JPS5844629A - Method of producing detector - Google Patents
Method of producing detectorInfo
- Publication number
- JPS5844629A JPS5844629A JP14086181A JP14086181A JPS5844629A JP S5844629 A JPS5844629 A JP S5844629A JP 14086181 A JP14086181 A JP 14086181A JP 14086181 A JP14086181 A JP 14086181A JP S5844629 A JPS5844629 A JP S5844629A
- Authority
- JP
- Japan
- Prior art keywords
- adjusted
- detector
- resin
- case
- processing circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims description 9
- 229920005989 resin Polymers 0.000 claims description 22
- 239000011347 resin Substances 0.000 claims description 22
- 238000004519 manufacturing process Methods 0.000 claims description 14
- 238000012545 processing Methods 0.000 claims description 13
- 238000001514 detection method Methods 0.000 claims description 12
- 239000010408 film Substances 0.000 claims description 6
- 230000004888 barrier function Effects 0.000 claims description 4
- 239000010409 thin film Substances 0.000 claims description 2
- 230000000149 penetrating effect Effects 0.000 claims 1
- 238000000465 moulding Methods 0.000 description 5
- 238000009966 trimming Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000013307 optical fiber Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 230000035945 sensitivity Effects 0.000 description 2
- 238000002834 transmittance Methods 0.000 description 2
- 229910000859 α-Fe Inorganic materials 0.000 description 2
- 238000013459 approach Methods 0.000 description 1
- 230000004397 blinking Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
Landscapes
- Switches That Are Operated By Magnetic Or Electric Fields (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】 本発明は検出器の製造方法に関する。[Detailed description of the invention] The present invention relates to a method for manufacturing a detector.
一般に検出器例えば高周波発振方式及び静電容量方式な
どの近接スイッチは、物体に接触することなしに物体の
接近を検出するものとして用いられている。Generally, detectors such as high-frequency oscillation type and capacitance type proximity switches are used to detect the approach of an object without coming into contact with the object.
このよう々検出器部ち近接スイッチは、第1図に示すよ
うに構成され、そのケース1は金属又は樹脂製の円筒状
ケース本体と両端をそれぞれ覆う樹脂製の前蓋2と金属
又は樹脂製の裏蓋3とがらなっている。尚、ケース本体
と前蓋2又は裏蓋3とは一体に形成されていることもあ
る。このようなケース1内には、例えばフェライトコア
4に巻回された検出コイル5からなりコイルケースを兼
ねた前蓋2に取付けるなど前蓋2に近接して配設された
検知部6や、この検知部6と接続されケース1内の中央
付近に配設された処理回路部7などの内蔵部品が収納さ
れている。処理回路部7は、基板8上にIC9や被調整
体1oを接続してなり、この被調整体10は例えば半固
定抵抗やトリマコンデンサ等である。The detector proximity switch is constructed as shown in Fig. 1, and the case 1 includes a cylindrical case body made of metal or resin, a front cover 2 made of resin covering both ends, and a metal or resin front cover 2 made of metal or resin. The back cover 3 of the watch has a slit. Note that the case body and the front cover 2 or back cover 3 may be formed integrally. Inside the case 1, there is a detection unit 6, which is disposed close to the front cover 2, such as a detection coil 5 wound around a ferrite core 4, and attached to the front cover 2, which also serves as a coil case. Built-in components such as a processing circuit section 7 connected to the detection section 6 and arranged near the center of the case 1 are housed. The processing circuit section 7 is formed by connecting an IC 9 and an object to be adjusted 1o on a substrate 8, and the object to be adjusted 10 is, for example, a semi-fixed resistor or a trimmer capacitor.
このような処理回路部7には、動作表示用LED(発光
ダイオード)11が接続され、このLEDllには光フ
ァイバ12が接続されて先端は前記裏蓋ろを貰通し、L
EDl 1の点滅により外部から近接スイッチの動作を
確認できるようになっている。更に、前記処理回路部7
には、外部引出ケーブル16が接続され、このケーブル
13は前記裏蓋5を貫通してケース1外に引出されてい
る。An operation display LED (light emitting diode) 11 is connected to the processing circuit section 7, and an optical fiber 12 is connected to this LED, the tip of which passes through the back cover.
The operation of the proximity switch can be confirmed from the outside by blinking EDl 1. Furthermore, the processing circuit section 7
An external lead-out cable 16 is connected to the case 1, and this cable 13 passes through the back cover 5 and is led out of the case 1.
