JPS5867088A - Light probe head - Google Patents

Light probe head

Info

Publication number
JPS5867088A
JPS5867088A JP16682981A JP16682981A JPS5867088A JP S5867088 A JPS5867088 A JP S5867088A JP 16682981 A JP16682981 A JP 16682981A JP 16682981 A JP16682981 A JP 16682981A JP S5867088 A JPS5867088 A JP S5867088A
Authority
JP
Japan
Prior art keywords
optical fiber
light receiving
light
light emitting
contacted
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16682981A
Other languages
Japanese (ja)
Inventor
Shuji Kondo
修司 近藤
Masaharu Noyori
野依 正晴
Tsuyoshi Shiragasawa
白ケ沢 強
Yoshiro Nakada
義朗 中田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP16682981A priority Critical patent/JPS5867088A/en
Publication of JPS5867088A publication Critical patent/JPS5867088A/en
Pending legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/36Mechanical coupling means
    • G02B6/38Mechanical coupling means having fibre to fibre mating means
    • G02B6/3807Dismountable connectors, i.e. comprising plugs
    • G02B6/3833Details of mounting fibres in ferrules; Assembly methods; Manufacture
    • G02B6/3847Details of mounting fibres in ferrules; Assembly methods; Manufacture with means preventing fibre end damage, e.g. recessed fibre surfaces

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Semiconductor Lasers (AREA)

Abstract

PURPOSE:To maintain at constant value the clearance between the light emitting part and the light receiving plane of an element to be tested and improve the reproducibility of the test, by projecting the fringe part of the optical fiber end part from the central part, and providing an abrasion resistant member on the fringe part. CONSTITUTION:An outer coating material 9 is formed around the optical fiber with a clad part 8, and a metallic sheath material 11 is constituted outside. The end part 11' of said metallic sheath material 11 has a conical aperture part, and on the top end a thin disc 13 which has a through hole 12 at the center and is constituted of Al2O3 crystal such as sapphire or of a material excellent in abrasion resistance such as a super steel alloy is fixed in a structure of slight projection from the top end part of the sheath material 11 by fitting or adhesion. The part contacted on the surface of the light emitting element to be tested is constituted of a material high in abrasion resistance, and the abrasion of the contacted part is not generated against repeated probings resulting in the prevention of damages of the light receiving part of an optical fiber. Since the clearance between the light receiving part and the contacted part is constantly maintained, the improvement of the reproducibility of the light receiving characteristic during probing can be realized.

Description

【発明の詳細な説明】 本発明は、発光ダイオード或は半導体レーザ等を用いた
光集積回路(以下光ICとよぶ)の発光出力を検出する
光プローブヘッドに関するものである。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an optical probe head for detecting the light emission output of an optical integrated circuit (hereinafter referred to as an optical IC) using a light emitting diode, a semiconductor laser, or the like.

通常の半導体集積回路(IC,LSI)のウェハー状態
における検査においては、検査装置と被検査半導体集積
回路間における電気信号の授受を、耐磨耗性の高いタン
グステン鋼等の金属細線を用いたプローブヘッドを用い
ている。
In normal testing of semiconductor integrated circuits (IC, LSI) in the wafer state, electrical signals are exchanged between the test equipment and the semiconductor integrated circuit under test using a probe using a thin metal wire made of highly wear-resistant tungsten steel or the like. head is used.

−力先IC等の検査においては、電気信号の授受と共に
、光信号の授受を効率良く行なえることが、検査機のプ
ローブヘッドとしての重要な条件2ペーミ。
- In testing ICs and the like, the ability to efficiently send and receive optical signals as well as electrical signals is an important condition for the probe head of the testing machine.

となる。becomes.

光ICの検査用プローブヘッドは、被検査光ICより照
射される光を、高効率で受光し検査機本体へ導入するラ
イトガイド、いわゆるファイバーグラスによシ構成され
るが、同プローブヘッドの先端受光面の光学的機能を、
長期間にわたり損なわないような構造とする必要がある
The probe head for testing optical ICs is composed of a so-called fiberglass light guide that receives the light emitted from the optical IC to be tested with high efficiency and introduces it into the main body of the testing machine. The optical function of the light receiving surface,
It is necessary to have a structure that will not be damaged over a long period of time.

すなわち、従来において、光IC等のレーザダイオード
、或は発光ダイオードの放射光を、搬送する光ファイバ
ーと、該発光素子との接合の構成には第1図(ム)、申
)に示されるよりな゛ものがあった。
That is, conventionally, the structure of the junction between the light emitting element and the optical fiber that conveys the emitted light of a laser diode such as an optical IC or a light emitting diode is as shown in FIG.゛There was something.

