JPS5873227U

JPS5873227U - electronic cooling pillow

Info

Publication number: JPS5873227U
Application number: JP16586481U
Authority: JP
Inventors: 山口　卯三郎; 原　利次; 飯塚　清次; 川島　庄司
Original assignee: 株式会社日立製作所
Priority date: 1981-11-09
Filing date: 1981-11-09
Publication date: 1983-05-18

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Brief explanation of the drawing]

第１図は、本考案による電子冷却枕の外観図、第２図は
、枕の縦断面図、第３図は、断熱層上面の溝形状を示す
説明図である。１・・・本体、１ａ・・・断熱層、２・・・マット、３
・・・吸排気グリル、３ａ・・・吐出口、３ｂ・・・吸
込口、４・・・冷却板、５・・・サーモエレメント、６
ａ・・・伝熱板、６ｂ・・・ヒートパイプ、６Ｃ・・・
放熱フィン、７・・・底板、訃・・溝、９・・・孔。FIG. 1 is an external view of the electronic cooling pillow according to the present invention, FIG. 2 is a vertical cross-sectional view of the pillow, and FIG. 3 is an explanatory diagram showing the shape of grooves on the upper surface of the heat insulating layer. 1... Main body, 1a... Heat insulation layer, 2... Mat, 3
...Intake/exhaust grill, 3a...Discharge port, 3b...Suction port, 4...Cooling plate, 5...Thermo element, 6
a... Heat exchanger plate, 6b... Heat pipe, 6C...
Radiation fin, 7...bottom plate, tail...groove, 9...hole.

Claims

[Scope of utility model registration request]

A thermoelectric cooling device is equipped with a cooling plate on the heat absorption side of the thermoelement and a heat transfer plate of a radiator on the heat generation side, with the cooling plate on the top and the heat transfer plate on the bottom, and around the thermoelement. The cooling plate is formed of a heat insulating layer and is attached to the pillar body, and a mat packed with liquid or liquid-impregnated corpus cavernosum is placed on the top surface of the cooling plate, and the pillar body, intake and exhaust grilles and In an electronic cooling pillow in which the radiation fin portion of the radiator is housed in the space formed by the bottom plate that closes the bottom surface of the pillar body, a U is placed on the top surface of the heat insulating layer so as to surround the thermoelement. 1. An electronic cooling pillow characterized in that a groove is provided in the shape of a letter, and a hole passing through the heat insulating layer is provided at the bottom of the groove and at the top of the bottom plate.