JPS5837532B2 - Kankoseijiyushuyoushijiban - Google Patents

Kankoseijiyushuyoushijiban

Info

Publication number
JPS5837532B2
JPS5837532B2 JP3754673A JP3754673A JPS5837532B2 JP S5837532 B2 JPS5837532 B2 JP S5837532B2 JP 3754673 A JP3754673 A JP 3754673A JP 3754673 A JP3754673 A JP 3754673A JP S5837532 B2 JPS5837532 B2 JP S5837532B2
Authority
JP
Japan
Prior art keywords
photosensitive resin
epoxy
layer
compound
weight
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP3754673A
Other languages
Japanese (ja)
Other versions
JPS49132167A (en
Inventor
輝夫 高橋
喜代巳 中
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Teijin Ltd
Original Assignee
Teijin Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Teijin Ltd filed Critical Teijin Ltd
Priority to JP3754673A priority Critical patent/JPS5837532B2/en
Priority to AU67152/74A priority patent/AU483122B2/en
Priority to DE19742414596 priority patent/DE2414596C3/en
Priority to BE142607A priority patent/BE813020A/en
Priority to FR7411264A priority patent/FR2223197B1/fr
Priority to CH453174A priority patent/CH597623A5/xx
Priority to CA196,445A priority patent/CA1045880A/en
Priority to DD17762674A priority patent/DD110705A5/xx
Priority to GB1461274A priority patent/GB1463616A/en
Priority to NL7404486A priority patent/NL161711C/en
Priority to IT2061074A priority patent/IT1007425B/en
Publication of JPS49132167A publication Critical patent/JPS49132167A/ja
Priority to US05/596,189 priority patent/US4060656A/en
Publication of JPS5837532B2 publication Critical patent/JPS5837532B2/en
Expired legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/09Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/11Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03CPHOTOSENSITIVE MATERIALS FOR PHOTOGRAPHIC PURPOSES; PHOTOGRAPHIC PROCESSES, e.g. CINE, X-RAY, COLOUR, STEREO-PHOTOGRAPHIC PROCESSES; AUXILIARY PROCESSES IN PHOTOGRAPHY
    • G03C1/00Photosensitive materials
    • G03C1/76Photosensitive materials characterised by the base or auxiliary layers
    • G03C1/91Photosensitive materials characterised by the base or auxiliary layers characterised by subbing layers or subbing means
    • G03C1/93Macromolecular substances therefor

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Printing Plates And Materials Therefor (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Laminated Bodies (AREA)

Description

【発明の詳細な説明】 本発明は液状感光性樹脂から印刷版を製造するに好適に
使用される感光性樹脂用支持板に関する。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a support plate for photosensitive resin that is suitably used for producing printing plates from liquid photosensitive resin.

更に詳しくは、基材の上に特定の接着層を設けてなる多
層の感光性樹脂用支持板に関する。
More specifically, the present invention relates to a multilayer photosensitive resin support plate having a specific adhesive layer provided on a base material.

凸版印刷版に用(/)られる感光性樹脂版は従来知られ
ているが、かかる感允性樹脂版は通常金属板またはプラ
スチックシ一トの基材と接着層(感光性樹脂層を支持体
に接着し易くするため設けられる)および感光性樹脂層
とよりなるものである。
Photosensitive resin plates used for letterpress printing plates have been known in the past, and such photosensitive resin plates usually consist of a base material of a metal plate or a plastic sheet and an adhesive layer (the photosensitive resin layer is attached to a support). (provided to facilitate adhesion to the surface) and a photosensitive resin layer.

また、この際、接着層と基材との間にハレーション防止
層を設けるのが一般的である。
Further, at this time, it is common to provide an antihalation layer between the adhesive layer and the base material.

しかして、該接着層は感光性樹脂層が光によって重合す
るのを妨げたりあるいは光なしで重合を開始するような
成分を含まずまた、印刷に際してレリーフが支持体から
剥離することのないように支持体と強く結合しているこ
とが必要である。
Therefore, the adhesive layer does not contain any component that prevents the photosensitive resin layer from polymerizing when exposed to light or initiates polymerization without light, and also prevents the relief from peeling off from the support during printing. It is necessary to have a strong bond with the support.

