JPS5848913A - Cover opening/closing system on semiconductor device manufacturing apparatus - Google Patents

Abstract

PURPOSE:To realize cost reduction and obtain compact system by configurating the cover opening/closing system so that the cover can be opened and closed with only one drive cylinder. CONSTITUTION:When the bracket 3 is boosted by the drive cylinder 16 for ascending/descending movement or rotating movement, the guide roller 18 rotates on the guide groove and ascends thereon. Simultaneously, since the link 15a rotates with the pin 14 working as the fulcrum, the bracket 3 rotatingly ascends. As a result, the cover 2 is fully opens. When the bracket 3 is pulled down by the cylinder 16 from above condition, the reverse operation occurs and the cover 2 is closed again. When the cover opening/closing system is thus configurated, only one drive cylinder is necessary. Thereby, structure is simplified and cost can also be reduced, resulting in compact semiconductor device manufacturing apparatus.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a lid opening/closing device for semiconductor manufacturing equipment, and in particular,
This relates to a lid opening/closing device for semiconductor manufacturing equipment suitable for obtaining an inexpensive and compact lid opening/closing device.0 Semiconductor manufacturing equipment such as etching equipment and plasma CVD equipment is usually installed in a clean room due to the nature of the products being manufactured. be done. Since this clean room is expensive to construct per floor area, there is a strong demand for semiconductor manufacturing equipment designed in the clean room to be more compact in order to effectively utilize the clean room floor area. Furthermore, in order to improve the efficiency of cleaning the semiconductor manufacturing equipment processing chamber, it is necessary to reduce the height of the semiconductor manufacturing equipment.

A conventionally known lid opening/closing device for a processing chamber of a semiconductor manufacturing apparatus will be explained with reference to FIGS. 1 and 2.

In FIGS. 1 and 2, the lid 2 at the top of the processing chamber l is fixed to a bracket 3 with bolts (not shown), and this bracket 3 is provided with two guide shafts 4. . Further, the guide shaft 4 is inserted into four plain bearings 6 provided on the support beam 5a, and has a sliding structure. Further, the support beam 5a is rotatably connected to a pedestal 9 via a pin 7 and a pin receiver 8. Lid lifting cylinder 1
0, the cylinder body is fixed to a support beam 5, and the drive shaft ends are fixed and attached to two guide shafts 4 with pins 11. The lid mouth movable cylinder unit is equipped with a cylinder body mounted on a stand 9.
The support beam 5a is fixed at the lower end, and the drive shaft end is rotatably connected to the lower end of the support beam 5a by a pin 13.

When the two guide shafts 4 are pushed up by the lid lifting/lowering cylinder IO, the guide shafts 4 are raised while sliding on the four plain bearings 6, and the lid 2 is pushed up vertically.

After the lid 2 is pushed up, when the lower end of the support beam 5a is pushed by the lid rotation cylinder, the lid 2 is rotated to a predetermined opening degree using the bottle 7 as a fulcrum.

Such a conventionally known lid opening/closing device for a semiconductor manufacturing apparatus requires two driving sources: a driving cylinder for lifting and lowering the lid and a driving cylinder for moving the lid opening, and has the disadvantage that the Tol structure is complicated and expensive.

Furthermore, when the lid opening cylinder is used on the compression side as shown in Figure 1, it protrudes outside the semiconductor manufacturing equipment, which increases the installation area of the semiconductor manufacturing equipment and makes effective use of the clean room floor space. *+1 If used in a tensile manner, it will fit inside the semiconductor manufacturing equipment, but it will not take up storage space for the internal parts of the semiconductor manufacturing equipment, and the height of the semiconductor manufacturing equipment will be high.) When the efficiency of cleaning the room decreases, the next problem arises.

The present invention aims to eliminate the above-mentioned drawbacks, and has nine features in which the upper part of a support beam fixed to a frame and the upper part of a bracket are rotatably connected via a link, and the length of the support beam is increased and decreased. A guide groove shorter than the stroke length of the 0-turn drive cylinder is provided, and the guide O-9 that rolls in the guide groove is rotatably attached to the lower part of the bracket, or the lower part of the support beam is connected to the plug or the guide groove. The lower part of the multiplication table is rotatably connected via a link longer than the length of the link, and the cylinder body is rotatably attached to the pedestal, and the drive shaft end of the multiplication table lifting/rotating drive cylinder is rotated to the bracket. The present invention provides a lid opening/closing device for semiconductor manufacturing equipment which is movably mounted and allows the lid to be raised, lowered and rotated by a single drive cylinder.

An embodiment of the present invention will be explained with reference to FIGS. 3 to 5. Note 1. In FIGS. 3 to 5, parts and the like that are the same as those in FIGS. 1 and 2 are designated by the same reference numerals and their explanations will be omitted.

In Figures 3 and 4, the lid 2 is attached to the bracket 3 with a spring (
The upper part of the bracket 3 is attached to a support 11 fixed to the frame 9 via a bolt (not shown).
Bin 14.19 via the top of /Asb and link 15m
are rotatably connected. It lies on the support beam 5b, and its length is the stroke length of the lifting/rotating drive cylinder 16! l
A short guide groove 17 is provided, and a guide roller 18 that rolls on a bride guide 1111 is rotatably attached to the lower part of the bracket 3.

The cylinder body of the lifting/rotating drive cylinder 16 is rotatably attached to the frame 9 with a bottle head, and the drive shaft end is pinned to the bracket 3 at a position above the position where the guide roller is fixed. A rotatable counter is attached at the end.

