JPS586714B2 - Heat resistant joining method - Google Patents

Heat resistant joining method

Info

Publication number
JPS586714B2
JPS586714B2 JP53003478A JP347878A JPS586714B2 JP S586714 B2 JPS586714 B2 JP S586714B2 JP 53003478 A JP53003478 A JP 53003478A JP 347878 A JP347878 A JP 347878A JP S586714 B2 JPS586714 B2 JP S586714B2
Authority
JP
Japan
Prior art keywords
mixture
weight
silicon
joining
ceramics
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP53003478A
Other languages
Japanese (ja)
Other versions
JPS5496512A (en
Inventor
高橋正吉
山崎正己
中園定敏
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TOKAI KONETSU KOGYO KK
Original Assignee
TOKAI KONETSU KOGYO KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TOKAI KONETSU KOGYO KK filed Critical TOKAI KONETSU KOGYO KK
Priority to JP53003478A priority Critical patent/JPS586714B2/en
Publication of JPS5496512A publication Critical patent/JPS5496512A/en
Publication of JPS586714B2 publication Critical patent/JPS586714B2/en
Expired legal-status Critical Current

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  • Ceramic Products (AREA)
  • Non-Adjustable Resistors (AREA)

Description

【発明の詳細な説明】 本発明はふたつの部材、特にセラミックスと金属又はセ
ラミックスどうしの接合方法に関する。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method of joining two members, particularly a ceramic and a metal or ceramic.

例えば、セラミックスどうしの接合方法としては従来か
ら、(1)金属熔射法(メタリコン)、(2)モリブデ
ン等の金属を水素などのガス中でセラミックス中に浸透
させるメタライジング法、(3)無電解メッキ法、又は
(4)銀又は白金ペーストの焼付方法などの方法により
セラミックス表面に金属面を形成し、この金属面に半田
又は銀ロウを用いて相互に熔着する方法が一般的に使用
されている。
For example, conventional methods for joining ceramics include (1) metal spraying (metallicon), (2) metallizing, in which a metal such as molybdenum is infiltrated into ceramics in a gas such as hydrogen, and (3) non-contact. A commonly used method is to form a metal surface on the ceramic surface by electrolytic plating or (4) baking silver or platinum paste, and then weld these metal surfaces to each other using solder or silver solder. has been done.

しかし、これらの方法によって形成された接合部分は空
気中で高温にさらされると熔融、酸化又は劣化して、導
電性の低下及び強度の低下などを来す。
However, when the bonded portions formed by these methods are exposed to high temperatures in the air, they melt, oxidize, or deteriorate, resulting in a decrease in conductivity and strength.

本発明は従来のかかる欠点に鑑みてなされたものであり
、セラミックスどうし又はセラミックスと金属を簡単に
しかも十分な耐熱性と導電性を備える材料で接合する方
法を提供するものである。
The present invention has been made in view of these conventional drawbacks, and provides a method for simply joining ceramics together or joining ceramics and metals using a material that has sufficient heat resistance and conductivity.

即ち、本発明は金属とセラミックス又はセラミックスど
うしを接合する方法であって、直径300μm以下の金
属珪素粉末又は珪素合金粉末と有機バインダーを混合し
、その糊状混合物を用いて両者を仮接着し、1300〜
1550Cの温度で加熱して熔着させることを含む接合
方法である。
That is, the present invention is a method for joining metal and ceramics or ceramics to each other, which involves mixing metal silicon powder or silicon alloy powder with a diameter of 300 μm or less with an organic binder, and temporarily bonding the two using the glue-like mixture. 1300~
This joining method includes heating and welding at a temperature of 1550C.

接合されるべき金属及びセラミックスは特に限定されな
い。
The metals and ceramics to be joined are not particularly limited.

使用する珪素合金粉末としては例えばフエ口シリコンな
どがある。
The silicon alloy powder used includes, for example, Huekuchi silicon.

