in the previous embodiment, the liquid passes through the vicinity of the discharge electrode 4, enters the ionization layer region and is ionized, or the ecology of carbon dioxide is destroyed and it flows into the next reaction layer 6. During the repeated collision, contact, and stirring with the surface of the filler 5 in the reaction layer 6, dust, mist, etc. in the gas to be treated are removed.
Reaction products, multi-S# polymer molecules, etc. are attached to the surface of the packing 5. In addition, deposits, ionized molecules with large molecular weight, etc. adhere to the ground electrode 9, but the filling 5 in the reaction layer 6 is discharged while flowing intermittently or continuously depending on the properties of the gas to be treated. By introducing the same amount of regenerated filler from the opposite direction, the surfaces of the reaction layer 6 and the ground electrode are always maintained in an active state, and the purification of the gas to be treated is always kept highly efficient and stable. , there is no need for pre-treatment equipment such as filters and gasification equipment to prevent condensation, which were required in conventional equipment for removing harmful gases and foul-smelling gases, and there is no need for equipment that can be combined with various types of processing equipment for the gas to be treated. Therefore, the purpose can be achieved only by changing the function of the reaction layer 6 by the method described above in a single system device.

In the figure, 13 is a high-voltage air cooling box, and 14 is a rotor IJ-/(
17.4 is a circulation pump for cleaning chemical liquid, 18 is a spray nozzle for cleaning chemical liquid, and 19 is a loading device such as a belt conveyor for conveying the filling material 5 to the cleaning and regenerating tank 16. 5 is the discharge door that takes out the drying reaction product from the cleaning and drying device 3120, 21 is the circulation pump for the cleaning chemical, δ is the packet conveyor that takes out the dried and recycled reaction product in the cleaning and drying 3120, and the grave is the packet. conveyor 2
A belt conveyor that supplies the regenerated reactant 5 carried out by 5Jζ to the hopper I above the regenerated reactant supply valve formed at the upper end of each reaction layer 6; 6ml gas inlet,
The blade is an exhaust pipe, 31 and 32 are a cleaning chemical tank, O is a cleaning chemical pump, and A is a porous plate like a net that holds the filler 5 together with a ground electrode 9. The same reference numerals as in the previous embodiment indicate the same parts. This shows that.

Printing ink manufacturer 1 according to the embodiment shown in FIG. ζ
Table 3 shows the results of the tests conducted on the exhaust gas generated in this plant.
Shown below.

The exhaust gas generated in the reaction vessel during the manufacturing process is multi-component, and its substance cannot be ascertained by gas or chromatographic analysis.The odor is particularly targeted, so it can be detected by using a detector tube and sensory test. We measured this tendency and made the interior of the reaction vessel inert in order to prevent explosions.
In this case, there is almost no oxygen, so the exhaust gas is introduced into a water sealing device, and air is mixed in at the outlet to reduce the oxygen content to 16% by weight.

Table 3 Injection electrical specifications AC I Processed gas flow rate 31435℃ (Water sealing device outlet) 1 Number of reaction layer stages 3 Table Actual inlet Chest-stimulating, suffocating, aversive gas emission
Mouth Can breathe in exhaust gas. Slight odor with no aversive odor 5, Filling and discharging: Replaced intermittently (every 20 to 30 minutes) 6, Contaminated light jj-viscosity, coated with a dark brown thin film Figure 3 shows another embodiment of the present invention As an example, if there is a small amount of dust in the gas to be treated, or if there are components that are easily absorbed, neutralized, or oxidized with water, chemicals, etc., or multiple bond molecules that are easily captured below the dew point, the packing 5. When wettability is imparted to the surface by dropping a liquid, it is likely to be adsorbed, absorbed, neutralized, or oxidized within the reaction layer 6.9 A nozzle is placed above the reaction layer 6 where the filler 5 falls continuously or intermittently. A dripping device (A) such as the one shown in FIG. The chemical solution applied to this device may be a commercially available one, and should be adapted to the properties of the gas to be treated.For basic gases, an aqueous solution of pH 2 to 5, preferably pH 2 to 3, such as sulfuric acid or hydrochloric acid should be used.
In addition, in the case of acidic gas, the H9-14, preferably PH12-12, is
It is applied as an aqueous solution of No. 13, and for exhaust gases such as trimethylamine, methyl mercaptan, methyl sulfide, and methyl disulfide, which are difficult to absorb and neutralize with neutral gases, acids, alkalis, etc., sodium hypochlorite and peroxide are used. An oxidizing agent such as hydrogen, sodium bromite, or stabilized chlorine dioxide is preferable, and the pH is 8-12, preferably 9-H.
is an aqueous solution, and the effective concentration of each oxidizing agent in the liquid is 500 to 2.
000 pp+s, preferably 5oo to 1ooopp.

In this embodiment, a plurality of reaction vessels 6 are used in combination as required, and the same reference numerals as in the previous embodiment indicate the same parts, and the other configurations are the same as the embodiment shown in FIG. 2.