又、上記のままでは各内蔵部品を振動や衝撃などの外力
や水分などから保護することができないために、ケース
1内にはエポキシ樹脂などの樹脂14を充填、硬化して
各内蔵部品を保護している。In addition, since the above cannot protect each built-in component from external forces such as vibrations and shocks, and moisture, etc., the case 1 is filled with resin 14 such as epoxy resin and hardened to protect each built-in component. are doing.
ところで、最近の電子機器は耐環境性及び信頼性の向上
のため、基板実装後、樹脂モールドが要求されているが
上記のようなりアクタンスの変化を検出する近接スイッ
チでは、検知部6を樹脂モールドすると大巾にQが変化
する。そこで、繍2図に示すように、先ず最初に検知部
6を樹脂モールドして処理回路部7に接続し、最適回路
定数となるように機能調整(選択部品の実装又はレーザ
トリミング等)後、ケース1に収納して処理回路部7を
樹脂モールドする2段方式になっている。Incidentally, recent electronic devices require resin molding after mounting on the board in order to improve environmental resistance and reliability, but in the proximity switch that detects changes in actance as described above, the detection part 6 is molded in resin. Then Q changes drastically. Therefore, as shown in Figure 2, first, the detection section 6 is molded in resin and connected to the processing circuit section 7, and after functional adjustment (mounting of selected parts, laser trimming, etc.) to achieve the optimum circuit constant, It is a two-stage system in which it is housed in a case 1 and the processing circuit section 7 is resin molded.
尚、図中15は感度調節用片であり、矢印方向に移動さ
せる。Note that 15 in the figure is a sensitivity adjustment piece, which is moved in the direction of the arrow.
本発明は上記事情に鑑みなされたもので、迅速確実に機
能調整を行なうことができる検出器の製造方法を提供す
ることを目的としている。The present invention was made in view of the above circumstances, and an object of the present invention is to provide a method for manufacturing a detector that allows quick and reliable function adjustment.
以下、図面を参照して本発BFIの一実施例を詳細に説
明する。本発明による検出器の製造方法は第6図及び第
4図に示すように構成される。第4図は第6図の要部を
取出して示している。又第1図と共通又は対応する部分
については同符号を用いている。即ち1本発明の検出器
つまり近接スイッチにおける処理回路部7は、基板・8
上にIC9や被調整体10を接続してなっている。この
被調整体10は、厚膜又は薄膜部品つまシセラミック基
板上での厚膜印刷体又は印刷抵抗体等のチップ部品など
である。このような処理回路部7及び検知部6は、レー
ザ光を吸収し難い樹脂例えばクリヤ樹脂14でモールド
されている (但し、図ではケース1は省略しである)
。この場合、2色成型などで被調整体10のみレーザ光
を吸収し難い樹脂でモールドしてもよい。尚、第5図に
レーザ光とクリヤ樹脂の光透過率との関係を示す。io
oomμでは殆どのエポキシ樹脂に透過する。又、一般
にレーザトリミングのレーザとしては、Nd : YA
Gレーザが使用され、このNd:YAGレーザはi、0
61E1Lの近赤外波長である。Hereinafter, one embodiment of the BFI of the present invention will be described in detail with reference to the drawings. The method for manufacturing a detector according to the present invention is constructed as shown in FIGS. 6 and 4. FIG. 4 shows the main parts of FIG. 6. Also, the same reference numerals are used for parts common or corresponding to those in FIG. 1. That is, 1. The processing circuit section 7 in the detector, that is, the proximity switch of the present invention includes a substrate 8.
The IC 9 and the body to be adjusted 10 are connected to the top. The object to be adjusted 10 is a thick film or thin film component, a thick film printed body on a ceramic substrate, or a chip component such as a printed resistor. The processing circuit section 7 and the detection section 6 are molded with a resin that does not easily absorb laser light, such as clear resin 14 (however, the case 1 is omitted in the figure).
. In this case, only the object 10 to be adjusted may be molded with a resin that does not easily absorb laser light, such as by two-color molding. Incidentally, FIG. 5 shows the relationship between the laser beam and the light transmittance of the clear resin. io
oomμ penetrates most epoxy resins. In addition, Nd: YA is generally used as a laser for laser trimming.
A G laser is used, and this Nd:YAG laser has i,0
61E1L near-infrared wavelength.
