JPS5848774U - Melt plating equipment - Google Patents
Melt plating equipmentInfo
- Publication number
- JPS5848774U JPS5848774U JP14439281U JP14439281U JPS5848774U JP S5848774 U JPS5848774 U JP S5848774U JP 14439281 U JP14439281 U JP 14439281U JP 14439281 U JP14439281 U JP 14439281U JP S5848774 U JPS5848774 U JP S5848774U
- Authority
- JP
- Japan
- Prior art keywords
- plating equipment
- melt plating
- plating
- metal
- pulley
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007747 plating Methods 0.000 title claims description 7
- 239000002184 metal Substances 0.000 claims 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims 1
- 239000000919 ceramic Substances 0.000 claims 1
- 229910002804 graphite Inorganic materials 0.000 claims 1
- 239000010439 graphite Substances 0.000 claims 1
- 229910052755 nonmetal Inorganic materials 0.000 claims 1
- 239000006104 solid solution Substances 0.000 claims 1
- 238000001816 cooling Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Coating With Molten Metal (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
図面は本考案溶融メッキ装置の一例を示す概略説明図で
ある。
１・・・被メツキ線、２・・・メッキ槽、３・・・滑車
、４・・・ダイス、５・・・滑車、６・・・冷却槽、７
・・・メッキ線。The drawing is a schematic diagram showing an example of the hot-dip plating apparatus of the present invention. 1... Wire to be plated, 2... Plating tank, 3... Pulley, 4... Dice, 5... Pulley, 6... Cooling tank, 7
...Plated wire.
Claims (1)
の滑車を設けた溶融メッキ装置において、該滑車として
黒鉛、セラミック等の如く金属と固溶体と生成しない非
金属にて形成したことを特徴とする溶融メッキ装置。A hot-dip plating apparatus having a pulley for supporting a running metal wire for plating in a plating tank, characterized in that the pulley is made of a non-metal such as graphite, ceramic, etc. that does not form a solid solution with metal. hot-dip plating equipment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14439281U JPS5848774U (en) | 1981-09-29 | 1981-09-29 | Melt plating equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14439281U JPS5848774U (en) | 1981-09-29 | 1981-09-29 | Melt plating equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5848774U true JPS5848774U (en) | 1983-04-01 |
Family
ID=29937356
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14439281U Pending JPS5848774U (en) | 1981-09-29 | 1981-09-29 | Melt plating equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5848774U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0491073U (en) * | 1990-03-30 | 1992-08-07 |
-
1981
- 1981-09-29 JP JP14439281U patent/JPS5848774U/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0491073U (en) * | 1990-03-30 | 1992-08-07 |
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