JPS5855074U - packaging pad - Google Patents

packaging pad

Info

Publication number
JPS5855074U
JPS5855074U JP15038481U JP15038481U JPS5855074U JP S5855074 U JPS5855074 U JP S5855074U JP 15038481 U JP15038481 U JP 15038481U JP 15038481 U JP15038481 U JP 15038481U JP S5855074 U JPS5855074 U JP S5855074U
Authority
JP
Japan
Prior art keywords
packaging pad
packaging
shielding film
pad
electrostatic shielding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15038481U
Other languages
Japanese (ja)
Inventor
佐藤　行夫
Original Assignee
東洋アルミニウム株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 東洋アルミニウム株式会社 filed Critical 東洋アルミニウム株式会社
Priority to JP15038481U priority Critical patent/JPS5855074U/en
Publication of JPS5855074U publication Critical patent/JPS5855074U/en
Pending legal-status Critical Current

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Landscapes

  • Buffer Packaging (AREA)
  • Packaging Frangible Articles (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図はこの考案の包装用パッドを示す断面図第２図及
び第３図は静電シールドフィルムの構造を示す断面図、
第４図及び第５図は包装用パッド　。 の使用例を示す断面図である。 、２・・・静電シールドフィルム、３・・・基材、４・
・・熱収縮性フィルム、５・・・金属薄膜層、６・・・
静電防止１１　　剤。FIG. 1 is a sectional view showing the packaging pad of this invention. FIGS. 2 and 3 are sectional views showing the structure of the electrostatic shielding film.
Figures 4 and 5 are packaging pads. It is a sectional view showing an example of use. , 2... Electrostatic shielding film, 3... Base material, 4...
...Heat-shrinkable film, 5...Metal thin film layer, 6...
Antistatic 11 agent.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 発泡樹脂基材を熱収縮性静電シールドフィルムで被覆し
た包装用パッド。　　　　　　　　゛A packaging pad made of a foam resin base coated with a heat-shrinkable electrostatic shielding film.゛
JP15038481U 1981-10-07 1981-10-07 packaging pad Pending JPS5855074U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15038481U JPS5855074U (en) 1981-10-07 1981-10-07 packaging pad

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15038481U JPS5855074U (en) 1981-10-07 1981-10-07 packaging pad

Publications (1)

Publication Number Publication Date
JPS5855074U true JPS5855074U (en) 1983-04-14

Family

ID=29943111

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15038481U Pending JPS5855074U (en) 1981-10-07 1981-10-07 packaging pad

Country Status (1)

Country Link
JP (1) JPS5855074U (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5520221B2 (en) * 1976-02-18 1980-05-31

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5520221B2 (en) * 1976-02-18 1980-05-31

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