さらQこまた、該接着層は通常の製版、印刷工程におけ
る処理の際に遭遇する温度、湿度あるいは溶媒等の影響
によりその接着力の弱められないものであることが要求
される。
Additionally, the adhesive layer is required to have a bonding force that is not weakened by the effects of temperature, humidity, solvents, etc. encountered during normal plate making and printing processes.

しかしながら、かかる諸要求特性を全て満足するような
接着層を有する支持板は今迄知られていなかった。
However, until now, a support plate having an adhesive layer that satisfies all of these required properties has not been known.

従来(こおいてもかかる試みが全くなされていないわけ
でもなく、例えば、特公昭36−23761号公報に記
載されている如きものが知られているが、この場合には
格別な処理を講ずる必要があり工業的に必ずしも好適な
ものとは云い難かった。
In the past (this is not to say that such attempts have not been made at all, for example, the one described in Japanese Patent Publication No. 36-23761 is known, but in this case, special measures must be taken) Therefore, it was difficult to say that it was necessarily suitable for industrial use.

本発明の目的は、解像力の優れた感光性樹脂印刷版を製
造するのに好適な支持板を提供することにある。
An object of the present invention is to provide a support plate suitable for manufacturing a photosensitive resin printing plate with excellent resolution.

本発明の別の目的は加熱しても融解せず、水、酸、アル
カリ、有機溶剤あるいは印刷インキなどによっても容易
に侵されることのない且つ接着層によってレリーフが強
固に支持体と接着している印刷版を製造するのに有用な
支持板を提供することにある。
Another object of the present invention is that the relief does not melt even when heated and is not easily attacked by water, acids, alkalis, organic solvents or printing inks, and that the relief is firmly adhered to the support by the adhesive layer. The object of the present invention is to provide a support plate useful for manufacturing printing plates.

また本発明の他の目的は印刷版が受ける外力の繰り返し
によって破損する恐れがなく、耐刷力が極めて優れた印
刷版を製造するのに有用な支持板を提供することにある
Another object of the present invention is to provide a support plate that is useful for manufacturing printing plates that are free from damage due to repeated external forces applied to the printing plates and have extremely high printing durability.

すなわち、本発明は、エボキシ化合物(4)、分子内に
不飽和炭素一炭素二重結合とエボキシ基又はアミノ基と
を併有する化合物B)および硬化剤(0とを反応せしめ
て得られた、不飽和炭素一炭素二重結合を側鎖に有する
三次元重合体の層を基材の上に設けてなる感光性樹脂用
支持板である。
That is, the present invention provides a compound obtained by reacting an epoxy compound (4), a compound B) having both an unsaturated carbon-carbon double bond and an epoxy group or an amino group in the molecule, and a curing agent (0). This is a support plate for a photosensitive resin comprising a base material and a layer of a three-dimensional polymer having unsaturated carbon-carbon double bonds in side chains.

本発明でいうエポキシ化合物(4)は分子内に少くとも
2個以上のエポキシ基を有する化合物をいう。
The epoxy compound (4) in the present invention refers to a compound having at least two or more epoxy groups in the molecule.

かかるエポキシ化合物としては、エビクロルヒドリンと
例えば2,2−ビズ(4′−オキシフエニル)フロパン
(スなわチ、ビスフェノールA)等の多価フェノール類
あるいは例えばグリセリン等の多価アルコール類との縮
合生成物であって線状高分子化合物が普通用いられる。
Such epoxy compounds include condensation of shrimp chlorohydrin and polyhydric phenols such as 2,2-bis(4'-oxyphenyl)furopane (sunawati, bisphenol A) or polyhydric alcohols such as glycerin. Linear polymeric products are commonly used.

