JPS5863773A - Bonding layer for composite material - Google Patents

Bonding layer for composite material

Info

Publication number
JPS5863773A
JPS5863773A JP16311481A JP16311481A JPS5863773A JP S5863773 A JPS5863773 A JP S5863773A JP 16311481 A JP16311481 A JP 16311481A JP 16311481 A JP16311481 A JP 16311481A JP S5863773 A JPS5863773 A JP S5863773A
Authority
JP
Japan
Prior art keywords
bonding layer
composite material
adhesive layer
prepared
crosslinking
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16311481A
Other languages
Japanese (ja)
Inventor
Yoshiaki Matsuga
松賀 義明
Osao Kamata
鎌田 長生
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Cable Ltd
Original Assignee
Hitachi Cable Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Cable Ltd filed Critical Hitachi Cable Ltd
Priority to JP16311481A priority Critical patent/JPS5863773A/en
Publication of JPS5863773A publication Critical patent/JPS5863773A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/38Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive

Landscapes

  • Adhesives Or Adhesive Processes (AREA)

Abstract

PURPOSE:The titled bonding layer, prepared by crosslinking the bonding layer under irradiation with electron rays in forming a composite material having the bonding layer consisting of a resin material on the surface of a metallic foil, etc., and having improved bonding strength and heat, solvent, and stress cracking resistance. CONSTITUTION:A bonding layer prepared by irradiating a bonding layer prepared by extruding a silane-modified polyolefin (copolymer) film on the surface of a metallic foil, e.g. a copper foil, or a metallic filament, e.g. a copper filament, and fusing the resultant bonding layer at the same temperature as the extrusion temperature or a preheating temperature above the extrusion temperature to form a composite material with electron rays, preferably at >=10 Mrad absorbed dose. EFFECT:Improved bonding strength at high temperatures.

Description

【発明の詳細な説明】 本発明は、複合材用接着層の改良に関するものである。[Detailed description of the invention] The present invention relates to improvements in adhesive layers for composite materials.

従来から積層材と称する複合材は、当初接着剤の塗布か
ら始まったことは衆知のところである。
It is well known that composite materials, traditionally referred to as laminate materials, were first developed by applying adhesives.

しかしながら、溶解する溶剤の引火性、公害性が問題と
なるに及んで、接着剤は徐々にホットメルト、フィルム
タイプへと移行しつつある。但し、ホットメルトは、融
点、M工(溶融粘度指数)に種々差があり、取り扱い易
い簡便さはあるが、耐熱性その他に一長一短がある。ま
た、フィルムタイプは、使い易いが、厚さが限定される
とか、熱可塑性ポリマーの場合には耐熱性に問題がある
However, as the flammability and pollution of the solvent used to dissolve adhesives become a problem, adhesives are gradually shifting to hot-melt and film-type adhesives. However, hot melts have various differences in melting point and M (melt viscosity index), and although they are easy to handle, they have advantages and disadvantages in heat resistance and other aspects. Furthermore, although film types are easy to use, they have limited thickness, and in the case of thermoplastic polymers, there are problems with heat resistance.

また、一部熱硬化性フィルムにおいてはキュア(硬化接
着時間)の問題が生産上の隘路となっている。
In addition, in some thermosetting films, the problem of curing (curing and adhesion time) is a bottleneck in production.

本発明は上記の状況に鑑みなされたものであり、接着強
度、耐熱性、耐溶媒性、耐ストレスクラツキング性を向
上できる複合材用接着層を提供することを目的としたも
のである。
The present invention was made in view of the above situation, and an object of the present invention is to provide an adhesive layer for composite materials that can improve adhesive strength, heat resistance, solvent resistance, and stress cracking resistance.

本発明の複合材用接着層は、金属箔または金属条の表面
に樹脂材からなる接着層を介在させて複合材を形成して
カリ、上記接着層が電子線により照射−し架橋されてな
るものである。
The adhesive layer for a composite material of the present invention is obtained by interposing an adhesive layer made of a resin material on the surface of a metal foil or metal strip to form a composite material, and then crosslinking the adhesive layer by irradiating it with an electron beam. It is something.

以下本発明の複合材用接着層の実施例を説明する。Examples of the adhesive layer for composite materials of the present invention will be described below.

