JPS5863599A - Induction missile - Google Patents

Induction missile

Info

Publication number
JPS5863599A
JPS5863599A JP16252481A JP16252481A JPS5863599A JP S5863599 A JPS5863599 A JP S5863599A JP 16252481 A JP16252481 A JP 16252481A JP 16252481 A JP16252481 A JP 16252481A JP S5863599 A JPS5863599 A JP S5863599A
Authority
JP
Japan
Prior art keywords
electronic devices
outer cylinder
shock absorber
axis
guided flying
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16252481A
Other languages
Japanese (ja)
Inventor
秀樹 渡辺
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP16252481A priority Critical patent/JPS5863599A/en
Publication of JPS5863599A publication Critical patent/JPS5863599A/en
Pending legal-status Critical Current

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  • Aiming, Guidance, Guns With A Light Source, Armor, Camouflage, And Targets (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】 この発明は外筒体内に複数の電子機器を実装した誘導飛
しよう体に関し、これら電子機器の実装方法、に係わる
ものである。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a guided flying object in which a plurality of electronic devices are mounted inside an outer cylinder, and a method for mounting these electronic devices.

誘導飛しよう体は周知のように広崗波帯域にわたる非常
に厳しい振動条件下にさらされるが。
Guided air vehicles are, as is well known, exposed to very severe vibration conditions over a wide frequency band.

とのような条件下において庵高い信頼性を維持しなけれ
はならない。
A high level of reliability must be maintained under such conditions.

ところが、近年におけるIC,L8工 勢の発、達に伴
い従来の半導体素子に比較してきわめて大型の電子部品
が電子機器内に装着される傾向に、あ冷。特に回路基板
上に増付けられたこれら大型の電子部品は過大な振幅を
伴う低周波共振状態に遭遇すると破損する危険があり、
前記回路基板を支持する電子機器筐体および筐体を支持
する構造部材は極力低周波領域における共振を避けるこ
とが望ましい。
However, with the development of IC and L8 technology in recent years, there is a tendency for electronic devices to be equipped with electronic components that are much larger than conventional semiconductor devices. In particular, these large electronic components mounted on circuit boards are at risk of being damaged if they encounter low frequency resonance conditions with excessive amplitude.
It is desirable that the electronic device casing that supports the circuit board and the structural members that support the casing avoid resonance in the low frequency range as much as possible.

ところで、従来における誘導飛しよう体は。By the way, what about conventional guided flying objects?

第1図、第2図に示すように外筒体(IIK固定された
7ランジ(za)、(zb)に、あるいはサイドフv 
−A (ia)、(3b)に各々電子機器(ia) 〜
(41)を固定する方法が一般的であった。
As shown in Figures 1 and 2, the outer cylinder body (IIK fixed 7 langes (za), (zb) or side flap
-A (ia) and (3b) each have electronic equipment (ia) ~
A common method was to fix (41).

この方法は外筒体(11としドーム(5)を取り外せば
内部の電子機器(4a)〜(41)が容易に点検可能な
状態となり保守性の良い構造を提供できる利点を有して
いる。
This method has the advantage that by removing the outer cylindrical body (11) and the dome (5), the internal electronic devices (4a) to (41) can be easily inspected, providing a structure with good maintainability.

しかし、この構造では7ランジ(za)、(zb)に増
付けられた電子機器(4a)#(4m))I(4d)は
矢印A方向の振動に対してフランジ(2a)、(zb)
の剛性が他方向にくらべて低く、低周波領域で共振し易
い。また、サイドフレーム(sa)、(rb)に懸架さ
れた電子機器(4f)、(ng)、(a・)e(4h)
I(41)は矢印B方向に対する剛性が低く上記と同様
に低周波領域で共振状態に遭遇する危険性がある。
However, in this structure, the electronic equipment (4a) # (4m)) I (4d) added to the 7 flange (za), (zb) is damaged by the flange (2a), (zb) against vibration in the direction of arrow A.
Its rigidity is lower than that in other directions, and it tends to resonate in the low frequency range. In addition, electronic equipment (4f), (ng), (a・)e (4h) suspended on the side frames (sa) and (rb)
I (41) has low rigidity in the direction of arrow B, and there is a risk of encountering a resonance state in the low frequency region as described above.

したがって、これらの共振点を所足の値に引き上げるた
めにはフランジ(2a)、(21))およびサイドフレ
ーム(sIL)、(sb)の剛性を上ける必要が有り、
これら構造部材は大型化され質量増加を招くという欠点
があった。
Therefore, in order to raise these resonance points to the required value, it is necessary to increase the rigidity of the flanges (2a), (21)) and the side frames (sIL), (sb).
These structural members have the drawback of being large and increasing their mass.

この発明はこのような欠点を考慮してな、されたもので
あり、以下図によシ詳細に説明する。
The present invention has been made in consideration of these drawbacks, and will be explained in detail below with reference to the drawings.

第3図、第4図はこの発明による実施例であり、電子機
器(6a)〜(6C)は機軸(7)直角面内で3分割さ
れ、その断面形状は外径が外筒体(1)の内径と、内径
が緩衝体(8)の外径に相応する扇形状に形成されてい
る。
3 and 4 show an embodiment according to the present invention, in which the electronic devices (6a) to (6C) are divided into three parts in a plane perpendicular to the machine axis (7), and the cross-sectional shape is such that the outer diameter is ) is formed into a fan shape whose inner diameter corresponds to the outer diameter of the buffer body (8).

さらに緩衝体(8)は円筒型ゴム、コイルバネ又は皿バ
ネのように、圧縮力により外径が増加する弾性を有した
構造体であり、座金(9)およびスペーサーを介して7
ランジ(2a)の機軸中心部に立てられたシャツ) (
imlに相互に積み重されておく。また、7ランジ(2
b)には押付はネジfi2と係合するネジ部を設けてお
く。
Furthermore, the buffer body (8) is an elastic structure such as a cylindrical rubber, a coil spring, or a disc spring that increases its outer diameter by compressive force.
A shirt placed at the center of the lunge (2a)) (
They are stacked on top of each other in iml. Also, 7 lunges (2
In b), a threaded portion that engages with the screw fi2 is provided for pressing.

なお、フランジ(25L)、(21))は外筒体□1に
固定する。ここで、押付ネジo2を締付は緩衝体(8)
を圧縮させると、電子機器(6a)〜(6c)は緩衝体
(8)の外径増加に伴い各々放射状に拡が凱外筒体(1
1の内壁面に密着して行き、保持することができる。
Note that the flanges (25L), (21)) are fixed to the outer cylinder □1. Here, tighten the pressing screw o2 on the buffer body (8).
When the electronic devices (6a) to (6c) are compressed, each of the electronic devices (6a) to (6c) expands radially as the outer diameter of the buffer body (8) increases.
It can be brought into close contact with the inner wall surface of 1 and held.

したがって、電子機器(6a)〜(6c)に伝達される
振動は緩衝体ts+および外筒体(11からのものであ
シ、大半が高剛性体である外筒体(11に影曽されるこ
ととなり、従来のように直接、低周波で共振する電子機
器支持構造物を削除することができる。
Therefore, the vibrations transmitted to the electronic devices (6a) to (6c) are from the shock absorber ts+ and the outer cylinder (11), and are mostly influenced by the outer cylinder (11), which is a highly rigid body. Therefore, it is possible to eliminate the electronic device support structure that directly resonates at low frequencies as in the past.

また、大気に面した外筒体o1に密着するととにより、
良好なる電子機器(6a)〜(6C)の放熱・手段をも
備えている。さらに、外筒体(11と7ランジ(2m)
、(2b)間の締結要素および押付ネジα2を開放する
のみで電子機器(6a)〜(AC) 10出すことがで
き、保守性にもすぐれている。
In addition, by closely contacting the outer cylindrical body o1 facing the atmosphere,
It also has good heat dissipation means for electronic devices (6a) to (6C). In addition, the outer cylinder (11 and 7 lunges (2 m)
, (2b) and the pressing screw α2, the electronic devices (6a) to (AC) 10 can be taken out, and maintainability is also excellent.

第5図はこの発明による他の実施例を示したものであシ
、原理的には第4図のものと相似であるが以下の点が異
なる。すなわち、電子機器(6)は構造体から緩衝体(
8)および防振体(1ga)。
FIG. 5 shows another embodiment according to the present invention, which is similar in principle to the embodiment shown in FIG. 4, but differs in the following points. That is, the electronic device (6) is separated from the structure by the buffer (
8) and vibration isolator (1 ga).

(13b)を介して独立させ、耐振性を向上させると共
に、フランジ(21L)は外筒体(11から分離させ。
(13b) to improve vibration resistance, and the flange (21L) is separated from the outer cylinder (11).

シャフトan端部に押付はネジ0と保合するネジ部を付
加し、7ランジーと外筒体(11との締結要素および押
せネジ(1’3を増り外すのみで電子機器(6)を増り
出すことができるようにして保守性を向上させた点であ
る。
Add a threaded part to the end of the shaft that engages the pressing screw 0, and attach the electronic device (6) by simply adding and removing the fastening element and set screw (1'3) for connecting the 7 langie and the outer cylinder (11). This improves maintainability by making it possible to increase the number of units.

以上述べたように、この発明によれは、極めて簡易な構
造で誘導飛しよう体に電子機器を搭載することができ、
耐振性・保守性にすぐれた誘導飛しよう体を構成するこ
とができる。
As described above, according to the present invention, electronic equipment can be mounted on a guided flying object with an extremely simple structure.
A guided flying object with excellent vibration resistance and maintainability can be constructed.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は従来の誘導飛しよう体の電子機器搭載状態を示
す図、第2図は第1図の機軸方向断面図、第3図はこの
発明による誘導飛しよう体の4部断面図、第4図は第5
図の機軸方向断面図、第5図はこの発明による他の実施
例を示す誘導飛しよう体の一部断面図である。 図中(11は外筒体、(2;は7ランジ、(6)は電子
機器、(7)は機軸、(9)は緩衝体、 Qnはシャフ
ト、αりは押付ネジである。 なお9図中同一あるいは相当部分には同一符号を付して
示しである。 代理人 葛 野 信 −6
Fig. 1 is a diagram showing a state in which electronic equipment is mounted on a conventional guided flying object, Fig. 2 is a sectional view in the axial direction of Fig. 1, and Fig. 3 is a sectional view of four parts of a guided flying object according to the present invention. Figure 4 is the fifth
FIG. 5 is a partial sectional view of a guided flying object showing another embodiment of the present invention. In the figure (11 is the outer cylinder body, (2; is the 7 lange, (6) is the electronic device, (7) is the machine shaft, (9) is the shock absorber, Qn is the shaft, and α is the pressing screw. Note 9 Identical or corresponding parts in the figures are indicated by the same reference numerals. Agent Shin Kuzuno -6

Claims (1)

【特許請求の範囲】[Claims] 外筒体内に複数の電子機器を搭載する誘導飛しよう体に
おいて、外筒体の内部中心部には機軸方向の所定圧力で
圧縮され機軸直角方向へ断面積が増加する弾性を有した
緩衝体をPJr要量要人挿入仁の緩衝体を芯として機軸
直角方向の断面が扇形状の電子機器を所定数組合わせて
円筒状に配列して、前記緩衝体を圧縮し、これら電子機
器を機軸直角方向へ放射状に移動させ前記外筒体の内壁
面へ圧着し固定するように構成したことを%徴とする誘
導飛しよう体。
In a guided flying vehicle that carries multiple electronic devices inside the outer cylinder, the inner center of the outer cylinder is equipped with an elastic shock absorber whose cross-sectional area increases in the direction perpendicular to the axis when it is compressed under a predetermined pressure in the axis direction. A predetermined number of electronic devices each having a fan-shaped cross section perpendicular to the machine axis are arranged in a cylindrical shape with the shock absorber of the PJr personnel inserted as the core, and the shock absorber is compressed, and these electronic devices are placed at right angles to the machine axis. A guided flying object characterized by being configured to move radially in a direction and press and fix to an inner wall surface of the outer cylindrical body.
JP16252481A 1981-10-12 1981-10-12 Induction missile Pending JPS5863599A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16252481A JPS5863599A (en) 1981-10-12 1981-10-12 Induction missile

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16252481A JPS5863599A (en) 1981-10-12 1981-10-12 Induction missile

Publications (1)

Publication Number Publication Date
JPS5863599A true JPS5863599A (en) 1983-04-15

Family

ID=15756253

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16252481A Pending JPS5863599A (en) 1981-10-12 1981-10-12 Induction missile

Country Status (1)

Country Link
JP (1) JPS5863599A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62297795A (en) * 1986-06-17 1987-12-24 中部電力株式会社 Structure of sampling section in washing sampling decontaminator for floor of nuclear power facility
DE102017108026A1 (en) 2016-04-19 2017-10-19 Denso Corporation Semiconductor module

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62297795A (en) * 1986-06-17 1987-12-24 中部電力株式会社 Structure of sampling section in washing sampling decontaminator for floor of nuclear power facility
DE102017108026A1 (en) 2016-04-19 2017-10-19 Denso Corporation Semiconductor module

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