例えば、ビスフェノールAとエビクロルヒトリ**ンと
の線状高分子化合物(下記式で表わされる、nは0又は
1以上の数) が、これらのうち特に好ましい。
For example, a linear polymer compound of bisphenol A and ebichlorohydrin (represented by the following formula, where n is a number of 0 or 1 or more) is particularly preferred.

また、下記式で表わされる化合物 〔ブタジエンとクロトンアルデヒドとをディールズ・ア
ルダー反応( Diels−Alder)せしめて得ら
れた4−ホルミル−3−メチルーシクロヘキセンを2分
子縮合せしめ次いでエポキシ化して製造する〕、更に、 ビニルシクロヘキセンジオキサイド、ジペンテンジオキ
サイド、2−グリシジルフエニールグリシジルエーテル
、2,6−ジグリシジルフエニルグリシジルエーテル、
等の環状エポキシ基を有する化合物、ジグリシジルエー
テル、ブタンジエンジオキサイド、等の脂肪族エポキサ
イド化合物等をあげることができる。
Further, a compound represented by the following formula [produced by condensing two molecules of 4-formyl-3-methyl-cyclohexene obtained by Diels-Alder reaction of butadiene and crotonaldehyde, and then epoxidizing] , furthermore, vinylcyclohexene dioxide, dipentene dioxide, 2-glycidyl phenyl glycidyl ether, 2,6-diglycidyl phenyl glycidyl ether,
Compounds having a cyclic epoxy group such as , aliphatic epoxide compounds such as diglycidyl ether, butane diene dioxide, and the like can be mentioned.

本発明でいう分子内に炭素一炭素二重結合とエポキシ基
又はアミノ基とを併有する化合vAB)は、以下に記載
する硬化剤の存在下に、上記エポキシ化合物囚と反応し
三次元の重合体を形或する。
In the present invention, the compound vAB) having both a carbon-carbon double bond and an epoxy group or an amino group in its molecule reacts with the epoxy compound prisoner in the presence of the curing agent described below to form a three-dimensional polymer. form a union.

本発明で云う炭素一炭素二重結合とは光によって有効に
重合し得る炭素一炭素二重結合の意味である。
The term "carbon-carbon double bond" used in the present invention means a carbon-carbon double bond that can be effectively polymerized by light.

かかる化合物としては、常圧Cこおける沸点が少くとも
120℃のものが好ましく、具体的には次の様な化合物
があげられる。
Such a compound preferably has a boiling point of at least 120° C. at normal pressure C, and specifically includes the following compounds.

すなわち、炭素一炭素二重結合とエポキシ基とを併有す
る化合物としては、例えば、グリシジルアクリレート、
グリシジルメタクリレート、グリシジルクロネート、グ
リシジルアリルエーテル、アリルフェノール若しくはク
ロチルフェノール若しくはこれらの核置換誘導体とエビ
クロルヒドリンの反応物(0−アリルフエニルクリシジ
ルエーテル、クロチルフエニルグリシジルエーテル等)
、1.1−ビス(ヒドロキシメチル)シクロヘキセン−
3若しくはその核置換体と2重結合を有するアルデヒド
とから得られるエポキシ化アセタール、ビニルグリシジ
ル工−テル、メタクリルグリシジルエーテル、一分子中
に多数のエポキシ基と炭素一炭素二重結合とを有する高
分子化合物(ブタジエンのアニオン重合体のエポキシ化
物等)をあげることができる。
That is, examples of compounds having both a carbon-carbon double bond and an epoxy group include glycidyl acrylate,
Glycidyl methacrylate, glycidyl cronate, glycidyl allyl ether, allylphenol or crotylphenol, or a reaction product of shrimp chlorohydrin with allylphenol or crotylphenol or their nuclear substituted derivatives (0-allylphenylcricidyl ether, crotylphenylglycidyl ether, etc.)
, 1.1-bis(hydroxymethyl)cyclohexene-
Epoxidized acetals, vinyl glycidyl ethers, methacryl glycidyl ethers, polymers having many epoxy groups and a carbon-carbon double bond in one molecule, obtained from 3 or its nuclear substituted product and an aldehyde having a double bond. Examples include molecular compounds (epoxidized products of anionic polymers of butadiene, etc.).