有機バインダーとしては、例えばポリビニルアルコール
、メチルセルロース、デン粉などがあり、これらを水溶
液として使用する。
Examples of the organic binder include polyvinyl alcohol, methylcellulose, and starch, which are used in the form of an aqueous solution.

また、かかる有機バインダー添加量は糊状混合物の重量
当り2〜0.1重量%が好ましい。
Further, the amount of the organic binder added is preferably 2 to 0.1% by weight based on the weight of the pasty mixture.

上記した金属珪素又は珪素合金の粉末と有機バインダー
とは糊状になるまで充分に混合する。
The above metal silicon or silicon alloy powder and organic binder are thoroughly mixed until they become paste-like.

上記粉末材料の直径が300μmをこえると混合物がな
めらかな糊状とならず、被接合部材の仮接着が困難であ
り、特に微少部分や複雑な部分の接合に適さない。
If the diameter of the powder material exceeds 300 μm, the mixture will not form a smooth paste, making it difficult to temporarily bond parts to be joined, and is particularly unsuitable for joining minute parts or complicated parts.

このようにして得られた糊状混合物は次にセラミックス
又は金属の被接合部材の接合個所に適用される。
The paste-like mixture thus obtained is then applied to the joining points of ceramic or metal parts to be joined.

例えば、筆塗り、スクリーン印刷などの手段を用いるこ
とができる。
For example, methods such as brush painting and screen printing can be used.

被接合部材は糊状混合物の粘着力により相互に仮接着さ
れる。
The members to be joined are temporarily adhered to each other by the adhesive force of the glue-like mixture.

その後、約120℃前後の温度で乾燥して糊状混合物を
ある程度固めるのが好ましい。
Thereafter, it is preferable to dry the pasty mixture at a temperature of about 120° C. to harden it to some extent.

最後に、糊状混合物で仮接着された被接合部材を130
0〜1550Cの温度で加熱する。
Finally, the parts to be joined temporarily bonded with the glue-like mixture were
Heat at a temperature of 0-1550C.

この加熱により有機バインダーは分解され、珪素粉末又
は珪素合金粉末が熔着してふたつの被接合部材を接合す
る。
The organic binder is decomposed by this heating, and the silicon powder or silicon alloy powder is melted to join the two members to be joined.

本方法によれば、従来のごとくセラミックス表面に一担
金属面を形成する必要がない。
According to this method, there is no need to form a single metal surface on the ceramic surface as in the conventional method.

従って、前記従来方法よりも極めて簡単にセラミックス
どうし又はセラミックスと金属を接合できる。
Therefore, it is possible to join ceramics to each other or to join ceramics to metal much more easily than in the conventional method.

接合材としてなめらかな糊状混合物を使用するので被接
合部材が微小又は複雑な形状であっても接合可能であり
、しかも同時に多数個所を接合することもできる。
Since a smooth glue-like mixture is used as the bonding material, it is possible to bond even if the members to be bonded have minute or complicated shapes, and it is also possible to bond multiple parts at the same time.

本方法により得られた接合個所は珪素熔着層であるから
優れた耐熱性を有し、且つ電気的にも良好な導電性を有
する。
Since the bonded area obtained by this method is a silicon welding layer, it has excellent heat resistance and good electrical conductivity.

従って、本接合方法は点火器における発熱体を端子に接
合する場合などに好適である。
Therefore, this joining method is suitable for joining a heating element in an igniter to a terminal.

特に、本出願人が昭和52年12月24日提出の特許出
願「線状又は帯状の炭化珪素発熱体」において提案した
超小型の炭化珪素発熱体を端子に接合するのに適してい
る。
In particular, it is suitable for joining the ultra-small silicon carbide heating element proposed in the patent application "Linear or band-shaped silicon carbide heating element" filed on December 24, 1972 by the present applicant to the terminal.