第1図(ム)は受光面1を乱反射の無い鏡面に仕上げた
光ファイバー2を、発光素子3の放射面4に樹脂6で接
合固着する構成を示す。第1図中)は発光素子3の放射
面4の近傍にレンズ構造6を有した受光面1を持つ光フ
ァイバー2を設置する構成を示す。
FIG. 1(m) shows a configuration in which an optical fiber 2 whose light-receiving surface 1 is finished as a mirror without diffused reflection is bonded and fixed to a radiation surface 4 of a light-emitting element 3 with a resin 6. 1) shows a configuration in which an optical fiber 2 having a light-receiving surface 1 having a lens structure 6 is installed near a radiation surface 4 of a light-emitting element 3.

以上のように第1図(ム) 、 (B)は発光ダイオー
ドと光ファイバーの接続構成を示すが、発光素子の発光
出力1発光効率等をウェハー或はチップ状態噂37・−
S・ で検査する検査装置の場合、微細領域より放射される光
を、光検出装置本体へ損失を少く導入する必要が有り、
光プローブヘッドの受光面は常に乱反射の無い平滑面を
保持させる必要がある。
As mentioned above, FIGS. 1(M) and 1(B) show the connection configuration of a light emitting diode and an optical fiber, but the light emitting output 1 luminous efficiency of the light emitting element, etc. can be determined based on the state of the wafer or chip.
In the case of an inspection device that inspects with S., it is necessary to introduce the light emitted from the microscopic area into the main body of the photodetector with little loss.
The light receiving surface of the optical probe head must always maintain a smooth surface without diffused reflection.

しかし、光プローブヘッドは、被検査素子である発光素
子表面に圧接、或は数μmの間隔をおいて近接設置を常
時多数回繰返すため、光プローブヘッド表面(受光面)
の損傷を招来し、光プa −ブヘッドとしての機能を損
なうことになる。
However, the optical probe head is repeatedly placed in pressure contact with the surface of the light-emitting element, which is the device to be tested, or placed in close proximity with an interval of several micrometers.
This may cause damage to the optical fiber head and impair its function as an optical fiber head.

上述したように光プローブヘッドを用いて、発光素子の
発光効率等の測定を行なう場合、その性質上電気的プロ
ーブヘッドと同様にヘッド先端部の耐磨耗性及び耐損傷
性を上げることが′重要な課題となる為、先にも述べた
ように第2図の如く光ファイバー2のコア部7及びクラ
ッド部8を直接被検査素子3の光放射部4に接触させる
ことは、受光面1を損傷させる為好ましくない。そこで
第3図の如く光ファイバー2の外覆部9及び補強シース
部1oより、コア7及びクラッド8を少し短くして光フ
アイバー2本体の受光面1を数μm以・被検査素子との
接触で生じる受光面1部の損傷が防止出来るが、周知の
如く検査用プローブヘッドはその機能上、被検査素子に
対し多数回の圧接を繰返すため、光ファイバーに使用さ
れている、外覆部9及びシース材1oである樹脂材料(
シリコン樹脂、ウレタン樹脂等)は容易に磨耗し、光フ
ァイバー2の受光面を傷つけることになる。
As mentioned above, when measuring the luminous efficiency of a light emitting element using an optical probe head, it is necessary to increase the abrasion resistance and damage resistance of the tip of the head due to its nature. As mentioned above, bringing the core part 7 and cladding part 8 of the optical fiber 2 into direct contact with the light emitting part 4 of the device under test 3 as shown in FIG. This is not desirable as it may cause damage. Therefore, as shown in Fig. 3, the core 7 and cladding 8 are made a little shorter than the outer covering part 9 and reinforcing sheath part 1o of the optical fiber 2, so that the light-receiving surface 1 of the optical fiber 2 body can be kept in contact with the device under test by several micrometers. This can prevent damage to one part of the light-receiving surface, but as is well known, the test probe head repeatedly presses against the device to be tested many times due to its function, so the outer sheath 9 and sheath used in optical fibers are damaged. Resin material which is material 1o (
(silicone resin, urethane resin, etc.) are easily worn out and damage the light receiving surface of the optical fiber 2.

また光プローブヘッドにおいて結合損失が減少するのを
防止ために、第1図(B)に示した先端レンズ構造の光
ファイバーを使用した場合においても、光フアイバー先
端と、発光素子の間隙を一定に保つため、第4図の如く
、シース材10等で間隙保持を行なう必要が有るが、上
述したような問題が発生する。
In addition, in order to prevent coupling loss from decreasing in the optical probe head, the gap between the optical fiber tip and the light emitting element is kept constant even when using an optical fiber with the tip lens structure shown in Figure 1 (B). Therefore, as shown in FIG. 4, it is necessary to maintain the gap using a sheath material 10 or the like, but this causes the above-mentioned problems.

本発明は上記従来の光プローブヘッドにおける先端部の
損傷、磨耗を防止することを目的、とする。
An object of the present invention is to prevent damage and wear to the tip of the conventional optical probe head.