又、炭素一炭素二重結合とアミン基とを併有する化合物
としては、グリシジルメタクリレート若しくはグリシジ
ルアリルエーテル等をヘキサメチレンジアミンの如き多
価アミンとの反応生成物(該アミンの活性水素の1部を
反応せしめたもの)あるいはグリシジルメタクリレート
とポリアミン樹脂との反応生成物(これは特に好ましく
用いられる)等をあげることができる。
In addition, as a compound having both a carbon-carbon double bond and an amine group, a reaction product of glycidyl methacrylate, glycidyl allyl ether, etc. with a polyvalent amine such as hexamethylene diamine (a part of the active hydrogen of the amine is Examples thereof include a reaction product of glycidyl methacrylate and a polyamine resin (which is particularly preferably used).

本発明でいう硬化剤(C)としては通常分子内Qこ2個
以上の活性水素を有する化合物が用いられるが、この他
に、例えば酸無水物、カルボン酸あるいは3級アミン等
も用いられる。
As the curing agent (C) in the present invention, a compound having Q2 or more active hydrogens in the molecule is usually used, but in addition to these, acid anhydrides, carboxylic acids, tertiary amines, etc. can also be used.

具体的には、例えば、ジエチレンアミン、ジエチレント
リアミン、ジエチルアミノプロビルアミンの如き脂肪族
アミン類、モノエタノールアミン、ジエタノールアミン
、N−メチルエタノールアミン、アミノエチルエタノー
ルアミンの如きヒドロキシアミン類、メタフエニレンジ
アミン、P,P′−ジアミノジフエニルメタンの如き芳
香族アミン類、これら各アミン類の活性水素の一部を脂
肪族基又は芳香族基により置換したアミン類、また例え
ば、以下の如き酸無水物(かかる硬化剤を用いたときに
は接着層の耐熱性を向上せしめることができる。
Specifically, for example, aliphatic amines such as diethyleneamine, diethylenetriamine, diethylaminoprobylamine, hydroxyamines such as monoethanolamine, diethanolamine, N-methylethanolamine, aminoethylethanolamine, metaphenylenediamine, Aromatic amines such as P,P'-diaminodiphenylmethane, amines in which a portion of the active hydrogen of each of these amines is substituted with an aliphatic group or an aromatic group, and acid anhydrides such as the following ( When such a curing agent is used, the heat resistance of the adhesive layer can be improved.

)をあげることができるが、酸無水物を用いるときには
少量のアミン又はアルコールと併用するのが好ましい。
), but when using an acid anhydride, it is preferable to use it together with a small amount of amine or alcohol.

すなわち、無水フタル酸、無水マレイン酸、ヘキサヒド
ロフクール酸無水物、ドデセニル無水コハク酸、無水ヒ
メリン酸、ヘキサク口ローエンドメチレンテトラヒドロ
無水フタル酸等の酸無水物があげられる。
Specifically, acid anhydrides such as phthalic anhydride, maleic anhydride, hexahydrofucuric anhydride, dodecenylsuccinic anhydride, himelic anhydride, and hexagonal low-end methylenetetrahydrophthalic anhydride are mentioned.

また、例えばフタル酸の如き多価カルボン酸や、ある種
のフェノール樹脂、尿素樹脂、ポリエステル樹脂、ポリ
スルフイド樹脂、メラミン樹脂、ポリアミド樹脂、ポリ
アミンの如き多数の活性水素を有した高分子化合物、ト
リエチルアミン、ベンジルジメチルアミンの如き第3級
アミン、その他トリアルカノールアミンホウ酸塩の如き
有機アミン錯塩、(C4H9)2sn(OCOCoH2
g)2 , C a(AA(QC4Hg)4 :]2
,( C4H9 0 4 T iの如き金属化合物等を
あげることができる。
Furthermore, polyhydric carboxylic acids such as phthalic acid, certain phenol resins, urea resins, polyester resins, polysulfide resins, melamine resins, polyamide resins, polymeric compounds having a large number of active hydrogens such as polyamines, triethylamine, Tertiary amines such as benzyldimethylamine, other organic amine complex salts such as trialkanolamine borate, (C4H9)2sn(OCOCoH2
g)2, Ca(AA(QC4Hg)4:]2
, (Metal compounds such as C4H904Ti, etc.) can be mentioned.