実施例 1 直径149μmの金属珪素粉末80重量%にポリビニル
アルコール3%水溶液20重量%を添加し、撹拌梱潰機
で1時間混合して糊状混合物を得た。
Example 1 20% by weight of a 3% aqueous solution of polyvinyl alcohol was added to 80% by weight of metallic silicon powder having a diameter of 149 μm, and the mixture was mixed for 1 hour using a stirring baler to obtain a pasty mixture.

第1図に示すような直径3mm長さ40mmの炭化珪素
端子1に上記糊状混合物2を塗布した。
The above paste-like mixture 2 was applied to a silicon carbide terminal 1 having a diameter of 3 mm and a length of 40 mm as shown in FIG.

次に、別に用意した直径1mm長さ10mmの線状炭化
珪素発熱体3を糊状混合物2に仮接着した後約120℃
で乾燥した。
Next, a separately prepared linear silicon carbide heating element 3 with a diameter of 1 mm and a length of 10 mm was temporarily bonded to the glue-like mixture 2 at a temperature of about 120°C.
It was dried.

これを黒鉛粉末中に埋没して1400℃で加熱熔着し、
更に空気中にて1000℃で熱処理した。
This was buried in graphite powder and heated and welded at 1400°C.
Further, heat treatment was performed at 1000° C. in air.

得られたものは第2図のような抵抗値1KΩの抵抗発熱
型点火素子として使用された。
The obtained product was used as a resistance heating type ignition element with a resistance value of 1KΩ as shown in FIG.

第2図において4は絶縁碍子である。実施例 2 空気中にて1400Cで加熱熔着したこと以外実施例1
と同様にして抵抗値2KΩの点火素子を得た。
In FIG. 2, 4 is an insulator. Example 2 Example 1 except that heat welding was performed at 1400C in air
An ignition element having a resistance value of 2KΩ was obtained in the same manner as above.

この点火素子は15W負荷で1000℃に発熱し、長時
間経続使用したが接合部に異常はなかった。
This ignition element generated heat to 1000° C. under a load of 15 W, and although it was used for a long time, there were no abnormalities in the joints.

実施例 3 使用した糊状混合物は直径44μmの第2種フエ口シリ
コン粉末(珪素含有量75〜80%)80重量%と1%
ポリビニルアルコール水溶液25重量%とからなってい
た。
Example 3 The paste-like mixture used was 80% by weight and 1% by weight of second type silicone powder (silicon content 75-80%) with a diameter of 44 μm.
It consisted of 25% by weight of an aqueous polyvinyl alcohol solution.

被接合部材は珪素粉末30重量%、二酸化珪素40重量
%及び粘土30重量%からなる混練物を押出成形し、1
300℃で焼成して作製した径の異なるセラミック管5
,6であった。
The members to be joined are made by extrusion molding a kneaded material consisting of 30% by weight of silicon powder, 40% by weight of silicon dioxide, and 30% by weight of clay.
Ceramic tubes with different diameters made by firing at 300°C 5
,6.

発熱体となる管5の両端に上記糊状混合物を塗布し、端
子となる管6を挿着した後、約120℃で乾燥した。
The paste-like mixture was applied to both ends of the tube 5, which served as the heating element, and the tube 6, which served as the terminal, was inserted, and then dried at about 120°C.

これを空気中にて1380℃で加熱することにより熔着
した。
This was heated in air at 1380°C to weld.

得られたものは電極7を付けて抵抗値33Ωの発熱体と
して使用できた。
The obtained product could be used as a heating element with a resistance value of 33Ω by attaching the electrode 7.

実施例 4 使用した糊状混合物は直径74μmの金属珪素粉末80
重量%と3%ポリビニルアルコール水溶液20重量%と
からなっていた。
Example 4 The paste-like mixture used was 80% of metallic silicon powder with a diameter of 74 μm.
% by weight and 20% by weight of a 3% polyvinyl alcohol aqueous solution.

