JPS5839440B2 - Diaphragm for speaker - Google Patents

Diaphragm for speaker

Info

Publication number
JPS5839440B2
JPS5839440B2 JP14026878A JP14026878A JPS5839440B2 JP S5839440 B2 JPS5839440 B2 JP S5839440B2 JP 14026878 A JP14026878 A JP 14026878A JP 14026878 A JP14026878 A JP 14026878A JP S5839440 B2 JPS5839440 B2 JP S5839440B2
Authority
JP
Japan
Prior art keywords
diaphragm
boron
carbonized
inorganic polymer
speaker
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP14026878A
Other languages
Japanese (ja)
Other versions
JPS5566195A (en
Inventor
和朗 奥沢
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP14026878A priority Critical patent/JPS5839440B2/en
Publication of JPS5566195A publication Critical patent/JPS5566195A/en
Publication of JPS5839440B2 publication Critical patent/JPS5839440B2/en
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R7/00Diaphragms for electromechanical transducers; Cones
    • H04R7/02Diaphragms for electromechanical transducers; Cones characterised by the construction
    • H04R7/04Plane diaphragms
    • H04R7/06Plane diaphragms comprising a plurality of sections or layers
    • H04R7/10Plane diaphragms comprising a plurality of sections or layers comprising superposed layers in contact

Landscapes

  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Laminated Bodies (AREA)
  • Diaphragms For Electromechanical Transducers (AREA)

Description

【発明の詳細な説明】 本発明は軽量で剛性が高く、しかも成形性に優れたスピ
ーカ用振動板に関するものである。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a speaker diaphragm that is lightweight, has high rigidity, and has excellent moldability.

従来のスピーカ用振動板として高弾性を有するものはチ
タン、ベリリウム、アルミニウムなどの金属箔を用いた
ものがある。
Conventional speaker diaphragms with high elasticity include those using metal foils such as titanium, beryllium, and aluminum.

しかしながら、チタンやアルミニウムでは十分満足でき
る剛性、比弾性を得ることができず、べIJ IJウム
を用いたものは高い剛性、比弾性を有するが成形加工が
困難で価格もきわめて高くなる欠点があった。
However, it is not possible to obtain sufficiently satisfactory rigidity and specific elasticity with titanium or aluminum, and products using aluminum have high rigidity and specific elasticity, but they have the drawbacks of being difficult to mold and extremely expensive. Ta.

本発明は上述のような金属箔を用いたスピーカ用振動板
に代って高弾性を有し、軽量で成形性の優れたスピーカ
用振動板を提供しようとするものである。
The present invention aims to provide a speaker diaphragm that has high elasticity, is lightweight, and has excellent moldability in place of the speaker diaphragm using metal foil as described above.

以下、本発明の実施例を図面第1図〜第7図により説明
する。
Embodiments of the present invention will be described below with reference to FIGS. 1 to 7 of the drawings.

まず、第1図において、1はコーン状に形成された振動
板本体でこの振動板本体1の外周面にはフリーエツジ2
が貼付げられてスピーカ用振動板を構成している。
First, in FIG. 1, reference numeral 1 denotes a diaphragm body formed in a cone shape, and a free edge 2 is provided on the outer peripheral surface of the diaphragm body 1.
is attached to form a speaker diaphragm.

なお、振動板としては上述のコーン状の振動板だけでな
くドーム形あるいは平板状の振動板とすることもできる
The diaphragm may be not only the cone-shaped diaphragm described above but also a dome-shaped or flat-plate diaphragm.

上記のような振動板本体1は、第2図に示すようにフェ
ノール系繊維3を基材とし、この基材3にフェノール系
樹脂4を含浸して成形する。
The diaphragm main body 1 as described above is formed by using a phenolic fiber 3 as a base material and impregnating the base material 3 with a phenolic resin 4, as shown in FIG.

