JPS5864723A - Temperature protecting switch - Google Patents

Temperature protecting switch

Info

Publication number
JPS5864723A
JPS5864723A JP16378581A JP16378581A JPS5864723A JP S5864723 A JPS5864723 A JP S5864723A JP 16378581 A JP16378581 A JP 16378581A JP 16378581 A JP16378581 A JP 16378581A JP S5864723 A JPS5864723 A JP S5864723A
Authority
JP
Japan
Prior art keywords
temperature
sensitive
spring
hook body
sensitive spring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP16378581A
Other languages
Japanese (ja)
Other versions
JPH0421292B2 (en
Inventor
阿部 幸平
芦川 正高
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokin Corp
Original Assignee
Tohoku Metal Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tohoku Metal Industries Ltd filed Critical Tohoku Metal Industries Ltd
Priority to JP16378581A priority Critical patent/JPS5864723A/en
Publication of JPS5864723A publication Critical patent/JPS5864723A/en
Publication of JPH0421292B2 publication Critical patent/JPH0421292B2/ja
Granted legal-status Critical Current

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  • Thermally Actuated Switches (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】 本発明は、電子機器等の異常な温度上昇を検知し、予め
設定した温度を越えて機器又は部品の温度が上昇したと
き直ちに回路を遮断し装置・回路等を保護する温度スイ
ッチに関する。
Detailed Description of the Invention The present invention detects abnormal temperature rises in electronic equipment, etc., and immediately shuts off the circuit when the temperature of the equipment or parts rises above a preset temperature to protect the equipment, circuits, etc. related to temperature switches.

形状記憶合金は、温度の高い母相で一旦形状を成形し、
これを温度降下させてマルテンサイト変態で成形した形
状に再び戻るという極めて特異な特性を持っている。従
ってマルテンサイト状態がら母相に変態と、室温付近で
接点開閉。する温度とを一致せしめるように合金組成、
加工条件等を変えて製造した形状記憶合金を感温素子と
して用いることにより、室温付近の温度変化により形状
が変形することができる感温ばねを製造することができ
る。
Shape memory alloys are made by forming a shape in a high-temperature matrix,
It has an extremely unique property of returning to its formed shape through martensitic transformation when the temperature is lowered. Therefore, the martensitic state transforms to the parent phase, and the contacts open and close at around room temperature. alloy composition to match the temperature
By using a shape memory alloy manufactured under different processing conditions as a temperature-sensitive element, it is possible to manufacture a temperature-sensitive spring whose shape can be deformed by changes in temperature around room temperature.

また形状記憶合金は、温度の高い母相の状態にあるとき
と温度の低いマルテンサイト変態の状態にあるときとで
は、同じひずみ量に対する抗張力の値が母相変態時の場
合がマルテンサイト変態時より約3倍大きい。従ってこ
の特性を併せて利用することにより、温度応答が確実で
廉価なこの種のスイッチを構成することができる。
In addition, the shape memory alloy has a tensile strength value for the same amount of strain when it is in the high-temperature matrix state and when it is in the low-temperature martensitic transformation state. Approximately 3 times larger than Therefore, by utilizing these characteristics together, it is possible to construct a switch of this type that has a reliable temperature response and is inexpensive.

本発明はかかる点に鑑み、形状記憶合金の周囲温度の変
化によって形状の偏倚を生ずる特性を利用し、構造が蘭
学で確実に動作する温度保護スイッチを提案することを
主たる目的とする。
In view of this, the main object of the present invention is to utilize the property of shape memory alloys to cause deviations in shape due to changes in ambient temperature, and to propose a temperature protection switch whose structure operates reliably.

以下本発明の一実施例について図面を参照しながら詳細
に説明する。
An embodiment of the present invention will be described in detail below with reference to the drawings.

第1図は本発明の一例を示す温度保護スイッチの平面図
、第2図及び第3図は第1図中■−■線及びm−III
 a K Gった断面図である。いずれも保待状態を示
している。また第4図は第2図例の動作状態を示しスイ
ッチの開放状態を示している。
Fig. 1 is a plan view of a temperature protection switch showing an example of the present invention, and Figs. 2 and 3 are the lines ■-■ and m-III in Fig. 1.
FIG. All of them are in a pending state. Further, FIG. 4 shows the operating state of the example shown in FIG. 2, and shows the open state of the switch.