さて、上記のようにレーザ光を吸収し難いクリヤ樹脂1
4でモールドされた被調整体10の機能調整を行なうに
は、被調整体10に対応する位置にレーザ源16を配置
する。このレーザ源16は、前記外部引出ケーブル13
に接続されている設定値と比較する比較回路17と連動
している。そして、レーザ源16からのレーザ光1Bが
被調整体10に照射できるように焦点を絞り、外部リー
ド線から処理回路部7に所定の電圧、電流等を印加した
状態で、レーザ源16をオンする−0すると、レーザ光
18のエネルギーは殆ど被調整体10に照射され、被調
整体10が例えば厚膜印刷体のときはとの厚膜印刷体に
対するトリミングが開始される。このトリミングによっ
て被調整体10つまり厚膜印刷体の調整値が変化してい
くため、比較回路17からの信号により最適回路定数と
なった時点でレーザ源16をオフにする。即ち、距離l
と設定値とを予め決めておいて、レーザ光18を当てな
がら設定値と比較し、設定値を超えると信号を出してレ
ーザ光18を止めればよく、被調整体10の機能調整が
完了する。Now, as mentioned above, clear resin 1 that is difficult to absorb laser light
4, the laser source 16 is placed at a position corresponding to the object to be adjusted 10. This laser source 16 is connected to the external extraction cable 13.
The comparison circuit 17 is connected to a comparison circuit 17 for comparing with a set value. Then, the laser source 16 is turned on while focusing the laser beam 1B from the laser source 16 so that it can irradiate the object to be adjusted 10, and applying a predetermined voltage, current, etc. from the external lead wire to the processing circuit section 7. When the value is -0, most of the energy of the laser beam 18 is irradiated onto the object to be adjusted 10, and when the object to be adjusted 10 is, for example, a thick-film printed material, trimming of the thick-film printed material is started. Due to this trimming, the adjustment value of the object to be adjusted 10, that is, the thick film printed material changes, so the laser source 16 is turned off when the optimum circuit constant is reached by the signal from the comparison circuit 17. That is, the distance l
and a set value in advance, compare it with the set value while applying the laser beam 18, and when the set value is exceeded, a signal is issued and the laser beam 18 is stopped, and the functional adjustment of the object to be adjusted 10 is completed. .
本発明の検出器の製造方法は上記説明及び図示のように
構成され、レーザ光18を照射して被調整体10の調整
を行なっているので、検知部6がモールド樹脂14によ
って変化しても、1回のモールドで最適定数が得られる
。又、調整がレーザ光1Bのため高速で行なわれ、而も
完全モールドの後であるので、精度の高い特性が得られ
る。更に、従来は生産工程の調整ラインで最適条件を出
した後、その部品を実装するために再び製造ラインf戻
していたが、本発明によれば製造ラインと調整・ライン
とを完全に分離することができる。The method for manufacturing a detector of the present invention is configured as described above and shown in the drawings, and since the object to be adjusted 10 is adjusted by irradiating the laser beam 18, even if the detection part 6 is changed by the mold resin 14, , optimal constants can be obtained with one molding. Further, since the adjustment is performed at high speed using the laser beam 1B, and is performed after complete molding, highly accurate characteristics can be obtained. Furthermore, in the past, after the optimum conditions were achieved on the adjustment line of the production process, the parts were returned to the production line f to be mounted, but according to the present invention, the production line and the adjustment line are completely separated. be able to.
尚、レーザ光によりモールド樹脂14が少し損傷を受け
る場合には、第6図に示すように被調整体10に樹脂1
4が浸入しないように予め透明のカップ状障壁19を設
け、その後、モールド樹脂14を充填して、レーザ光1
8を被調整体10に当て調整を行なう。この場合、レー
ザ光18の焦点を被調整体10に合わせておくと、結像
しない部分つまり障壁19附近は樹脂14が溶けない。In addition, if the mold resin 14 is slightly damaged by the laser beam, the resin 1 is attached to the adjusted body 10 as shown in FIG.
A transparent cup-shaped barrier 19 is provided in advance to prevent the laser beam 1 from entering, and then a mold resin 14 is filled to prevent the laser beam 1 from entering.
8 to the object to be adjusted 10 for adjustment. In this case, if the focus of the laser beam 18 is set on the object to be adjusted 10, the resin 14 will not melt in the area where the image is not formed, that is, in the vicinity of the barrier 19.
図中、20は空気である。In the figure, 20 is air.
以上説明したように本発明によれば、1回のモールドで
最適回路定数が得られると共に精度の高い特性が得られ
、目、つ生産工程で製造ラインと調整ラインが完全に分
離することができる工業的価値大なる検出器の製造方法
を提供することができる。As explained above, according to the present invention, optimum circuit constants and highly accurate characteristics can be obtained in one molding process, and the manufacturing line and adjustment line can be completely separated in the second production process. A method for manufacturing a detector of great industrial value can be provided.