このフェノール系繊維3とフェノール系樹脂4とは化学
構造式が類似し、200〜300℃の加熱成形時には下
式のように強固に結合される。
The phenolic fiber 3 and the phenolic resin 4 have similar chemical structural formulas, and are strongly bonded as shown in the formula below during heat molding at 200 to 300°C.

これを無酸素または不活性気体の雰囲気中で徐徐に昇温
し700℃以上の高温で炭化させると下記のような構造
となる。
When this is gradually heated in an oxygen-free or inert gas atmosphere and carbonized at a high temperature of 700°C or higher, the following structure is obtained.

このように焼成炭化された成形体5を第3図に示し、こ
の成形体50表面に第4図に示すように、物性値を高く
するためにシリコーン−ボロン系無機ポリマー6を溶媒
に溶かした状態で均一にコーティングし、乾燥後、60
0℃以上の高温にしてシIJコーンーボロン系無機ポリ
マー6をも炭化させて、成形体50表面にSic、炭化
ボロン層7を形成して第5図に示すような振動板基体1
としたものである。
The molded body 5 thus fired and carbonized is shown in FIG. 3, and on the surface of this molded body 50, as shown in FIG. After coating evenly and drying, 60
The SiIJ cone-boron-based inorganic polymer 6 is also carbonized at a high temperature of 0° C. or higher to form a SiC and boron carbide layer 7 on the surface of the molded body 50 to form a diaphragm substrate 1 as shown in FIG.
That is.

また、第6図に示すようにフェノール系繊維3にフェノ
ール系樹脂4を含浸したものを200〜300℃で加熱
成形したものの表面に第7図に示すようにシリコーン−
ボロン系無機ポリマー6を均一に塗布し、これを無酸素
または不活性気体の雰囲気中で徐々に昇温し700℃以
上の高温で焼成炭化すれば第5図のよ・うな振動板基体
1が得られる。
In addition, as shown in FIG. 6, phenolic fiber 3 impregnated with phenolic resin 4 was heated and molded at 200 to 300°C, and silicone was added to the surface as shown in FIG.
If a boron-based inorganic polymer 6 is uniformly applied, the temperature is gradually raised in an oxygen-free or inert gas atmosphere, and then fired and carbonized at a high temperature of 700°C or higher, a diaphragm substrate 1 as shown in Fig. 5 is obtained. can get.

すなわち、本発明はフェノール系繊維にフェノール系樹
脂を含浸したものを加熱成形後焼成炭化した層の表面に
シリコーン−ボロン系無機ポリマーの炭化層7を形成し
たスピーカ用振動板を特徴とするものである。
That is, the present invention is characterized by a speaker diaphragm in which a carbonized layer 7 of a silicone-boron-based inorganic polymer is formed on the surface of a layer obtained by heat-forming phenolic fiber impregnated with a phenolic resin and then firing and carbonizing it. be.

上記シリコーン−ボロン系無機ポリマーの炭化層7はア
モルファス状態となっており優れた物性を有するスピー
カ用振動板を得ることができる。
The carbonized layer 7 of the silicone-boron-based inorganic polymer is in an amorphous state, and a speaker diaphragm having excellent physical properties can be obtained.

このシリコーン−ボロン系無機ポリマーはビックバイソ
ン(商品名=特殊無機材料研究所)として市販されてい
る。
This silicone-boron-based inorganic polymer is commercially available as Big Bison (trade name: Special Inorganic Materials Research Institute).

また、フェノール系繊維3としては、フェノール、クレ
ゾール、フロロフェノールの変性フェノールとホルムア
ルデヒドを代表とするアルデヒド類とを重縮合して得ら
れるノボラック樹脂を用いる。
Further, as the phenolic fiber 3, a novolak resin obtained by polycondensing a modified phenol such as phenol, cresol, or fluorophenol with an aldehyde typified by formaldehyde is used.

フェノール系樹脂4としては、フェノール、クレゾール
、フロロフェノールの変性樹脂を用いる。
As the phenolic resin 4, a modified resin of phenol, cresol, or fluorophenol is used.