When the bracket 3 is pushed up by the lifting/rotating drive cylinder in the state shown in FIG. 3, the guide row 218 rolls in the guide groove 17 and rises. In order to rotate, the bracket 3 moves 12 times at the same time as it rises, and as a result, the lid 2 is fully opened as shown in FIG. 5. Then, from the state shown in FIG. Bracket 3 for cylinder 16
When the lid 2 is pulled down, an operation opposite to the above occurs and the lid 2 is moved to the third position.
It returns to the closed state as shown in the figure. In this case, the lid 2
A spring is provided at the mounting part of the bracket 3, so that the sealing surfaces of the processing chamber 1 and the lid 2 can be uniformly brought into close contact with each other without straining. Further, depending on the relationship between the length of the guide groove 1 and the stroke length of the lifting/rotating drive cylinder 16), the lifting height and opening degree of the lid 2 can be freely selected.

When the lid opening/closing device (hereinafter referred to as the lid opening/closing device) of semiconductor manufacturing equipment is configured as described above, it has a simple nine-piece structure that requires only one drive cylinder, which reduces the cost of semiconductor manufacturing. The device can be made more compact.

FIGS. 6 to 8 illustrate other embodiments of the lid opening/closing device, and the same parts as those in FIGS. 3 and 4 are designated by the same reference numerals and their explanations will be omitted.

In FIGS. 6 and 7, the lower part of the bracket 3 is rotatably connected to the lower part of the support beam 5C fixed to the frame 9 via a link 15b which is longer than the length of the link 15a. Furthermore, the drive shaft end of the lifting/rotating drive cylinder 16 whose cylinder body is rotatably attached to the frame 9 is rotatably attached to the bracket 3 with a pin 21 VLe.

When the bracket 3 is pushed up by the lifting/rotating drive cylinder 16 in the state shown in FIG. 6, the links L5m, 1
5b rotates using the bin 14.22 as a fulcrum, but the position of the bin 1 moves vertically but hardly moves horizontally, and the position of the bin 19 is approximately 90 degrees. Due to the rotation, the bracket 3 moves vertically and horizontally by the length of the link 15Jl, and as a result, the lid 2 is fully opened as shown in FIG. Next, when the bracket 3 is pulled down by the lifting/rotating drive cylinder 16 from the state shown in Fig. 8, the operation opposite to the above occurs, and the lid 2
Return to closed state as shown. In this case, the lengths of the links 15a and 15b and the driving cylinder 1 for lifting/lowering/rotating
The rising height and opening degree of It2 can be freely selected by the stroke length rtam of 6.

When the lid opening/closing device is configured as described above, the structure of the lid opening/closing device can be simplified, manufacturing is easy, and the price can be reduced.

As explained above, the lid opening/closing device of the present invention is configured so that the lid can be opened and closed using one driving cylinder, so that the cost of the lid opening/closing device can be reduced and the semiconductor manufacturing equipment can be made more compact. Effectively utilizes clean room floor space and improves cleaning work efficiency in semiconductor manufacturing equipment processing rooms.

[Brief explanation of the drawing]

1 and 2 illustrate a conventionally known lid opening/closing device for semiconductor manufacturing equipment, and FIG. WE1 is a front view of the lid opening/closing device for semiconductor manufacturing equipment, and FIG. 3
Figures 5 to 5 illustrate one embodiment of the present invention.
FIG. 3 is a front view of the lid opening/closing device of the semiconductor manufacturing apparatus with the lid closed, FIG. 4 is a side view, and FIG. 5 is a straight view with the lid open. 6 to 8 illustrate other embodiments of the lid opening/closing device, in which FIG. 6 is a front view of the lid opening/closing device of a semiconductor manufacturing device with the lid closed, and FIG. 7 is a side view of the lid opening/closing device. , FIG. 8 is a front view with the lid open. 1...processing chamber, 2...lid, 3...
...Bracket, 5b, 5c'91.・Support beam, 9 ・
--- Frame, 14.1 (JAb et zoollo, Bin, 15 a, 15 b =... Link, 16...
... Lifting/rotating drive cylinder, 17...
Guide groove, 18...Guide roller 6 1st figure 31' 2nd figure'\'3u 4th figure'rs figure

Claims (1)

[Claims] 1. In a lid opening/closing device that is attached to a bracket of semiconductor manufacturing equipment and opens and closes a safety lid, the upper part of a support beam fixed to a pedestal and the upper part of the bracket are rotated via a link. The cylinders are movably connected, and the cylinder body is rotatably attached to the pedestal, and the drive shaft end of the nine lifting and rotating drive cylinders is connected. 4! Lid opening/closing device for semiconductor manufacturing equipment. 2. A guide groove whose length is shorter than the stroke length of the lifting/rotating drive cylinder is provided in the support beam, and a guide roller that rolls in the guide groove is rotatably attached to the lower part of the bracket, and the lifting/lowering drive cylinder is rotatably attached to the lower part of the bracket. - The lid opening/closing device for a semiconductor manufacturing apparatus according to claim 1, wherein the drive shaft end of the rotating drive cylinder is rotatably attached to the bracket at a position above the guide roller. 2. The lid opening/closing device for a semiconductor manufacturing apparatus according to claim 1, wherein the lower part of the support beam and the lower part of the bracket are rotatably connected via a link having a length of 3°) longer than the length of the link.