1は感温ばねな示し、形状記憶合金により形成される。1 indicates a temperature-sensitive spring, which is made of a shape memory alloy.

形状記憶合金は、温度が上昇して母相の組織に戻ると、
母相の状′態で予め成形された形状に戻る性質を有して
いるだめ、温度が上昇して母相の状態のときに、第4図
に示す如く、折曲された形状に成形しておく。従って形
状記憶合金がマルテンサイト変態から母相に組織が変化
すると、感温体20に密着していた感温げね1ば、第4
図に示す如く、元の成形形状に戻ることになる。第1図
乃至第3図において、2はフック体を示し、これはマル
テンサイト変態を保持する温度時において感温げね1と
係合するものであり、ばね材料が好適である。また形状
記憶合金は、マルテンサイト変態時と母相の状態のとき
とでは、同じひずみ量に対し抗張力の値に差があり、母
相の状態ではマルテンサイト状態の約3倍である。感温
ばね1の温度が上昇して母相の組織に戻るとき、感温ば
ね1の抗張力が増大し、フック体2との保合が急激に外
れ、第4図に示す如き元の形状に戻るように構成される
。尚、感温ばね1の先端及びフック体2の先端は互いに
係合の解除を容易にするだめ、先鋭状に形成される。
When the temperature rises and the shape memory alloy returns to its parent phase structure,
Since it has the property of returning to the preformed shape in the matrix state, when the temperature rises and the matrix state is in the matrix state, it is formed into a bent shape as shown in Figure 4. I'll keep it. Therefore, when the structure of the shape memory alloy changes from martensitic transformation to the matrix, the first and fourth temperature sensitive elements that were in close contact with the temperature sensitive element 20
As shown in the figure, it returns to its original molded shape. In FIGS. 1 to 3, reference numeral 2 denotes a hook body, which engages with the temperature-sensitive barb 1 at a temperature that maintains martensitic transformation, and is preferably made of a spring material. In addition, in shape memory alloys, there is a difference in tensile strength for the same amount of strain between the martensitic transformation and the matrix state, and the tensile strength in the matrix state is about three times that of the martensitic state. When the temperature of the temperature-sensitive spring 1 rises and returns to the matrix structure, the tensile strength of the temperature-sensitive spring 1 increases, and the connection with the hook body 2 is suddenly released, returning to the original shape as shown in FIG. Configured to return. Incidentally, the tip of the temperature-sensitive spring 1 and the tip of the hook body 2 are formed into a sharp point so that they can be easily released from each other.

可動接点4aは絶縁板10を介して感温ばね1に固定さ
れているだめ、感温ばね1の変形に応じて固定接点4b
と接触離間する。そして可動接点4aは基台12に設け
た一方の端子7aに電気的に接続するだめのリード線9
によって接続される。
Since the movable contact 4a is fixed to the temperature-sensitive spring 1 via the insulating plate 10, the fixed contact 4b changes depending on the deformation of the temperature-sensing spring 1.
Contact and separation. The movable contact 4a is a lead wire 9 that is electrically connected to one terminal 7a provided on the base 12.
connected by.

一方、固定接点4bは基台12に設けた他方の端子7b
に電気的に接続される。8は固定接点4bと端子7bと
を接続するだめの導体を示す。尚、フック体2はねじ6
により基台12に取付けられるが、感温ばね1との係合
力を調整するため、フック体2のねじ取付孔を長孔又は
入孔とすることにより摺動自材在に取付は得るように形
成される。
On the other hand, the fixed contact 4b is connected to the other terminal 7b provided on the base 12.
electrically connected to. Reference numeral 8 indicates a conductor for connecting the fixed contact 4b and the terminal 7b. In addition, the hook body 2 has a screw 6
However, in order to adjust the engagement force with the temperature-sensitive spring 1, the screw mounting hole of the hook body 2 is made into a long hole or an entry hole, so that it can be mounted in a sliding manner. It is formed.