他方、スズ酸バリウム95重量%と三酸化アンチモン5
重量%の混合物に更に30重量%の陶石を加え、この混
練物を直径3mm長さ50mmの棒状に押出成形した後
1300℃で焼成することによりセラミック質抵抗体を
作製した。
On the other hand, 95% by weight of barium stannate and 5% by weight of antimony trioxide
A ceramic resistor was produced by adding 30% by weight of pottery stone to the mixture, extruding the kneaded product into a rod shape with a diameter of 3 mm and a length of 50 mm, and firing it at 1300°C.

この棒状抵抗体8に第4図のように直径0,5mmのタ
ングステン線9を巻き付け、その巻き付け個所に上記糊
状混練物を塗布した。
A tungsten wire 9 having a diameter of 0.5 mm was wound around this rod-shaped resistor 8 as shown in FIG. 4, and the paste-like kneaded material was applied to the wound portion.

約120℃で乾燥後、アルゴンガス中で1400℃で加
熱し熔着した。
After drying at about 120°C, it was heated at 1400°C in an argon gas to fuse.

抵抗値5.5KΩの発熱体が得られた。A heating element with a resistance value of 5.5 KΩ was obtained.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図ないし第4図は本方法を適用した各具体例を説明
するための斜視図である。 1・・・・・・炭化珪素端子、2・・・・・・糊状混合
物、3・・・・・・炭化珪素発熱体、5・・・・・・セ
ラミック管状発熱体、6・・・・・・セラミック管状端
子、8・・・・・・セラミック質抵抗体、9・・・・・
・タングステン線。
1 to 4 are perspective views for explaining each specific example to which this method is applied. DESCRIPTION OF SYMBOLS 1...Silicon carbide terminal, 2...Glue mixture, 3...Silicon carbide heating element, 5...Ceramic tubular heating element, 6... ... Ceramic tubular terminal, 8 ... Ceramic resistor, 9 ...
・Tungsten wire.

Claims (1)

【特許請求の範囲】[Claims] 1 金属とセラミックス又はセラミックスどうしを接合
する方法において、直径300μm以下の金属珪素粉末
又は珪素合金粉末と有機バインダーを混合し、その糊状
混合物を用いて両者を仮接着し、1300〜1550℃
の温度で加熱して熔着させることを含む上記接合方法。
1 In a method for joining metal and ceramics or ceramics to each other, a metal silicon powder or silicon alloy powder with a diameter of 300 μm or less is mixed with an organic binder, and the two are temporarily bonded using the glue-like mixture, and the temperature is 1300 to 1550°C.
The above joining method includes heating and welding at a temperature of .
JP53003478A 1978-01-17 1978-01-17 Heat resistant joining method Expired JPS586714B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP53003478A JPS586714B2 (en) 1978-01-17 1978-01-17 Heat resistant joining method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP53003478A JPS586714B2 (en) 1978-01-17 1978-01-17 Heat resistant joining method

Publications (2)

Publication Number Publication Date
JPS5496512A JPS5496512A (en) 1979-07-31
JPS586714B2 true JPS586714B2 (en) 1983-02-05

Family

ID=11558436

Family Applications (1)

Application Number Title Priority Date Filing Date
JP53003478A Expired JPS586714B2 (en) 1978-01-17 1978-01-17 Heat resistant joining method

Country Status (1)

Country Link
JP (1) JPS586714B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS634838Y2 (en) * 1983-07-12 1988-02-08

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DK38981A (en) * 1981-01-29 1982-07-30 Danfoss As METHOD FOR CONNECTING REACTIONAL SUBSTANCES OF SILICON CARBID WITH SUBSTANCES OF IRON OR METAL AND IONIZATION ELECTRODE PREPARED BY THE MOTOD

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS634838Y2 (en) * 1983-07-12 1988-02-08

Also Published As

Publication number Publication date
JPS5496512A (en) 1979-07-31

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