JPS5845017U - Mold for resin molding - Google Patents
Mold for resin moldingInfo
- Publication number
- JPS5845017U JPS5845017U JP14023681U JP14023681U JPS5845017U JP S5845017 U JPS5845017 U JP S5845017U JP 14023681 U JP14023681 U JP 14023681U JP 14023681 U JP14023681 U JP 14023681U JP S5845017 U JPS5845017 U JP S5845017U
- Authority
- JP
- Japan
- Prior art keywords
- mold
- resin molding
- groove
- utility
- model registration
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図は従来の温調回路を備えた金型の平面図、第2図
は第1図の線A−Aに沿って取った断面図、第3図は第
1図に示された金型の底面図、第4図は本考案の一例に
よる金型の平面図、第5図は第”4図の線B−Bに沿っ
て取った断面図、そして第6図は第4図に示された金型
の底面図である。
図中、2・・・キャビティ、11.12・・・金型の部
分、13・・・溝、14・・・出入口用の孔。Fig. 1 is a plan view of a mold equipped with a conventional temperature control circuit, Fig. 2 is a sectional view taken along line A-A in Fig. 1, and Fig. 3 is a plan view of a mold equipped with a conventional temperature control circuit. 4 is a plan view of a mold according to an example of the present invention, FIG. 5 is a sectional view taken along line B-B of FIG. 4, and FIG. It is a bottom view of the shown mold.In the figure, 2...cavity, 11.12...mold part, 13...groove, 14...hole for entrance and exit.
Claims (3)
樹脂成形用金型において、前記金型は厚さ方向に分割さ
れ且つ互に接合される二つめ部分から成り、それらの部
分の接合面の少なくとも一方には前記温調回路としての
閉回路の溝が形成され、下側の前記部分には前記溝に連
通した出入口用の孔が設けられていることを特徴とする
樹脂成形用金型。(1) In a resin molding mold equipped with a temperature control circuit for the cavity, core, etc., the mold is divided in the thickness direction and consists of a second part that is joined to each other, and these parts are joined together. A molding metal for resin molding, characterized in that a closed circuit groove serving as the temperature control circuit is formed on at least one of the surfaces, and a hole for an entrance and exit communicating with the groove is provided in the lower part. Type.
いて、前記溝は一方の前記部分の接合面に設けられてい
る樹脂成形用金型。(2) Utility Model Registration The mold according to claim 1, wherein the groove is provided on the joint surface of one of the parts.
において、前記溝は二つの前記部分の各接合面の合致し
た位置に形成されている樹脂成形用金型。(3) Utility Model Registration The mold according to claim 1, wherein the groove is formed at a position where each joint surface of the two parts coincides with each other.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14023681U JPS5845017U (en) | 1981-09-21 | 1981-09-21 | Mold for resin molding |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14023681U JPS5845017U (en) | 1981-09-21 | 1981-09-21 | Mold for resin molding |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5845017U true JPS5845017U (en) | 1983-03-26 |
Family
ID=29933406
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14023681U Pending JPS5845017U (en) | 1981-09-21 | 1981-09-21 | Mold for resin molding |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5845017U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0486212A (en) * | 1990-07-31 | 1992-03-18 | Mitsubishi Heavy Ind Ltd | Mold |
-
1981
- 1981-09-21 JP JP14023681U patent/JPS5845017U/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0486212A (en) * | 1990-07-31 | 1992-03-18 | Mitsubishi Heavy Ind Ltd | Mold |
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