以上の構成になる温度保護スイッチは、感温体20例え
ば電子機器等の発熱箇所に対し、取付用ねじ孔11を用
いてねじ止めされる。尚、5は。
The temperature protection switch configured as described above is screwed to a heat-generating portion of the temperature sensing element 20, for example, an electronic device, using the mounting screw hole 11. In addition, 5.

感応して折曲した感温げね1をフック体2と再び保合さ
せるだめの押子を示す。
A pusher is shown for reattaching the temperature-sensitive bar 1 which has been bent in response to the hook body 2.

次に本発明スイッチの動作について説明する。Next, the operation of the switch of the present invention will be explained.

形状記憶合金より成る感温ばね1は母相状態の温度で第
4図に示す如き形状に予め成形し、母相での形状を記憶
させる。感温ばね1は成形した母相温度より降下したマ
ルテンサイト変態の状態になっても外力を加えない限カ
母相で成形されたときの形状を保持しているが、マルテ
ンサイト変態時における感温ばね1の変形に要する力は
母相のときの約1/3になるため、感温ばね1は押子5
を押圧することにより容易に変形して第2図に示す如き
形状に戻る。そして感温ばね1とフック体2との保合に
よって感温体20に密着される。
The temperature-sensitive spring 1 made of a shape memory alloy is preformed into a shape as shown in FIG. 4 at the temperature of the matrix state, so that the shape in the matrix state is memorized. Even if the temperature-sensitive spring 1 reaches the state of martensitic transformation, which is lower than the temperature of the matrix in which it was molded, it retains the shape it had when it was molded in the matrix as long as no external force is applied. Since the force required to deform the warm spring 1 is approximately 1/3 of that in the matrix, the temperature sensitive spring 1 is
By pressing , it is easily deformed and returns to the shape shown in FIG. The thermosensing spring 1 and the hook body 2 are held in close contact with the thermosensor 20.

そして端子7a、7bに電気回路を接続することにより
、感温ばね1の作動によって回路を開放することができ
る。すなわち第1図乃至第3図に示す如く、接点4a、
4bが閉状態にあるとき、感温ばね1の温度が異常昇温
によって母相変態温度に近づくと、感温ばね1は抗張力
が増大してフック体2との保合に抗して急激に変形し、
接点間を瞬間的に開放する。従って機器の異常温度状態
になると回路を遮断して機器を保護することができる。
By connecting an electric circuit to the terminals 7a and 7b, the circuit can be opened by operating the temperature-sensitive spring 1. That is, as shown in FIGS. 1 to 3, the contacts 4a,
4b is in the closed state, when the temperature of the temperature-sensitive spring 1 approaches the parent phase transformation temperature due to an abnormal temperature rise, the tensile strength of the temperature-sensitive spring 1 increases, and the temperature-sensitive spring 1 suddenly resists the retention with the hook body 2. deformed,
Instantly opens the contacts. Therefore, when the equipment reaches an abnormal temperature state, the circuit can be cut off to protect the equipment.

異常温が解消されると共に感温ばね1の温度も降下して
マルテンサイト変態になると、再び押子5を押圧して磁
感温ばね1とフック体2との保合状態を保持せしめ得る
When the abnormal temperature is eliminated and the temperature of the temperature-sensitive spring 1 is also lowered to undergo martensitic transformation, the pusher 5 can be pressed again to maintain the state of engagement between the magnetic temperature-sensitive spring 1 and the hook body 2.

以上述べた如く本発明によれば、形状記憶合金より成る
感温ばねと、該感温ばねと解除可能に係合されるフック
体とより構成され、上記感温ばねは感温体に接し、上記
感温ばねが作動して上記フック体との係合が解除して接
点を開閉するように構成1−だので、上記感温体の異常
温度上昇により電子機器内の回路を損傷する以前に回路
を遮断することができるため、温度保護の効果がある。
As described above, the present invention includes a temperature-sensitive spring made of a shape memory alloy, a hook body releasably engaged with the temperature-sensing spring, and the temperature-sensitive spring is in contact with the temperature-sensitive body, Since the temperature-sensing spring operates and disengages from the hook body to open and close the contact, the circuit in the electronic device can be prevented from being damaged due to abnormal temperature rise of the temperature-sensing body. Since the circuit can be cut off, it has the effect of temperature protection.