本発明の感光性樹脂用支持板は、上記化合物(4)2(
矧および硬化剤(0との反応生戒物である不飽和炭素一
炭素二重結合を側鎖Oこ有する三次元重合体の層を基材
の上6こ設けてなるものである。
The support plate for photosensitive resin of the present invention comprises the compound (4) 2(
Six layers of a three-dimensional polymer having side chains of unsaturated carbon-carbon double bonds, which are reactants with a curing agent and a curing agent (0), are provided on a base material.

上記三次元重合体は炭素一炭素二重結合を重合体1グラ
ム当りIXIO−’〜I X 1 0−” モル、好ま
しくはI X 1 0−3〜4X10−”モルの割合で
含有する。
The three-dimensional polymers contain carbon-carbon double bonds in a proportion of from IXIO-' to IX10-'' moles, preferably from IX10-3 to 4X10-'' moles per gram of polymer.

上記基材としては、例えば次の如きものをあげることが
できる。
Examples of the above-mentioned base material include the following.

例えば、鉄、ステンレス鋼、亜鉛、アルミニウム等から
なる金属板、天然ゴム、合成ゴム等からなるゴムシ一ト
、セルローズ、セルローズ誘導体、ポリオレフイン、ポ
リエステル、ポリカーボネート、ポリスルホン等からな
るフイルム、シートあるいは紙、布等の厚さ0.1〜数
皿のものが好ましく用いられる。
For example, metal plates made of iron, stainless steel, zinc, aluminum, etc., rubber sheets made of natural rubber, synthetic rubber, etc., films, sheets, paper, cloth made of cellulose, cellulose derivatives, polyolefin, polyester, polycarbonate, polysulfone, etc. Those having a thickness of 0.1 to several plates are preferably used.

又、光重合性組或物の重合により製造したフイルム、シ
ート状物であっても良い。
It may also be a film or sheet-like product produced by polymerizing a photopolymerizable composition.

これら基材中には、充填剤や補強剤を存在せしめること
ができ、特に高度に光を反射する基材例えば金属板等を
用いるときには、このように設けられた感光性樹脂層を
通過した光は90’以外の角度で支持体面を照射し反射
したのち画像のない個処にまで重合を起させるので、こ
のような基材を用いる場合には、入射活性光線の少くと
も50饅程度を吸収するに充分な光吸収剤を上記三次元
重合体の層(接着層)中{こ混入するかあるいはいわゆ
る基材面上にハレーション防止層を設けるのがよい。
Fillers and reinforcing agents can be present in these base materials, and especially when using a highly light-reflecting base material such as a metal plate, the light that has passed through the photosensitive resin layer provided in this way is When using such a substrate, it is necessary to absorb at least 50 degrees of the incident actinic rays, because after irradiating and reflecting the support surface at an angle other than 90', polymerization occurs even in areas where there is no image. It is preferable to incorporate a sufficient amount of a light absorbing agent into the three-dimensional polymer layer (adhesive layer) or to provide an antihalation layer on the surface of the substrate.

ハレーション防止層を設けた場合にはハレーション防止
層を設けた基材を本発明にいう基材と考えれば良く、本
発明はかかる場合も包含する。
In the case where an antihalation layer is provided, the substrate provided with the antihalation layer may be considered as the substrate according to the present invention, and the present invention also includes such a case.

かかる光吸収剤またはハレーション防止層中の光吸収剤
は無色のものであっても着色したものであっても良い。
Such light absorbers or light absorbers in the antihalation layer may be colorless or colored.