銅箔あるいは銅条を始めとする金属箔、金属条にシ2ン
変性ポリオレフィンあるいはシラン変性ポリオレフィン
共重合体フィルムを、押出しと同時に押出温度と同じか
あるいは押出温度以上の予熱温度で融着させ複合体を形
成させたとき、この接着層は縮合剤を含まない。このた
め、熱可塑性樹脂であり、変性によって溶融粘度指数は
115〜1/7に減少して分子量は増大するが、同、耐
熱、耐薬品性、耐油耐溶剤性に問題があり、これを解決
するために架橋構造とすることが考えられる。
Copper foil or copper strip or other metal foil or metal strip is bonded with silane-modified polyolefin or silane-modified polyolefin copolymer film at the same time as extrusion at a preheating temperature that is the same as or higher than the extrusion temperature. When the body is formed, this adhesive layer is free of condensing agents. Therefore, it is a thermoplastic resin, and when modified, the melt viscosity index decreases to 115 to 1/7 and the molecular weight increases, but it also has problems with heat resistance, chemical resistance, oil resistance, and solvent resistance. In order to do this, it is possible to create a cross-linked structure.

多くの高分子は放射線によって、粘度、平均分子量及び
枝分れが増加する。これらの変化は2つの分子相互の結
合に基づくものである。即ち、架橋とは放射線によって
側鎖結合が切断され、そのあとに出来たラジカルを通し
て隣接分子間に新な結合を生じる反応である。一般に、
高分子の主鎖がC−C結合しているビニル系高分子では
放射線効果と化学構造との間には一定の関係がある。若
し、高分子が(−cH,−0HR−)nなる構造をして
いれば架橋し、また、C−OH、−c (OH、) R
−)nなる構造をしていれば崩壊すると云うのが一般で
ある。
Radiation increases the viscosity, average molecular weight, and branching of many polymers. These changes are based on the binding of two molecules to each other. That is, crosslinking is a reaction in which side chain bonds are cleaved by radiation and new bonds are formed between adjacent molecules through the resulting radicals. in general,
In vinyl polymers whose main chain is C--C bonded, there is a certain relationship between the radiation effect and the chemical structure. If the polymer has the structure (-cH, -0HR-)n, it will be crosslinked, and C-OH, -c (OH,) R
-) It is generally said that if it has a structure n, it will collapse.

ここに、RはH,CHs、C6H、などの置換基を表わ
すがビニル系以外の高分子では必ずしもこの関係は成立
しない。
Here, R represents a substituent such as H, CHs, C6H, etc., but this relationship does not necessarily hold true for non-vinyl polymers.

放射線によってゲル化した高分子は三次元構造の巨大分
子となるので溶媒に溶けなくなる禮がこれは架橋度に依
存する。例えばポリエチレンを照射すると分子間に架橋
ができるので、十分に照射したものは、耐熱性、耐溶媒
性、対ストレスクラツキング性などが向上する。照射は
ほとんど容量の大きい電子加速器で発生した電子線で行
っている。耐熱性を持たせるように十分に架橋するには
10Mraa以上のかなり大きい吸収線量を要する。
Polymers gelled by radiation become macromolecules with a three-dimensional structure, so they become insoluble in solvents, but this depends on the degree of crosslinking. For example, when polyethylene is irradiated, crosslinking occurs between molecules, so those that are sufficiently irradiated will have improved heat resistance, solvent resistance, stress cracking resistance, etc. Most of the irradiation is performed using electron beams generated by high-capacity electron accelerators. A fairly large absorbed dose of 10 Mra or more is required to sufficiently crosslink the material to provide heat resistance.

電子線のように高線量率の放射線を用いると空中照射で
も効率よく架橋し得る。ポリエチレンのようなポリオレ
フィンの架橋は化学的外方法によっても行い得る。しか
し、化学方法は一般に高温を用いるので、肉の薄い既に
接着した板や薄いフィルムに行うのは困難であり、放射
線による処理が他の方法に比べて有利に行い得ると考え
ることができる。
When radiation with a high dose rate such as an electron beam is used, crosslinking can be efficiently achieved even during aerial irradiation. Crosslinking of polyolefins such as polyethylene can also be carried out by non-chemical methods. However, since chemical methods generally use high temperatures, they are difficult to apply to thin, already bonded plates or thin films, so radiation treatment may be considered more advantageous than other methods.