以下本発明の実施例を図面にもとづいて説明する。Embodiments of the present invention will be described below based on the drawings.

第6図は本発明の一実施例における光プローブ′6ベー
・・ ヘッドの正面断面図、第6図は第5図の底面図を示して
いる。なお、従来例と同一箇所には同一番号を付してい
る。これらの図に示す如く、クラッド部8の外径が10
0〜150μmである光ファイバーに外覆材9を形成し
、さらにその外側には、金属性シース材11を構成する
。同金属シース材11の端部11′は円錐状の開口部を
有し、同先端部には中央部に貫通孔12を有するサファ
イア等のム120s結晶、或は超鋼合金等の耐磨耗性の
秀れた材質よりなる薄円豚13が嵌合或は接着により、
シース材11先端部より若干突出した構造で固着されて
い、る。
FIG. 6 shows a front sectional view of an optical probe '6 head in one embodiment of the present invention, and FIG. 6 shows a bottom view of FIG. 5. Note that the same numbers are given to the same parts as in the conventional example. As shown in these figures, the outer diameter of the cladding part 8 is 10
A sheathing material 9 is formed on the optical fiber having a thickness of 0 to 150 μm, and a metallic sheathing material 11 is further formed on the outside thereof. The end portion 11' of the metal sheath material 11 has a conical opening, and the tip portion is made of a 120s crystal such as sapphire or a wear-resistant material such as super steel alloy with a through hole 12 in the center. By fitting or gluing the thin circular pig 13 made of a material with excellent properties,
The sheath material 11 is fixed in a structure that protrudes slightly from the tip.

実施例の光プローブヘッドでは、上述の如く、被検査発
光素子表面に接触する部位が、耐磨耗性の高い材質で構
成されて居シ、繰返しのブロービングに対しても、接触
部位の磨耗が無く、光ファイバーの受光部を損傷するこ
とが防止される。また、受光部と接触部間の隔隙が常に
一定に保持さ1れるため、ブロービング時の受光特性の
再現性の゛向上を計ることが出来る。        
  −例を示している。光ファイバーの受光部は、先ノ
実施例を示す第6図においては、平面形状の場合で示し
たが、同部を結合損失の少ない(平面形状に対して捧〜
晃の損失)形状である先端レンズ結合構造の場合につい
ても第7図に示す如き構造とすることで、同一の効果が
容易に得ることが出来る。
In the optical probe head of the example, as described above, the part that contacts the surface of the light emitting element to be inspected is made of a material with high wear resistance, and even with repeated blobbing, the contact part does not wear out. This prevents damage to the light receiving section of the optical fiber. In addition, since the gap between the light receiving part and the contact part is always kept constant, it is possible to improve the reproducibility of the light receiving characteristics during blowing.
- Shows examples. Although the light-receiving part of the optical fiber is shown in the case of a planar shape in FIG.
The same effect can be easily obtained even in the case of a tip lens coupling structure having a (low loss) shape by using a structure as shown in FIG.

なお、接触部の薄円板13は、嵌合、或は接着構造とし
ている為、同部が損傷した場合、同薄円板13の交換の
みで、光プローブ本体は半永久的に作用することが可能
である。
Note that the thin disc 13 at the contact part has a fitting or adhesive structure, so if this part is damaged, simply replacing the thin disc 13 will keep the optical probe body functioning semi-permanently. It is possible.

第8図、第9図は発光素子3と光プローブヘッド2との
結合損失を小さくした構造の本発明のさらに他の実施例
における光プローブヘッドの実施例である。結合損失を
下げる結合構成としては、発光素子と光フアイバー間に
球レンズを使用する方法があるが1本実施例では第8図
、第9図に示す如く、薄円板13の一主面部に、球レン
ズ保持用の薄層部14を形成し、同薄層部14に対しぞ
も同心円状の開孔部を開孔し、同開孔部に対し、球レン
ズ15を工大保持させた構造の光プローブヘッドである
。この光プロ6−プヘツドにおいて、集光用の球レンズ
16の面は、耐磨耗用の高い薄円板13の一主面で保持
されており、被検査用発光素子表面に接触することが無
いため、長時間にわたり、集光レンズとしての機能を保
持することが出来る。
FIGS. 8 and 9 show an optical probe head according to still another embodiment of the present invention, which has a structure in which the coupling loss between the light emitting element 3 and the optical probe head 2 is reduced. As a coupling configuration for reducing coupling loss, there is a method of using a ball lens between the light emitting element and the optical fiber, but in this embodiment, as shown in FIGS. A structure in which a thin layer 14 for holding a ball lens is formed, a concentric hole is formed in the thin layer 14, and a ball lens 15 is held in the hole. This is an optical probe head. In this optical processor 6-head, the surface of the condensing ball lens 16 is held by one main surface of a highly wear-resistant thin disk 13, so that it cannot come into contact with the surface of the light emitting element to be inspected. Because there is no lens, it can maintain its function as a condensing lens for a long time.