好適な光吸収剤としては例えば、カーボンブラック、四
三酸化鉛、二酸化チタン、ベンチジンイエロー、ローダ
ミン等の近紫外部に吸収を有する無機ならびに有機顔料
また従来効果的な紫外線吸収剤として知られているペン
ゾフエノン系あるいはベンゾt− IJアヅール系化合
物等をあげることができる。
Suitable light absorbers include, for example, inorganic and organic pigments that absorb in the near ultraviolet region, such as carbon black, trilead tetroxide, titanium dioxide, benzidine yellow, and rhodamine, as well as those conventionally known as effective ultraviolet absorbers. Examples include penzophenone type compounds and benzo t-IJ azur type compounds.

基材上に重合体層(接着層)を設ける方法としては、上
記化合物(4),圓および硬化剤(C)の配合混合物で
基材面上を被覆し、次いでこれを加熱もしくは熟成しイ
オン的付加反応せしめることにより行う方法が好適であ
る。
A method for forming a polymer layer (adhesive layer) on a substrate is to coat the surface of the substrate with a blended mixture of the above compound (4), a circle, and a curing agent (C), and then heat or age the mixture to form an ionized layer. Preferably, the method is carried out by carrying out an addition reaction.

接着層の厚さは通常5〜100ミクロン程度で充分にそ
の目的を達或する。
The thickness of the adhesive layer is usually about 5 to 100 microns, which is sufficient to achieve its purpose.

また、上記配合混合物には必要に応じ更に、イオン的付
加反応触媒、ラジカル重合抑制剤または禁止剤等を含有
せしめても良い。
Further, the above-mentioned blended mixture may further contain an ionic addition reaction catalyst, a radical polymerization inhibitor or inhibitor, etc., if necessary.

かくして得られた本発明の感光性樹脂支持体の接着層は
極めて丈夫であり、通常接触したりあるいはこれを重ね
合せても損われることはなくまた粘着したりする恐れも
ない。
The adhesive layer of the photosensitive resin support of the present invention thus obtained is extremely strong, and will not be damaged even if it is brought into contact with it or is overlapped with it, and there is no risk of it sticking.

本発明の支持板を用いて感光性樹脂板を製造する際には
、光の作用によって重合する感光性樹脂組或物を該支持
板上にコーティング、スクイーズ、スプレイあるいはラ
ミネート等公知の被覆法を適用して均一な厚さに被覆方
法を適用して均一な厚さに被覆する。
When manufacturing a photosensitive resin plate using the support plate of the present invention, a photosensitive resin composition that polymerizes under the action of light is coated on the support plate by a known coating method such as squeezing, spraying, or laminating. Apply a coating method to obtain a uniform thickness.

凸版印刷板を製造するのに好適な感光性樹脂組或物は、
ラジカル的付加重合性の不飽和炭素一炭素二重結合を有
する化合物を光6こよって活性化する光重合開始剤の両
者を含有し、必要あれば更に上記化合物を保持するため
の溶剤可溶性高分子量重合体、例えばセルローズエステ
ル、セルローズエーテルの如きセルローズ誘導体、ポリ
ビニールアルコールの如きポリオレフイン、ポリアミド
、ポリエステルの如き縮合重合体を含有する感光性樹脂
組成物である。
Photosensitive resin compositions suitable for producing letterpress printing plates include:
A solvent-soluble high molecular weight compound containing both a photopolymerization initiator that activates a radically addition-polymerizable compound having an unsaturated carbon-carbon double bond with light and, if necessary, further retaining the above-mentioned compound. It is a photosensitive resin composition containing a polymer, for example, a cellulose derivative such as cellulose ester or cellulose ether, a polyolefin such as polyvinyl alcohol, a polyamide, or a condensation polymer such as polyester.

かくして得られた感光性樹脂構或体から凸版印刷版を製
造するOこは透明な画線部を有するネガフイルムを通し
て感光性樹脂層に光を照射し、次で適当な溶媒で処理す
る。
To produce a letterpress printing plate from the photosensitive resin structure thus obtained, the photosensitive resin layer is irradiated with light through a negative film having a transparent image area, and then treated with a suitable solvent.