FIG. 4 shows still another embodiment of the present invention, in which the configuration of the embodiment shown in FIG. 3 is simplified to suit the characteristics of the gas to be treated. In the case of gases that are easily oxidized, such as ammonia and hydrogen sulfide gas, or in the case of chemical cleaning methods, for exhaust gases containing trimethylamine, methyl sulfide, and methyl disulfide, which have low oxidation removal efficiency, it is generated by the voltage applied to the discharge electrode 4. After being dissociated and ionized by a group of accelerated electrons, the reaction layer 6 of the embodiment shown in FIG.
Instead, an insulating dielectric 41 capable of forming an electrically insulated and breathable liquid film is formed on the ground electrode 9, and the components in the liquid are caused to collide with the accelerating electron group still remaining in the ionization region and the liquid film. This ionizes the gas and increases the mass transfer coefficient at the gas-liquid boundary significantly compared to conventional electrostatic absorption methods, making it easier for the ionized gas to react with and pass through the secondarily ionized liquid film.

In this case, if the liquid film and the ground electrode 9 are in close contact with each other, the potential difference between the electron groups becomes zero and the transfer coefficient of the electron group becomes smaller than in the present invention. 9, liquid film supply nozzle 42, liquid circulation pump, new liquid supply pump 44, liquid storage tank 6, circulating liquid cypress, neutralization drain tank 4
7 or the like, and a plurality of insulating dielectrics 41 are formed as necessary, and the thickness of the insulating dielectric 41 is 5 to 5.
1. The liquid trout conductor is made of insulating resin fiber,
Net-like, lattice-like! 1$J (knitted, and its shape is not restricted. The same applies to the combination of multiple layers.

Note that the same reference numerals as in the above embodiment indicate the same parts.

In addition, the space velocity SV indicating the basic design value of the device according to the present invention
represents the relationship between the velocity and residence time of the gas to be treated flowing through the equipment, and in general, in the catalytic oxidation (catalytic combustion) method, the capacity of the catalytic reaction layer is determined by the SV value, which is an important element in the basic design. It is.

Based on the present invention (the 8V value varies depending on the components and properties of the gas to be treated, the magnitude of the applied voltage, etc.)
00 Hr-', preferably 6000-15
000 hours.

The SV values in Tables 1, 2, and 3 are each 12.000 Hr.

1 12000 Hr, 8000 Hr.

The space velocity S■ is calculated as follows.

-1 8V = y Hr Q: Amount of gas to be treated flowing in the device in one hour (m2
/Hr) ■=Volume of reaction layer (m2)

[Brief explanation of drawings]

1 and 2 are longitudinal sectional views of two embodiments, and FIGS. 3 and 4 are partial sectional views of two other embodiments. 2... Casing, 3... Current plate, 4... Discharge electrode, 5... Filler, 6... Reaction layer, 9...
- Ground electrode, 15... Carrying out device, stamen... Dripping device, 41... Insulating dielectric. Applicant Shoji Imamura Agent Mutsuaki Nozawa

Claims (1)

[Scope of Claims] 1. Accelerated electron groups and ion groups generated in the p1 electric field atmosphere due to high voltage discharge are used to generate harmful and/or malodorous gas component differences in the gas to be treated, such as oxygen in the gas to be treated. The ionized active gas is ionized by colliding with the gas, or the ecology of bacteria in the gas to be treated is destroyed by high voltage, and then the ionized active gas is contacted in a reaction layer made of electrically semiconductive packing.
The purified gas is purified by collision, agitation, and residence, and is discharged through a breathable electrode surface that is in close contact with the entire surface of the outlet of the reaction layer and is grounded, or is treated by a plurality of the reaction layers. A gas purification method characterized by processing gas. 2. Depending on the temperature of the gas to be treated, the concentration of components of harmful and/or malodorous gases in the gas to be treated, the amount of dust, and other physical properties, the filling material in the reaction layer is loaded intermittently or continuously, and gradually The gas to be treated is carried out of the passage system, the contaminated filling is regenerated and returned to the reaction layer, and the reaction layer is configured to have a mechanism according to the characteristics of the gas to be treated, and the filling constituting the reaction layer is A gas purification method according to claim 1, characterized in that the gas to be treated is given adsorption, absorption neutralization, and catalytic oxidation properties on the surface of an object. 3. A rectifying plate that rectifies the gas to be treated at a low speed is formed in the casing, and a discharge electrode to which a high voltage is applied and a grounding electrode that is grounded face each other to maintain a space in the casing downstream of the Ill1 flow plate. and a reaction layer made of a semiconductive filler is formed in the space by intersecting with the gas to be treated and blocking the space.
Gas purification equipment that implements the above. 4.4I The apparatus according to claim 3, comprising: an adjustable transport device for transporting the filling material forming the reaction layer out of the system intermittently or continuously depending on the characteristics of the gas to be treated; A regeneration device that removes adsorbed matter adhering to the surface of the deposited packing material, products or dust by absorption neutralization or oxidation, and regenerates the packing material, and an adjustable system that returns the recycled packing material to the reaction bed. The function of adsorption, absorption neutralization, oxidation, or catalytic fermentation catalyst can be applied to the semiconductive packing that forms the transport device and is applied to the reaction bed, depending on the characteristics of the gas to be treated. Claim 2, characterized in that, for absorption neutralization and chemical liquid oxidation, a water or chemical liquid dripping device or the like is formed to impart wettability to the filling.
g4. A gas purification device that performs ! L4# In the apparatus according to claim 4, water or a chemical solution is poured into the reaction layer for the gas to be treated which is easily absorbed, neutralized, oxidized and decomposed, etc. to provide insulation and air permeability. A gas purification device according to claim 2, characterized in that the dielectric having the above structure is formed between the discharge electrode and the ground electrode while maintaining a space between the dielectric and the discharge electrode.