JPS5844865U - 分割プリント基板 - Google Patents
分割プリント基板Info
- Publication number
- JPS5844865U JPS5844865U JP13899081U JP13899081U JPS5844865U JP S5844865 U JPS5844865 U JP S5844865U JP 13899081 U JP13899081 U JP 13899081U JP 13899081 U JP13899081 U JP 13899081U JP S5844865 U JPS5844865 U JP S5844865U
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- split
- board
- split printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- 239000011889 copper foil Substances 0.000 claims description 2
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13899081U JPS5844865U (ja) | 1981-09-21 | 1981-09-21 | 分割プリント基板 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13899081U JPS5844865U (ja) | 1981-09-21 | 1981-09-21 | 分割プリント基板 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5844865U true JPS5844865U (ja) | 1983-03-25 |
JPH0121573Y2 JPH0121573Y2 (enrdf_load_stackoverflow) | 1989-06-27 |
Family
ID=29932195
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13899081U Granted JPS5844865U (ja) | 1981-09-21 | 1981-09-21 | 分割プリント基板 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5844865U (enrdf_load_stackoverflow) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61173277U (enrdf_load_stackoverflow) * | 1985-04-18 | 1986-10-28 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5956237A (en) * | 1993-12-24 | 1999-09-21 | Ibiden Co., Ltd. | Primary printed wiring board |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5066153U (enrdf_load_stackoverflow) * | 1973-10-18 | 1975-06-14 | ||
JPS55146997A (en) * | 1979-05-04 | 1980-11-15 | Oki Electric Ind Co Ltd | Method of fabricating integral package |
-
1981
- 1981-09-21 JP JP13899081U patent/JPS5844865U/ja active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5066153U (enrdf_load_stackoverflow) * | 1973-10-18 | 1975-06-14 | ||
JPS55146997A (en) * | 1979-05-04 | 1980-11-15 | Oki Electric Ind Co Ltd | Method of fabricating integral package |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61173277U (enrdf_load_stackoverflow) * | 1985-04-18 | 1986-10-28 |
Also Published As
Publication number | Publication date |
---|---|
JPH0121573Y2 (enrdf_load_stackoverflow) | 1989-06-27 |
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