感光性樹脂層の光が当った部分とさらにその丁Oこある
接着層Qこ含まれているラジカル的付加重合性の不飽和
炭素一炭素二重結合と感光性樹脂組成物中の不飽和炭素
一炭素二重結合が実質的に一体となって重合し、溶媒に
不溶になると同時に強固に接着する。
The portion of the photosensitive resin layer that is exposed to light and the adhesive layer Q that is close to the photosensitive resin layer contain radical addition polymerizable unsaturated carbon-carbon double bonds and unsaturated carbon in the photosensitive resin composition. The one-carbon double bonds polymerize substantially together, making it insoluble in solvents and at the same time strongly adhering.

光の当らなかった部分は重合が起らないので溶媒によっ
て除去され、直ちに印刷機にとりつけて印刷できる印刷
版が得られる。
Since polymerization does not occur in the areas that are not exposed to light, they are removed by a solvent, and a printing plate that can be immediately mounted on a printing press and printed is obtained.

支持体と重合して残った凸版レリーフ像との接着性は極
めて強く、また、インキや他の溶媒等に対して侵されな
いのでその耐刷性は、非常に優れており、数十万部ある
いはそれ以上の通し印刷が可能である。
The adhesion between the support and the remaining relief image after polymerization is extremely strong, and it is not attacked by ink or other solvents, so its printing durability is extremely excellent, and can be printed in the hundreds of thousands of copies or more. More continuous printing is possible.

以下、実施例昏こより本発明を更に詳細をこ説明する。Hereinafter, the present invention will be explained in more detail with reference to Examples.

実施例 1 表面Gこ錫メッキした厚さ0. 3 mmの銅板に鉛丹
を含有するエポキシ塗料(東亜ペイント製エピライト)
を25ミクロンの厚さに塗布(下塗り層と称す)し、1
30℃で20分間加熱処理後、グリシジールメタクリレ
ートを全固型分に対して30重量係含む透明なエポキシ
塗料を15ミクロンの厚さに吹付け塗装(上塗り層と称
す)して充分風乾後、100℃で20分間加熱処理して
非粘着性の感光性樹脂用支持板を得た。
Example 1 The surface was tin-plated with a thickness of 0. Epoxy paint containing red lead on a 3 mm copper plate (Epirite manufactured by Toa Paint)
was applied to a thickness of 25 microns (referred to as an undercoat layer), and 1
After heat treatment at 30°C for 20 minutes, a transparent epoxy paint containing 30% by weight of glycidyl methacrylate based on the total solid content was spray-coated to a thickness of 15 microns (referred to as a top coat layer), and after thoroughly air-dried, A non-adhesive photosensitive resin support plate was obtained by heat treatment at 100° C. for 20 minutes.

かくして制られた上塗り層中にはグリシジルメCH3 I タアクリレートから由来するCH2二C一基が層19当
り約3X10−”モル含有されている。
The topcoat layer thus obtained contains approximately 3.times.10@-" moles of CH22C derived from glycidylmethacrylate per layer 19.

前記下塗り層及び上塗り層に使用したエポキシ塗料の成
分、組戒その他の詳細は次の通りである。
The components, composition, and other details of the epoxy paint used for the undercoat layer and topcoat layer are as follows.

(下塗り層用エポキシ塗料) 下塗り層用エポキシ塗料は、ビスフェノールAとエビク
ロルヒドリンを縮合させて得られたエポキシ当量4×1
0−3当量/ 9 rのエポキシ樹脂(平均分子量約5
00)20重量部、末端アミノ基のアミン当量がI X
1 0−2当量//!rである脂肪族ポリアミド樹脂
15重量部、及び鉛丹約20重量部を、トルエン、ジア
セトンアルコール及びn−ブタノールを主成分とするシ
ンナーに均一に溶解、分散した塗料である。
(Epoxy paint for undercoat layer) The epoxy paint for undercoat layer is an epoxy equivalent of 4×1 obtained by condensing bisphenol A and shrimp chlorohydrin.
0-3 equivalents/9r epoxy resin (average molecular weight approx. 5
00) 20 parts by weight, the amine equivalent of the terminal amino group is I
1 0-2 equivalent //! This paint is made by uniformly dissolving and dispersing 15 parts by weight of aliphatic polyamide resin (r) and about 20 parts by weight of red lead in a thinner whose main components are toluene, diacetone alcohol, and n-butanol.

