JPS585344U - 半導体用ボンデイングワイヤ−スプ−ル - Google Patents

半導体用ボンデイングワイヤ−スプ−ル

Info

Publication number
JPS585344U
JPS585344U JP9709081U JP9709081U JPS585344U JP S585344 U JPS585344 U JP S585344U JP 9709081 U JP9709081 U JP 9709081U JP 9709081 U JP9709081 U JP 9709081U JP S585344 U JPS585344 U JP S585344U
Authority
JP
Japan
Prior art keywords
semiconductors
bonding wire
wire spool
spool
substance
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9709081U
Other languages
English (en)
Other versions
JPH0133569Y2 (ja
Inventor
富山　進
Original Assignee
田中電子工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 田中電子工業株式会社 filed Critical 田中電子工業株式会社
Priority to JP9709081U priority Critical patent/JPS585344U/ja
Publication of JPS585344U publication Critical patent/JPS585344U/ja
Application granted granted Critical
Publication of JPH0133569Y2 publication Critical patent/JPH0133569Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus

Landscapes

  • Wire Bonding (AREA)
  • Storage Of Web-Like Or Filamentary Materials (AREA)
  • Storing, Repeated Paying-Out, And Re-Storing Of Elongated Articles (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
図面は本考案スプールの一部切欠せる正面図である。 図中、Ａはスプール本体、２はガラス質材である。

Claims (3)

    【実用新案登録請求の範囲】
  1. （１）合成樹脂に較べ熱膨張係数の小さな物質を添加し
    てなる合成樹脂でスプール本体を筒状に形成した半導体
    用ボンディングワイヤースプール。
  2. （２）上記物質がガラス７質材又はセラミック材である
    実用新案登録請求の範囲第１項記載のスプール。
  3. （３）上記物質の添加量が１０〜４０重量％である実用
    新案登録請求の範囲第１項記載のスプール。
JP9709081U 1981-06-30 1981-06-30 半導体用ボンデイングワイヤ−スプ−ル Granted JPS585344U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9709081U JPS585344U (ja) 1981-06-30 1981-06-30 半導体用ボンデイングワイヤ−スプ−ル

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9709081U JPS585344U (ja) 1981-06-30 1981-06-30 半導体用ボンデイングワイヤ−スプ−ル

Publications (2)

Publication Number Publication Date
JPS585344U true JPS585344U (ja) 1983-01-13
JPH0133569Y2 JPH0133569Y2 (ja) 1989-10-12

Family

ID=29891911

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9709081U Granted JPS585344U (ja) 1981-06-30 1981-06-30 半導体用ボンデイングワイヤ−スプ−ル

Country Status (1)

Country Link
JP (1) JPS585344U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009161330A (ja) * 2008-01-09 2009-07-23 Allied Material Corp 金属線材貯蔵体

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50145825U (ja) * 1974-05-25 1975-12-03
JPS56140556U (ja) * 1980-03-26 1981-10-23

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50145825U (ja) * 1974-05-25 1975-12-03
JPS56140556U (ja) * 1980-03-26 1981-10-23

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009161330A (ja) * 2008-01-09 2009-07-23 Allied Material Corp 金属線材貯蔵体

Also Published As

Publication number Publication date
JPH0133569Y2 (ja) 1989-10-12

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