試料、約100fflll角、厚さ45μmの銅箔に上
記シラン変性ポリオレフィン接着層100μmを融着し
た銅箔の接着層側より7.35 M Vの照射電圧によ
り図に示す如き照射線量により照射した。
A sample, a copper foil of about 100 fflll square and 45 μm thick, was irradiated from the adhesive layer side of the copper foil with 100 μm of the above silane-modified polyolefin adhesive layer fused at an irradiation voltage of 7.35 MV at an irradiation dose as shown in the figure.

このときの線量は次の如く計算される。The dose at this time is calculated as follows.

線量計算 1、35 MVX2 mA=2.7 X I D”W=
=2.7 X 10”ジュール2.7X10”ジュール
=2.7X10”エルグ1rad=IDoエルグ/gr 総線量 2.7X10111エルグ刈/100X(15秒X1/
2+5秒)=3,575X10sMrad/gr 利用効率は0.05〜0.15と経験的に知られている
ので、仮に0.01とすると約34 Mradとなる。
Dose calculation 1, 35 MVX2 mA=2.7 X I D”W=
=2.7 X 10" joule 2.7X10" joule = 2.7
2+5 seconds)=3,575×10sMrad/gr Since the utilization efficiency is empirically known to be 0.05 to 0.15, if it is set to 0.01, it becomes about 34 Mrad.

上記試料の接着強度試験の結果は第1〜第3表の第2表 第3表 第1〜3表に示す通り23℃及び110℃における剥離
荷重は顕著に相違が認められる。伺、各試料において2
個の数値のあるものは、小さな数値が剥離開始時のもの
であり、大きな数値は剥離完了時のものである。また、
数値が1個のものは剥離の開始と完了が同時のものの数
値である。
As shown in Tables 1 to 3 of the adhesive strength test results of the above samples, there is a significant difference in peel loads at 23°C and 110°C. 2 for each sample.
Among the numerical values, the smaller number is the value at the start of peeling, and the larger number is the value at the time the peeling is completed. Also,
If there is one number, the peeling starts and ends at the same time.

このように本実施例の複合材用接着層は、電子線照射に
よって架橋することにより、各温度において無処理品に
比較し接着強度を向上し比較的高温において著しく、ま
た、耐溶媒性、対ストレスクラツキング性も向上できる
As described above, the adhesive layer for composite materials of this example is crosslinked by electron beam irradiation, which improves adhesive strength compared to untreated products at various temperatures, and shows remarkable improvement in solvent resistance and resistance at relatively high temperatures. Stress cracking properties can also be improved.

以上記述した如く本発明の複合材用接着層は、接着強度
、耐熱性、耐溶媒性、対ストレスクラツキング性を向上
できる効果を有するものである。
As described above, the adhesive layer for composite materials of the present invention has the effect of improving adhesive strength, heat resistance, solvent resistance, and stress cracking resistance.

【図面の簡単な説明】[Brief explanation of the drawing]

図は本発明の複合材用接着層の実施例の電子線照射量説
明図である。 (杓仁”−4電娘贅雲1虐 −
The figure is an explanatory diagram of the amount of electron beam irradiation in an example of the adhesive layer for composite materials of the present invention. (Runnin” - 4 Denmusume Gakuun 1 Torture -

Claims (1)

【特許請求の範囲】[Claims] 1、金属箔まだは金属条の表面に樹脂材からなる接着層
を介在させて複合材を形成する複合材用接着層において
、上記接着層が電子線により照射し架橋されてなること
を特徴とする複合材用接着層。
1. An adhesive layer for a composite material in which a composite material is formed by interposing an adhesive layer made of a resin material on the surface of a metal foil or metal strip, characterized in that the adhesive layer is crosslinked by irradiation with an electron beam. Adhesive layer for composite materials.
JP16311481A 1981-10-13 1981-10-13 Bonding layer for composite material Pending JPS5863773A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16311481A JPS5863773A (en) 1981-10-13 1981-10-13 Bonding layer for composite material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16311481A JPS5863773A (en) 1981-10-13 1981-10-13 Bonding layer for composite material

Publications (1)

Publication Number Publication Date
JPS5863773A true JPS5863773A (en) 1983-04-15

Family

ID=15767425

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16311481A Pending JPS5863773A (en) 1981-10-13 1981-10-13 Bonding layer for composite material

Country Status (1)

Country Link
JP (1) JPS5863773A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6155270A (en) * 1984-08-27 1986-03-19 工業技術院長 Production of adhesive cloth

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6155270A (en) * 1984-08-27 1986-03-19 工業技術院長 Production of adhesive cloth

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