以上説明したように本発明の光プローブヘッドを用いる
事により、光I(j或は発光ダイオード等のウェハー状
態、及びチップ状態での光出力の検査時において、光プ
ローブの受光面が、耐磨耗性の高い薄日盤で保護され、
受光面に損傷が与えられる事がなく、また被検査素子の
発光部と受光面の間隙を常に一定状態に保持出来るため
、検査の再現性を著しく向上させる事が可能となる。
As explained above, by using the optical probe head of the present invention, the light-receiving surface of the optical probe can be polished while inspecting the optical output of light I(j) or light emitting diode in wafer state and chip state. Protected by a thin sun disc that is highly abrasive,
Since the light-receiving surface is not damaged and the gap between the light-emitting part of the device to be inspected and the light-receiving surface can always be kept constant, it is possible to significantly improve the reproducibility of inspection.

【図面の簡単な説明】[Brief explanation of drawings]

第1図(ム) 、 (B)は一般的な発光ダイオードと
光ファイバーの接続構成を示す図、第2図、第3図およ
び第十図はそれぞれ、従来の発光ダイオードめ係を示す
断面図、第5図は本発明の一実施例における光プローブ
ヘッドの断面図、第6図は同光プローブヘッドの底面図
、第7図は本発明の他の実施例における光プローブヘッ
ドの断面図、第8図は本発明のさらに他の実施例におけ
る光プローブヘッドの断面図、第9図は第8図のプロー
ブ先端部の構造を示す断面図である。 1・・・・・・光ファイバーの受光面、2・・・・・・
光ファイバー、3・・・・・・被検査用発光素子、4・
・・・・・発光放射面、9・・・・・・光ファイバーの
外覆、10・・・・・・シース材、11・・・・・・金
属シース%13・・・・・・薄円板、15・・・・・・
球レンズ。 代理人の氏名 弁理士 中 尾 敏 男 ほか1名Jl
i1図 第21!! 13  図 14図 第5図 16図 17図 第8図 第9図
Figures 1 (M) and (B) are diagrams showing the connection configuration of a general light emitting diode and an optical fiber, and Figures 2, 3, and 10 are cross-sectional views showing a conventional light emitting diode connection, respectively. 5 is a sectional view of an optical probe head in one embodiment of the present invention, FIG. 6 is a bottom view of the same optical probe head, and FIG. 7 is a sectional view of an optical probe head in another embodiment of the present invention. FIG. 8 is a cross-sectional view of an optical probe head in still another embodiment of the present invention, and FIG. 9 is a cross-sectional view showing the structure of the probe tip of FIG. 8. 1... Light-receiving surface of optical fiber, 2...
Optical fiber, 3... Light emitting element to be inspected, 4.
...Light emission surface, 9 ... Outer covering of optical fiber, 10 ... Sheath material, 11 ... Metal sheath %13 ... Thin circle Board, 15...
ball lens. Name of agent: Patent attorney Toshio Nakao and one other Jl
i1 figure 21! ! 13 Figure 14 Figure 5 Figure 16 Figure 17 Figure 8 Figure 9

Claims (1)

【特許請求の範囲】[Claims] 光フアイバ一端部の周縁部を上記光ファイバーの中心部
よシ突出せしめ、上記周縁部に耐磨耗性部材を設けたこ
とを特徴とする光プローブヘッド。
An optical probe head characterized in that a peripheral edge of one end of an optical fiber projects beyond the center of the optical fiber, and a wear-resistant member is provided on the peripheral edge.
JP16682981A 1981-10-19 1981-10-19 Light probe head Pending JPS5867088A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16682981A JPS5867088A (en) 1981-10-19 1981-10-19 Light probe head

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16682981A JPS5867088A (en) 1981-10-19 1981-10-19 Light probe head

Publications (1)

Publication Number Publication Date
JPS5867088A true JPS5867088A (en) 1983-04-21

Family

ID=15838426

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16682981A Pending JPS5867088A (en) 1981-10-19 1981-10-19 Light probe head

Country Status (1)

Country Link
JP (1) JPS5867088A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0285493A2 (en) * 1987-03-23 1988-10-05 Optomistic Products Apparatus for testing light-emitting devices
JP2021061290A (en) * 2019-10-04 2021-04-15 株式会社日本マイクロニクス Optical probe, optical probe array, inspection system, and inspection method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0285493A2 (en) * 1987-03-23 1988-10-05 Optomistic Products Apparatus for testing light-emitting devices
JP2021061290A (en) * 2019-10-04 2021-04-15 株式会社日本マイクロニクス Optical probe, optical probe array, inspection system, and inspection method

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