JPS5842769U - Connection conductor for testing DIP type IC - Google Patents
Connection conductor for testing DIP type ICInfo
- Publication number
- JPS5842769U JPS5842769U JP13786881U JP13786881U JPS5842769U JP S5842769 U JPS5842769 U JP S5842769U JP 13786881 U JP13786881 U JP 13786881U JP 13786881 U JP13786881 U JP 13786881U JP S5842769 U JPS5842769 U JP S5842769U
- Authority
- JP
- Japan
- Prior art keywords
- contact piece
- connection conductor
- contact
- test
- dip type
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
- Measuring Leads Or Probes (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は一般的なりＩＰ形ＩＣの斜視図、第２図は、本
考案の一実施例から成る試験用接続導体の平面図、第３
図は第２図のＡ−Ａ線断面図、第４図は第３図のＢ−Ｂ
線断面図、第５図及び第６図は本考案の他の実施例から
成る試験用接続導体の未使用時及び使用時における正面
図である。
１・・・ＤＩＰ形ｉｃ、１２・・・接続ピン、２・・・
試験用接続導体、３・・・接触子体、３１．３１ａ、
３１ｂ・・・接触子片、３２・・・モールド体、４１・
・・ケーブル素線、４２・・・コネクタ。Fig. 1 is a perspective view of a general IP type IC, Fig. 2 is a plan view of a test connecting conductor according to an embodiment of the present invention, and Fig.
The figure is a sectional view taken along line A-A in Figure 2, and Figure 4 is a sectional view taken along line B-B in Figure 3.
The line sectional view and FIGS. 5 and 6 are front views of a test connection conductor according to another embodiment of the present invention when it is not in use and when it is in use. 1...DIP type IC, 12...Connection pin, 2...
Test connection conductor, 3... Contact body, 31.31a,
31b... Contact piece, 32... Mold body, 41...
...Cable wire, 42...Connector.
Claims (3)
試験用機器とを電気的に接続する試験用接続導体におい
て、該試験用接続導体を、複数のケーブル素線と、これ
らケーブル素線の一端側に各々設けた前記試験用機器に
接続されるコネクタと、前記ケーブル素線の他端側に接
触支片を各々設けると共にこれら接触子片を２列に対向
して並設し、且つこれら各接触子片を相互に絶縁離隔す
ると共に絶縁部から成るモード体で包囲して成る接触子
体とで形成し、該接触子体を前記ＩＣの具備する接続ピ
ンに係脱し得るように構成したことを特徴とするＤＩＰ
形ＩＣの試験用接続導体。(1) In a test connection conductor that electrically connects a plurality of connection pins of a DIP type IC and a test device, the test connection conductor is connected to a plurality of cable wires and one end of these cable wires. A connector to be connected to the test equipment provided on each side, and a contact piece on the other end side of the cable wire, and these contact piece pieces are arranged in two rows facing each other, and A contact piece is formed of a contact piece that is insulated and separated from each other and a contact piece that is surrounded by a mode body made of an insulating part, and the contact piece is configured to be able to be engaged with and detached from a connecting pin provided on the IC. DIP characterized by
Connection conductor for testing type IC.
部において接触子を対向させて成ることを特徴とする実
用新案登録請求の範囲第１項記載のＤＩＰ形ＩＣの試験
用接続導体。(2) A test connection for a DIP type IC according to claim 1 of the utility model registration claim, characterized in that the contact body is formed by facing the contacts inside a molded body formed in the shape of a casing. conductor.
法を可変することができるクリップから成ることを特徴
とする実用新案登録請求の範囲第１項記載のＤＩＰ形Ｉ
Ｃの試験用接続導体。(3) The DIP type I according to claim 1 of the utility model registration claim, characterized in that the contact body is composed of a clip that can change the facing dimension between a pair of opposing contact pieces.
C test connection conductor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13786881U JPS5842769U (en) | 1981-09-17 | 1981-09-17 | Connection conductor for testing DIP type IC |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13786881U JPS5842769U (en) | 1981-09-17 | 1981-09-17 | Connection conductor for testing DIP type IC |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5842769U true JPS5842769U (en) | 1983-03-22 |
Family
ID=29931117
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13786881U Pending JPS5842769U (en) | 1981-09-17 | 1981-09-17 | Connection conductor for testing DIP type IC |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5842769U (en) |
-
1981
- 1981-09-17 JP JP13786881U patent/JPS5842769U/en active Pending
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