さらに、シリコーン−ボロン系無機ポリマー6としては
、ジフェニルジクロロシランとホウ酸系化合物とを不活
性ガス中で反応させて合成したものを用いる。
Furthermore, as the silicone-boron-based inorganic polymer 6, one synthesized by reacting diphenyldichlorosilane and a boric acid-based compound in an inert gas is used.

このような本発明のスピーカ用振動板と従来のチタン、
べIJ IJウム2紙を用いたスピーカ用振動板との物
性の比較を下表に示す。
Such a speaker diaphragm of the present invention and conventional titanium,
The table below shows a comparison of the physical properties with a speaker diaphragm using BeiJIJum2 paper.

なお、本発明の一実施例として従来のものと比較する振
動板は以下のように作成されている。
As an example of the present invention, a diaphragm to be compared with a conventional diaphragm was prepared as follows.

まずフェノール系繊維を基材とし、これにフェノール系
樹脂な含浸成形後N2ガス中で約1200℃で焼成炭化
する。
First, a phenolic fiber is used as a base material, and after being impregnated with a phenolic resin and molded, it is fired and carbonized at about 1200° C. in N2 gas.

次にこの成形物にシリコン−ボロン系無機ポリマーを表
裏面に均一にコーティング処理し、乾燥後N2ガス中に
て昇温し、1200〜13oO℃の高温にて焼成して振
動板を得る。
Next, this molded product is uniformly coated with a silicon-boron based inorganic polymer on the front and back surfaces, and after drying, the temperature is raised in N2 gas and fired at a high temperature of 1200 to 13oO<0>C to obtain a diaphragm.

ただしフェノール炭化物は90〜91wt%1.シリコ
ン−ボロン系無機ポリマーは9〜10wt%とする。
However, phenol carbide is 90-91wt%1. The content of the silicon-boron-based inorganic polymer is 9 to 10 wt%.

また表中フェノール系繊維十フェノール樹脂炭化物とあ
るのは上記実施例の振動板の、シリコン−ホロン系無機
ポリマーをコーティング処理スる前の成形物を比較例と
して出したものである。
Furthermore, in the table, phenolic fiber decaphenolic resin carbide refers to a molded product of the diaphragm of the above example before being coated with a silicone-holon based inorganic polymer as a comparative example.

以上のように本発明のスピーカ用振動板は構成されるた
め、ベリリウムに匹敵する物性を有し、しかも樹脂フィ
ルムと同等の成形性を有し、焼成炭化しているため軽量
で剛性に富んだものとすることができ工業的価値の大な
るものである。
As the speaker diaphragm of the present invention is constructed as described above, it has physical properties comparable to beryllium, has moldability equivalent to that of a resin film, and is lightweight and highly rigid because it is sintered and carbonized. It can be used as a material and has great industrial value.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明のスピーカ用振動板の一実施例を示す断
面図、第2図〜第5図は同振動板の製造工程上の要部断
面図、第6図、第7図は他の実施例の製造工程上の要部
断面図である。 1・・・・・・振動板本体、2・・・・・・フリーエツ
ジ、3・・・・・・フェノール系繊維、4・・・・・・
フェノール系樹脂、5・・・・・・炭化焼成成形体、6
・・・・・・シリコーン−ボロン系無機ポリマー、7・
・・・・・シリコーン−ボロン系無機ポリマーの炭化層
Fig. 1 is a sectional view showing one embodiment of the speaker diaphragm of the present invention, Figs. 2 to 5 are sectional views of main parts in the manufacturing process of the diaphragm, and Figs. 6 and 7 are other views. FIG. 3 is a cross-sectional view of a main part of the manufacturing process of the example. 1... Vibration plate body, 2... Free edge, 3... Phenol fiber, 4...
Phenolic resin, 5...Carbonized fired molded product, 6
...Silicone-boron-based inorganic polymer, 7.
...Carbonized layer of silicone-boron-based inorganic polymer.