しかも感温ばねは感温体と直接接触しているため、感温
反応速度が速く、かつ感温ばねの小型化にも寄与するこ
とができる。またフック体2は感温ばね1との係合量を
調整するため摺動し得るだめ、感温ばね1の母相時の抗
張力、フック体2のたわみ力1作動温度設定の任意の選
択が容易に行ない得る。
Moreover, since the temperature-sensitive spring is in direct contact with the temperature-sensitive body, the temperature-sensing reaction speed is fast, and it can also contribute to miniaturization of the temperature-sensitive spring. In addition, the hook body 2 can be slid to adjust the amount of engagement with the temperature-sensitive spring 1, and the tensile strength of the temperature-sensitive spring 1 at its parent phase and the operating temperature of the deflection force of the hook body 2 can be arbitrarily selected. It can be done easily.

更に感温ばね1の先端には、フック体2の先端との係合
を容易にするため、感温体20に対する側を削り取り段
付きに形成しているだめ、押子5の抑圧による感温ばね
1とフック体2との係合が容易である。
Furthermore, the tip of the temperature-sensing spring 1 is formed with a step by cutting off the side facing the temperature-sensing body 20 in order to facilitate engagement with the tip of the hook body 2. The spring 1 and the hook body 2 can be easily engaged.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本発明の一例を示す平面図、第2図は第1図中
■−■線断面図、第3図は第1図中DI−■線断面図、
第4図は本発明スイッチの作動状態の説明に供する図で
ある。 1・・・感温ばね、2・・・フック体、4a、4b・・
・夫夫接点。 代理人 解理士 秋  山   高
FIG. 1 is a plan view showing an example of the present invention, FIG. 2 is a cross-sectional view taken along the line ■-■ in FIG. 1, and FIG. 3 is a cross-sectional view taken along the line DI--■ in FIG.
FIG. 4 is a diagram for explaining the operating state of the switch of the present invention. 1... Temperature-sensitive spring, 2... Hook body, 4a, 4b...
・Husband contact point. Agent Anatomist Takashi Akiyama

Claims (1)

【特許請求の範囲】[Claims] 形状記憶合金より成る感温ばねと、該感温ばねと解除可
能忙係合されるフック体とより構成され、上記感温ばね
は感温体に接し、上記感温ばねが作動、して上記フック
体との保合が解除して接点を開閉するようにしたことを
特徴とする温度保護スイッチ0
It is composed of a temperature-sensitive spring made of a shape memory alloy, and a hook body that is releasably engaged with the temperature-sensing spring, and the temperature-sensitive spring is in contact with the temperature-sensitive body, and the temperature-sensitive spring is actuated to cause the above-mentioned Temperature protection switch 0 characterized in that the contact opens and closes when the connection with the hook body is released.
JP16378581A 1981-10-13 1981-10-13 Temperature protecting switch Granted JPS5864723A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16378581A JPS5864723A (en) 1981-10-13 1981-10-13 Temperature protecting switch

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16378581A JPS5864723A (en) 1981-10-13 1981-10-13 Temperature protecting switch

Publications (2)

Publication Number Publication Date
JPS5864723A true JPS5864723A (en) 1983-04-18
JPH0421292B2 JPH0421292B2 (en) 1992-04-09

Family

ID=15780658

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16378581A Granted JPS5864723A (en) 1981-10-13 1981-10-13 Temperature protecting switch

Country Status (1)

Country Link
JP (1) JPS5864723A (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5291178A (en) * 1976-01-26 1977-08-01 Aisin Seiki Bimetal type temperature switching device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5291178A (en) * 1976-01-26 1977-08-01 Aisin Seiki Bimetal type temperature switching device

Also Published As

Publication number Publication date
JPH0421292B2 (en) 1992-04-09

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