JPS5846477U - bonding equipment - Google Patents
bonding equipmentInfo
- Publication number
- JPS5846477U JPS5846477U JP14091881U JP14091881U JPS5846477U JP S5846477 U JPS5846477 U JP S5846477U JP 14091881 U JP14091881 U JP 14091881U JP 14091881 U JP14091881 U JP 14091881U JP S5846477 U JPS5846477 U JP S5846477U
- Authority
- JP
- Japan
- Prior art keywords
- bonding
- printed circuit
- bonding equipment
- lighting device
- data
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Illuminated Signs And Luminous Advertising (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は本考案によるボンディング装置の一実施例を示
す斜視図、第２図は第１図の装置の制御ブロック図、第
３図はプリント基板に対するワイヤのボンディング状況
を示す平面図である。
１・・・ボンディング装置、７・・・照明装置、１７・
・・切換え制御手段（照明制御回路）、２０・・・切換
え制御手段（光量切換器）、２１・・・プリント基板、
２１ｂ・・・ボンディング地点、２３・・・ワイヤ、Ｄ
ＡＴＡ・・・ボンディングデータ。FIG. 1 is a perspective view showing an embodiment of a bonding apparatus according to the present invention, FIG. 2 is a control block diagram of the apparatus shown in FIG. 1, and FIG. 3 is a plan view showing the state of bonding wires to a printed circuit board. 1... Bonding device, 7... Lighting device, 17.
...Switching control means (lighting control circuit), 20...Switching control means (light amount switch), 21...Printed circuit board,
21b... Bonding point, 23... Wire, D
ATA...Bonding data.
Claims (1)
ヤのボンディングを行なうボンディング装置において、
前記プリント基板のボンディング地点周辺を照明する照
明装置を設けると共に、照明装置に前記ボンディングデ
ータに応じて照度を切換え得る切換え制御手段を接続し
、゛ワイヤのフォーミングが必要な場合には、プリント
基板に対する照明の照度を減少させ得るようにして構成
したボンディング装置。In bonding equipment that performs bonding of wires to printed circuit boards according to bonding data,
A lighting device is provided to illuminate the vicinity of the bonding point of the printed circuit board, and a switching control means that can switch the illuminance according to the bonding data is connected to the lighting device. A bonding device configured to reduce illumination intensity.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14091881U JPS5846477U (en) | 1981-09-22 | 1981-09-22 | bonding equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14091881U JPS5846477U (en) | 1981-09-22 | 1981-09-22 | bonding equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5846477U true JPS5846477U (en) | 1983-03-29 |
Family
ID=29934052
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14091881U Pending JPS5846477U (en) | 1981-09-22 | 1981-09-22 | bonding equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5846477U (en) |
-
1981
- 1981-09-22 JP JP14091881U patent/JPS5846477U/en active Pending
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