Claims (1)

【特許請求の範囲】[Claims] 1 フェノール系繊維にフェノール系樹脂を含浸したも
のを加熱成形したものを無酸素または不活性気体の雰囲
気中で徐々に昇温し700℃以上の高温で焼成炭化した
炭化物の表面にシリコーン−ボロン系無機ポリマーの炭
化層を設けたことを特徴とするスピーカ用振動板。
1 Heat-molded phenolic fiber impregnated with phenolic resin is gradually heated in an oxygen-free or inert gas atmosphere and then fired and carbonized at a high temperature of 700°C or higher to form a silicone-boron-based material on the surface of the carbide. A speaker diaphragm characterized by having a carbonized layer of inorganic polymer.
JP14026878A 1978-11-13 1978-11-13 Diaphragm for speaker Expired JPS5839440B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14026878A JPS5839440B2 (en) 1978-11-13 1978-11-13 Diaphragm for speaker

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14026878A JPS5839440B2 (en) 1978-11-13 1978-11-13 Diaphragm for speaker

Publications (2)

Publication Number Publication Date
JPS5566195A JPS5566195A (en) 1980-05-19
JPS5839440B2 true JPS5839440B2 (en) 1983-08-30

Family

ID=15264813

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14026878A Expired JPS5839440B2 (en) 1978-11-13 1978-11-13 Diaphragm for speaker

Country Status (1)

Country Link
JP (1) JPS5839440B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0232553B2 (en) * 1983-05-25 1990-07-20 Sharp Kk
JPH0232552B2 (en) * 1983-05-25 1990-07-20 Sharp Kk

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63283299A (en) * 1987-05-15 1988-11-21 Mitsubishi Pencil Co Ltd Diaphragm for acoustic apparatus
CN1318206C (en) * 2004-08-02 2007-05-30 金大仁 Multilayer plate made of composite material
US10645497B1 (en) * 2019-05-28 2020-05-05 Bose Corporation Surface treatments for silicone acoustic diaphragms

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0232553B2 (en) * 1983-05-25 1990-07-20 Sharp Kk
JPH0232552B2 (en) * 1983-05-25 1990-07-20 Sharp Kk

Also Published As

Publication number Publication date
JPS5566195A (en) 1980-05-19

Similar Documents

Publication Publication Date Title
JPS5839440B2 (en) Diaphragm for speaker
KR910013293A (en) Method of manufacturing inorganic insulated wire
JP2018044158A5 (en)
US2810425A (en) Mica base insulating sheet and method for producing the same
US4216271A (en) Composite diaphragm for speaker
JP2687458B2 (en) Insulation material for heating furnace
JPS61117161A (en) Manufacture of aluminium nitride ceramics
JP3025542B2 (en) Diaphragm for carbonaceous acoustic equipment and method of manufacturing the same
JPH0468839B2 (en)
JPS6043913B2 (en) Crucible for evaporation source
JP2006232569A (en) SiC/Si COMPOSITE MATERIAL AND METHOD OF MANUFACTURING THE SAME
JPH0745226B2 (en) Laminate
JP2753334B2 (en) Method for forming coating on ceramic substrate
JPS5857038B2 (en) Method for manufacturing diaphragm for electroacoustic transducer
JPS59870Y2 (en) Honeycomb diaphragm for speakers
JPS5879872A (en) Non-oxide ceramics hot press method
KR102025461B1 (en) Solventless photosensitive resin composition, cured film manufactured by the same, conducting film comprising the cured film and method for manufacturing the conducting film
JP2938926B2 (en) Silicon carbide member and method of manufacturing the same
JPS60155572A (en) Manufacture of high heat conductivity silicon carbide sintered body
JPS6049400B2 (en) Manufacturing method of speaker diaphragm
JP2002347163A (en) Surface covering lamination body
JPS60105502A (en) Method of molding heat-insulating material
JPS6256100A (en) Manufacture of voice coil bobbin for vitreous hard carbonaceous acoustic equipment
JPS6054860B2 (en) Copper-clad phenolic resin laminate
JP2005015277A (en) Manufacturing method of silicon carbide honeycomb structure