(上塗り層用エボキシ塗料) 上塗り層用エポキシ塗料は、前記エポキシ樹脂を50重
量幅含有するクリヤーA液40重量部、前記ポリアミド
樹脂を40重量φ含有するクリャ一B液50重量部、グ
リシジルメタアクリレート30重量部及び前記シンナー
20重量部を使用数時間前に混合して調整した。
(Epoxy paint for top coat layer) The epoxy paint for top coat layer includes 40 parts by weight of Clear A liquid containing 50 weight range of the above-mentioned epoxy resin, 50 parts by weight of Clear B liquid containing 40 weight φ of the above-mentioned polyamide resin, and glycidyl methacrylate. The composition was prepared by mixing 30 parts by weight and 20 parts by weight of the thinner described above several hours before use.

かかる支持板に不飽和ポリエステル、アクリルアミド、
テトラメチレングリコールジアクリレートおよびペンゾ
イルイソプロビルエーテルからなる感光性樹脂組戒物を
0.7mmの厚さに塗布しネガフイルムを通して紫外線
螢光灯の活性光線を5分間照射し、次いで希アルカリ水
で洗浄して凸版印刷版を作った。
Such a support plate is made of unsaturated polyester, acrylamide,
A photosensitive resin composite consisting of tetramethylene glycol diacrylate and penzoyl isopropyl ether was applied to a thickness of 0.7 mm, exposed to active light from an ultraviolet fluorescent lamp for 5 minutes through a negative film, and then washed with dilute alkaline water. A letterpress printing version was created.

この版では50万部の印刷テスト後も樹脂の剥離がみら
れなかった。
With this plate, no peeling of the resin was observed even after a printing test of 500,000 copies.

一方前記銅板に鉛丹を含むエポキシ塗料を塗布加熱処理
後、グリシジルメタアクリレートを含有しない透明なエ
ポキシ塗料のみを塗布加熱処理した支持板を使用して他
は同様にして製造した印刷版は感光性樹脂と支持板との
接着力が非常に弱く小さな点や細い線のレリーフ部分は
、手を触れるだけで支持板から剥離した。
On the other hand, after applying an epoxy paint containing red lead to the copper plate and heat-treating it, a printing plate manufactured in the same manner except for using a support plate coated with only a transparent epoxy paint that does not contain glycidyl methacrylate and heat-treated is photosensitive. The adhesive force between the resin and the support plate was very weak, and the relief parts, which were small dots and thin lines, were peeled off from the support plate just by touching them.

この印刷版で1万部の印刷テストを行った結果、リーダ
ー罫、細線、独立した小さな点のレリーフ部分等が支持
板から剥離して全く印刷版として使用不可能であった。
As a result of a printing test of 10,000 copies with this printing plate, the leader lines, thin lines, relief parts of small independent dots, etc. were peeled off from the support plate, and it was completely unusable as a printing plate.

実施例 2 シアニングリーンを含有するエポキシ塗料(川上塗料製
エトン#2100)にヘキサメチレンジアミン1モルに
対してグリシジールメタアクリレートを2モル反応させ
た化合物を全固形分に対して33重量φ混合し、この混
合物を厚さ0. 2 0 mmのアルミニューム板に3
0ミクロンの厚さに塗布し、直ちに120℃で30分間
加熱処理して得られた支持板を用0)で実施例1の方法
に従って凸版印刷板を作り10万部の印刷テスト後も樹
脂の剥離は見られなかった。
Example 2 A compound obtained by reacting 2 moles of glycidyl methacrylate with 1 mole of hexamethylene diamine was mixed into an epoxy paint containing cyanine green (Etone #2100 manufactured by Kawakami Paint Co., