JPS5845341U - Semi-metallic friction material - Google Patents
Semi-metallic friction materialInfo
- Publication number
- JPS5845341U JPS5845341U JP13783581U JP13783581U JPS5845341U JP S5845341 U JPS5845341 U JP S5845341U JP 13783581 U JP13783581 U JP 13783581U JP 13783581 U JP13783581 U JP 13783581U JP S5845341 U JPS5845341 U JP S5845341U
- Authority
- JP
- Japan
- Prior art keywords
- semi
- friction material
- metallic friction
- organic
- metallic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Braking Arrangements (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図は本考案の実施例74るセミメタ;ノック摩擦材
を備えたバンドアッセンブリの側面図であり、第2図は
第1図における低有機成分層を形成する加熱手段として
の高周波誘導加熱における摩擦材深さとの関係を示す図
である。
10:パッドアッセンブリ、12:摩擦材、14:断熱
材、16:裏板、18:低有機成分層。FIG. 1 is a side view of a band assembly equipped with a semi-metal knock friction material according to Embodiment 74 of the present invention, and FIG. 2 is a side view of a band assembly equipped with a semi-metal knock friction material according to a 74th embodiment of the present invention, and FIG. FIG. 3 is a diagram showing the relationship with the depth of friction material. 10: Pad assembly, 12: Friction material, 14: Heat insulating material, 16: Back plate, 18: Low organic component layer.
Claims (1)
結合材で固めて成るブレーキ用セミメタリック摩擦材に
おいて、 摩擦面を高周波誘導力1熱することによって有機成分の
量を他の部分の172以下まで低下させた低有機成分層
を0.5〜3rIrIrLの厚さで形成したことを特徴
とするセミメタリック摩擦材。[Claims for Utility Model Registration] In semi-metallic friction materials for brakes, which are mainly composed of metal wires, powders, chips, etc. solidified with organic binders such as synthetic resins, the organic component can be extracted by heating the friction surface with high-frequency induction force. A semi-metallic friction material characterized in that a low organic component layer is formed with a thickness of 0.5 to 3rIrIrL in which the amount of organic components is reduced to 172 or less than that of other parts.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13783581U JPS5845341U (en) | 1981-09-17 | 1981-09-17 | Semi-metallic friction material |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13783581U JPS5845341U (en) | 1981-09-17 | 1981-09-17 | Semi-metallic friction material |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5845341U true JPS5845341U (en) | 1983-03-26 |
Family
ID=29931085
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13783581U Pending JPS5845341U (en) | 1981-09-17 | 1981-09-17 | Semi-metallic friction material |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5845341U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005503525A (en) * | 2001-09-14 | 2005-02-03 | ティーエムディー フリクション ゲーエムベーハー | Method and apparatus for heat treating molded parts |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5259270A (en) * | 1975-11-10 | 1977-05-16 | Hisayo Bureeki Kougiyou Kk | Friction lining for brake |
-
1981
- 1981-09-17 JP JP13783581U patent/JPS5845341U/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5259270A (en) * | 1975-11-10 | 1977-05-16 | Hisayo Bureeki Kougiyou Kk | Friction lining for brake |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005503525A (en) * | 2001-09-14 | 2005-02-03 | ティーエムディー フリクション ゲーエムベーハー | Method and apparatus for heat treating molded parts |
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