JPS5846459U - semiconductor element - Google Patents
semiconductor elementInfo
- Publication number
- JPS5846459U JPS5846459U JP14038681U JP14038681U JPS5846459U JP S5846459 U JPS5846459 U JP S5846459U JP 14038681 U JP14038681 U JP 14038681U JP 14038681 U JP14038681 U JP 14038681U JP S5846459 U JPS5846459 U JP S5846459U
- Authority
- JP
- Japan
- Prior art keywords
- lead terminals
- semiconductor element
- package
- displaying
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は本考案の一実施例を示すｉｃの斜視図、第２図
は第１図のｎ−ｎ矢視断面図、第３図は本考案を適用し
た一実施例の回路図である。
１・・・パッケージ、２・・・電源用リード端子、３・
・・グランド用リード端子、４・・・入力信号、出力信
号、その他用者リード端子、５・・・表示口、６・・・
ＩＣチップ、７・・・ワイヤ、８・・・発光ダイオード
、９・・・抵ＬＩＯ−・・アノ−ド、１１・・・カソー
ド。Fig. 1 is a perspective view of an IC showing an embodiment of the present invention, Fig. 2 is a sectional view taken along the line nn in Fig. 1, and Fig. 3 is a circuit diagram of an embodiment to which the present invention is applied. . 1...Package, 2...Power supply lead terminal, 3.
...Ground lead terminal, 4...Input signal, output signal, other user lead terminal, 5...Display port, 6...
IC chip, 7... Wire, 8... Light emitting diode, 9... Resistor LIO-... Anode, 11... Cathode.
Claims (1)
の通電動作状態を表示する発光物質を、前記リード端子
のパッケージへの取付端部に設けたことを特徴とする半
導体素子。1. A semiconductor device with lead terminals, characterized in that a light-emitting substance for displaying the energization operating state of the lead terminals is provided at an end portion of the lead terminals attached to the package.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14038681U JPS5846459U (en) | 1981-09-24 | 1981-09-24 | semiconductor element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14038681U JPS5846459U (en) | 1981-09-24 | 1981-09-24 | semiconductor element |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5846459U true JPS5846459U (en) | 1983-03-29 |
Family
ID=29933547
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14038681U Pending JPS5846459U (en) | 1981-09-24 | 1981-09-24 | semiconductor element |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5846459U (en) |
-
1981
- 1981-09-24 JP JP14038681U patent/JPS5846459U/en active Pending
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