第1図は検出器(近接スイッチ)を示す断面図1、
第2図は従来の検出器の製造方法を示す一部断面を含む
側面図、第3図は本発明の一実施例に係る検出器の製造
方法を示す断面図、第4図(a) 、 (blは第3図
の要部を拡大して示す平面図と側面図、第5図はレーザ
光とクリヤ樹脂の光透過率との関係を示す特性曲線図、
第6図は本発明の変形例を示す断面図である。
1・・・ケース、2・・・前蓋、6・・・裏蓋、4・・
・フェライトコア、5・・・検出コイル、6・・・検知
部、7・・・回路処理部、8・・・基板、9・・・I
C1,10・・・被調整体、11・・・LED、12・
・・光ファイバ、16・・・外部引出ケーブル、14・
・・樹脂、15・・・感度調整用片、16・・・レーザ
源、17・・・比較回路、18・・・レーザ光、19・
・・障壁。
特許出願人 立石電機株式会社
代理人弁理士伊東辰雄
〃 〃伊東哲也
第1図
第2図
見
第3図
第4図
ア
第5図
第6図Figure 1 is a sectional view 1 showing the detector (proximity switch).
FIG. 2 is a side view including a partial cross section showing a conventional method for manufacturing a detector, FIG. 3 is a sectional view showing a method for manufacturing a detector according to an embodiment of the present invention, and FIG. 4(a), (bl is a plan view and side view showing enlarged main parts of Fig. 3, Fig. 5 is a characteristic curve diagram showing the relationship between the laser beam and the light transmittance of the clear resin,
FIG. 6 is a sectional view showing a modification of the present invention. 1...Case, 2...Front cover, 6...Back cover, 4...
- Ferrite core, 5... detection coil, 6... detection section, 7... circuit processing section, 8... board, 9... I
C1, 10...Object to be adjusted, 11...LED, 12.
...Optical fiber, 16... External lead-out cable, 14.
... Resin, 15... Sensitivity adjustment piece, 16... Laser source, 17... Comparison circuit, 18... Laser light, 19.
··barrier. Patent Applicant Tateishi Electric Co., Ltd. Representative Patent Attorney Tatsuo Ito Tetsuya Ito Figure 1 Figure 2 View Figure 3 Figure 4 A Figure 5 Figure 6
Claims (1)
と、このケース内の前記前蓋に近接して配設された検知
部と、この検知部に接続されると共に前記ケース内に配
設され厚膜又は薄膜部品からなる被調整体を有する処理
回路部と、この処理回路部に接続され前記裏蓋を貫通す
る外部引出ケーブルと、前記ケース内に充填されたレー
ザ光を吸収し難い樹脂とを具備してなる検出器において
、 前記処理回路部に所定の電圧、電流を印加した状態で最
適回路定数となるように、前記被調整体にレーザ光を照
射してトリミングを行ない機能調整することを特徴とす
る検出器の製造方法。 2 予め前記被調整体を障壁で覆って、前記樹脂が被調
整体に浸入しないようにしておく特許請求の範囲第1項
記載の検出器の製造方法。[Scope of Claims] 1. A cylindrical case having both ends formed by a front cover and a back cover, a detection section disposed close to the front cover inside the case, and a detection section connected to the detection section. a processing circuit section which is arranged in the case and has an adjusted body made of a thick film or thin film component; an external lead cable connected to the processing circuit section and passing through the back cover; In the detector, the object to be adjusted is irradiated with a laser beam so that an optimum circuit constant is obtained when a predetermined voltage and current are applied to the processing circuit section. A method for manufacturing a detector, characterized in that the detector is trimmed to adjust its function. 2. The method of manufacturing a detector according to claim 1, wherein the object to be adjusted is covered in advance with a barrier to prevent the resin from penetrating into the object to be adjusted.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14086181A JPS5844629A (en) | 1981-09-09 | 1981-09-09 | Method of producing detector |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14086181A JPS5844629A (en) | 1981-09-09 | 1981-09-09 | Method of producing detector |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5844629A true JPS5844629A (en) | 1983-03-15 |
Family
ID=15278445
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14086181A Pending JPS5844629A (en) | 1981-09-09 | 1981-09-09 | Method of producing detector |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5844629A (en) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS52140861A (en) * | 1976-05-19 | 1977-11-24 | Siemens Ag | Method of adjusting electric circuit network of synthetic resin foil |
-
1981
- 1981-09-09 JP JP14086181A patent/JPS5844629A/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS52140861A (en) * | 1976-05-19 | 1977-11-24 | Siemens Ag | Method of adjusting electric circuit network of synthetic resin foil |
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