JPS58420U - Mold package forming equipment - Google Patents
Mold package forming equipmentInfo
- Publication number
- JPS58420U JPS58420U JP9339581U JP9339581U JPS58420U JP S58420 U JPS58420 U JP S58420U JP 9339581 U JP9339581 U JP 9339581U JP 9339581 U JP9339581 U JP 9339581U JP S58420 U JPS58420 U JP S58420U
- Authority
- JP
- Japan
- Prior art keywords
- forming equipment
- package forming
- mold package
- heater block
- longitudinal direction
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来のモールドパッケージ成形装置の下型の斜
視図、第２図は同じ〈従来のモールドパッケージ成形装
置の金型合わせ面の形状を示す暢明図、第３図はこの考
案の一実施例を示す斜視図、第４図は同じくこの考案の
一実施例の正面図、第５図は同じくこの考案の一実施例
の側面図である。
１・・・ヒータブロック、２・・・キャビティホルダ、
３・・・成形部、５・・・スペーサブロック、６・・・
ベース、８・・・スライド溝、１１・・・移動ベッド。Figure 1 is a perspective view of the lower die of a conventional mold package forming apparatus, Figure 2 is the same (a clear view showing the shape of the mold mating surface of a conventional mold package forming apparatus), and Figure 3 is an implementation of this invention. FIG. 4 is a front view of an embodiment of this invention, and FIG. 5 is a side view of an embodiment of this invention. 1... Heater block, 2... Cavity holder,
3... Molding part, 5... Spacer block, 6...
Base, 8...Slide groove, 11...Moving bed.
Claims (1)
介して設けられたヒータブロックとこのヒータブロック
上に取付けられた成形部およびキャビティホルダとから
なる上下金型で構成される成形装置において、上記ベー
スの上面に設けられたスライド溝に長手方向に複数に分
割したスペーサブロックを摺動自在に嵌合させるととも
に、上記ヒータブロック上に長手方向に複数に分割した
成形部およびキャビティホルダとを設けたことを特徴と
するモールドパッケージ成形装置。In a molding device consisting of an upper and lower mold consisting of a heater block installed on a support fixed on a movable bed via a spacer block, a molding section and a cavity holder mounted on the heater block, the base A spacer block divided into a plurality of parts in the longitudinal direction is slidably fitted into a slide groove provided on the upper surface, and a molded part divided into a plurality of parts in the longitudinal direction and a cavity holder are provided on the heater block. Mold package forming equipment featuring:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9339581U JPS58420U (en) | 1981-06-24 | 1981-06-24 | Mold package forming equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9339581U JPS58420U (en) | 1981-06-24 | 1981-06-24 | Mold package forming equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS58420U true JPS58420U (en) | 1983-01-05 |
Family
ID=29888360
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9339581U Pending JPS58420U (en) | 1981-06-24 | 1981-06-24 | Mold package forming equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58420U (en) |
-
1981
- 1981-06-24 JP JP9339581U patent/JPS58420U/en active Pending
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