JPS5853153U - Boiling cooling device - Google Patents
Boiling cooling deviceInfo
- Publication number
- JPS5853153U JPS5853153U JP14777081U JP14777081U JPS5853153U JP S5853153 U JPS5853153 U JP S5853153U JP 14777081 U JP14777081 U JP 14777081U JP 14777081 U JP14777081 U JP 14777081U JP S5853153 U JPS5853153 U JP S5853153U
- Authority
- JP
- Japan
- Prior art keywords
- cooling device
- refrigerant
- boiling cooling
- container
- condenser
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000009835 boiling Methods 0.000 title claims description 5
- 238000001816 cooling Methods 0.000 title claims description 5
- 239000003507 refrigerant Substances 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 2
- 239000007788 liquid Substances 0.000 claims 2
- 239000000110 cooling liquid Substances 0.000 claims 1
- 238000001704 evaporation Methods 0.000 claims 1
- 230000008020 evaporation Effects 0.000 claims 1
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来の沸騰冷却装置を示す断面図、第２図は本
考案の沸騰冷却装置の一実施例を示す断面図、第３図は
第２図のＡ−Ａ線矢視断面図である。
１・・・・・・容器、２・・・・・・発熱体、３・・Ｊ
・・・冷媒、５・・・・・・凝縮器、８・・・・・・分
配装置、８ａ・・・・・・孔。Fig. 1 is a sectional view showing a conventional boiling cooling device, Fig. 2 is a sectional drawing showing an embodiment of the boiling cooling device of the present invention, and Fig. 3 is a sectional view taken along the line A-A in Fig. 2. be. 1...Container, 2...Heating element, 3...J
... Refrigerant, 5 ... Condenser, 8 ... Distribution device, 8a ... Hole.
Claims (1)
し、蒸発した冷媒蒸気を凝縮器に送って凝縮させ前記容
器に戻す沸騰冷却装置において、前記凝縮器の底部に冷
硯液が溜まるようにするとともに、この冷媒液の液面下
に、上面に多数の孔を有する分配装置を置き、この分配
装置に前記容器よりの冷媒蒸気を送るようにしたことを
特徴とする沸騰冷却装置。In a boiling cooling device in which a heating element immersed in a refrigerant in a container is cooled by evaporation of the refrigerant, the evaporated refrigerant vapor is sent to a condenser, where it is condensed and returned to the container, cooling liquid is collected at the bottom of the condenser. A boiling cooling device characterized in that a distribution device having a large number of holes on the upper surface is placed below the liquid level of the refrigerant liquid, and the refrigerant vapor from the container is sent to the distribution device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14777081U JPS5853153U (en) | 1981-10-06 | 1981-10-06 | Boiling cooling device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14777081U JPS5853153U (en) | 1981-10-06 | 1981-10-06 | Boiling cooling device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5853153U true JPS5853153U (en) | 1983-04-11 |
Family
ID=29940615
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14777081U Pending JPS5853153U (en) | 1981-10-06 | 1981-10-06 | Boiling cooling device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5853153U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018109928A1 (en) * | 2016-12-16 | 2018-06-21 | 三菱電機株式会社 | Gas-liquid separating device of boiling and cooling system |
-
1981
- 1981-10-06 JP JP14777081U patent/JPS5853153U/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018109928A1 (en) * | 2016-12-16 | 2018-06-21 | 三菱電機株式会社 | Gas-liquid separating device of boiling and cooling system |
| JPWO2018109928A1 (en) * | 2016-12-16 | 2019-06-24 | 三菱電機株式会社 | Gas-liquid separation device for boiling cooling system |
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