JPS58427U - IC package - Google Patents

IC package

Info

Publication number
JPS58427U
JPS58427U JP9217681U JP9217681U JPS58427U JP S58427 U JPS58427 U JP S58427U JP 9217681 U JP9217681 U JP 9217681U JP 9217681 U JP9217681 U JP 9217681U JP S58427 U JPS58427 U JP S58427U
Authority
JP
Japan
Prior art keywords
package
terminals
grooves
utility
recorded
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9217681U
Other languages
Japanese (ja)
Inventor
松井 康夫
Original Assignee
株式会社日立製作所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社日立製作所 filed Critical 株式会社日立製作所
Priority to JP9217681U priority Critical patent/JPS58427U/en
Publication of JPS58427U publication Critical patent/JPS58427U/en
Pending legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図イ1口は従来のICの例を示す正面図、平面図、
第2図、第3図はそれぞれ本考案のICパッケージを示
し、41口はそれぞれ正面図及び平面図である。 1・・・・・・溝、2・・・・・・穴。
Figure 1A shows a front view, a top view, and a top view of an example of a conventional IC.
2 and 3 respectively show the IC package of the present invention, and 41 ports are a front view and a plan view, respectively. 1...groove, 2...hole.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] ICの端子部分に、プローブを当てるための穴または溝
を設けることにより、部品面側から、ICの動作チ゛ニ
ックが容易かつ安全に行えるようにしたことを特徴とす
るICパッケージ。
An IC package characterized in that the IC can be easily and safely operated from the component side by providing holes or grooves in the terminals of the IC for applying probes.
JP9217681U 1981-06-24 1981-06-24 IC package Pending JPS58427U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9217681U JPS58427U (en) 1981-06-24 1981-06-24 IC package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9217681U JPS58427U (en) 1981-06-24 1981-06-24 IC package

Publications (1)

Publication Number Publication Date
JPS58427U true JPS58427U (en) 1983-01-05

Family

ID=29887217

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9217681U Pending JPS58427U (en) 1981-06-24 1981-06-24 IC package

Country Status (1)

Country Link
JP (1) JPS58427U (en)

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