JPS5860833A - Submarine repeater unit structure - Google Patents

Abstract

PURPOSE:To improve radiation characteristics by coupling circuit cases which each have a printed-board holding part and a radiation substrate internally and a radiation window and a projecting parallel stage on the external side surface, and electrically insulating the circuit cases. CONSTITUTION:A printed board 9 having packaged electric parts is arranged extending to the printed-board holding part 13 of a radiation substrate 12 and then screwed, and a high heating value part 19 is fixed in the radiation substrate 12 or a case wall, thus forming circuit units 1 and 2. The circuit units 1 and 2 are coupled together by screws through an insulating bush 17 while projection parallel stages 14 of the cases are opposed to a center support 15 via insulating spaces 16 in between; and end surface plates 6a and 6b are screwed on both side surfaces of the center support 15 and then placed in an internal cyclinder 8, and the circumferential surfaces of the end surface plates 6a and 6b are coupled and fixed with screws. The flank of the center support 15 is also screwed to the internal cylinder 8.

Description

[Detailed Description of the Invention] For example, ζO threat is sj! Party-I! s used in the device
Concerning the structure of the medium-organic structure.

Conventionally, the structure shown in Illkaku and Gazwi has been used as the ζomos bottom SO structure.

1 and 3 are subdivisions 1 and 3, respectively. Gourd cases 3a, sb and 4a e 4b are attached to the surfaces, respectively, and end plates 6m and 6bK electric candy edge layers 7 are attached to both ends of the supports S& and sbo.
It had a structure in which it was fixed with screws through the inner cylinder S, inserted into the internal locking claw 8, and held by inserting the large Il and end plates 6a and ak into the internal cylinder S.

Electrical parts t in cases sa and sb with 1iPv&
Wiring base 1 [9 mounted on II is installed, and wiring base II! 9
The high heat generating component 19 installed in the case 3b is connected to the series #1I.
It's 11 years old.

ζ0* In the structure, as mentioned above, the K11l road crystal case Sa, lb and 4m, 4b are rounded and structurally separated from the single road & black cut support 11a, Sb, @ @
&am The heat generated by the high tip mat parts installed directly inside the foot and case 3b is generated by the circuit case 3b and a.
Heat resistance is applied at the connection part with the supporting deity 6a.
Rotaimokut supporting body SaK transmission 1re9 14h end■ll6a
, The internal series yrsvc through Ib is the main heat dissipation path, and the heat transfer efficiency is high.

Also, - even if it comes to drawings, the li circuit aggregation tg bribes
,, x) Support 5 a, s b all@I
I$D @ fixed end board @ through the insulating layer 7 in 9 spaces
a. Due to the structure in which IbK is fixed, there was a frequent problem of lack of mechanical rigidity.

eO departure @t) The above-mentioned nine conventional drawbacks have been addressed, and good heat dissipation characteristics and efficiency as well as sufficient mechanical properties have been obtained.
Our goal is to provide the best structure possible.

The ζO invention consists of a plurality of on-line cases accommodating electrical and optical components connected to a central support, and an inner cylinder and an end plate are connected to the central support. Central support and one-way case and 0XfC
Insert the edge space t and the insulation pusher and attach the dairy case 1
Electrically trim the edges.

ζO Yamei has a structure that allows for the integration of the WAII & ET case O poles and constant O screws between each component, and the case is designed with a suitable opening to improve heat conduction and heat transfer O efficiency. In this case, the mechanical insulation layer is round and flat, and the mechanical Il# property can be obtained so that it can be inserted over the entire area.

The implementation of the ζO falsehood will be described below.

Figure 3 shows the vertical semi-new rMwJ of the ζO invention actual vagina example.

$1411 is for To in the bare side sectional view cut along the 3rd sOB-B line. In Figures 3 and 4, 1 and 2 are circuit boards, 9 is a printed board with electrical components mounted on it, and 10.11 is a heat dissipation board 12 inside and printed circuit boards integrally formed on both sides of the board. WII&= having a plate holder 1118, a heat dissipation l113 and a mourning parallel step 14 on the external side surface
case, ls is multiple ogss tool case 10
．． The 111 connection has been decided, and the Nawate 111! lIa, Ib and the central support screwed 1 to the inner cylinder 8, 16.17 g
l@s, Insulating base plate and insulation pusher to electrically insulate the case 10.11.

The assembly procedure is to first assemble a printed board with 1ull of electrical components.
The heat dissipation board 120 - printed/printed plate holders on both sides of the board - 1 are arranged and screwed together, and the parts on the height 1111 are the discharge layer [1! Alternatively, a fixed circuit board (1.1) may be formed within the case. Next, each route JL tool,! ! Company case 0511 raised parallel JR14 central support ISK,
Is it possible to connect IIs through an insulating system? l
The screw garden 'RK is connected through the edge pushers &17, and the end-plates @h, @b are screwed on both sides 1 of its central support ls.
W value, put into the inner cylinder 8, end liI plate amtab
The circumference is fixedly connected with screws. Furthermore, the central support 154
0@Rin is also fixed to the internal cylinder 8 with screws.

According to the structure described above, the integrated case〇9mepriz)
I [I on and case heat dissipation group [1! Upper O fever is case 10.
11011111m, the heat conduction value O thermal resistance of the central raised parallel step 14 is surprisingly small, and by providing the malls, it is possible to promote the gas #i inside and outside the case 10.11. .

According to the insulation space 91, the electrical insulating layer stack is one-way between the eight case 10.11, the central support 1s, and the O pair metal
By providing this structure, it is possible to minimize N, A, and conduction losses. Also, the unit of insulation base + 16 ■ Product f
it) Since the received pressure is also relaxed, the creep of the viscous layer can be ignored, and the tin case 10.11 and the central support l
S and O connections are also included in one line.

Furthermore, a part of the end of the central support 150 is directly screwed to the internal cylinder 8 and fixed at a certain level via the end @1liah, fjk.
With the sqp stage, good heat dissipation properties and mechanical properties can be obtained.

As explained above, according to ζO1l-, the circuit is
1, the heating efficiency is 1, and the mechanical Kll rate is 11.
L capacity holding Jζ7 is the 9th part, which accommodates as many OII items as the party sea hawk medium-SO, and is a device for changing the parts that will affect the production life and production quality. 70 liters in Nishi
L amount 4! The turn O that opposes K has a great effect.

[Brief explanation of drawings]

The 1st one shows the structure of Jumikai Taka Junior High School and the Toolet structure. Showing the structure of Mushidan Seirinkaku, 1If 4th kaku is lI3th kaku OB-Bfll
This is a 11rWA cut by K. l knee road a, JIL road, 2:ill road z=t, 3m. 8 b: Circuit &! /) KX% 4114 b:
III ET case, 5m, 5b: Li road & ink cut support body, 6m, 6b: 11111m board, F: Electrical insulation layer, 8: Internal cylinder% 9: Printed board with electrical parts stored, 10: 1m short ET case, 11: Circuit two knit case! 2: Heat dissipation board, 1s: Heat dissipation window, 14: Q raised thousand rows, 1s: central support, 16: insulating spacer, 17
: Binding push, 18 Niblint plate holding part, 19: High heat generation parts. Takashi Yogaki Hitosho

Claims (1)

[Claims] <17 Inside IiK printed board holding part and heat dissipation board,
The outer side fIi is equipped with a parallel stage with a radial strip and a centrally raised parallel stage, so that a plurality of 〇-road cases and these 〇-road cases are arranged in succession,
The center support is clamped to the internal V ring and the end plate, and the rounded center support and the 9-way case are inserted between the center support and the 9-way case, and the connection pusher is inserted between the center support and the connection case. Umimaronaka--& 1-kit structure equipped with.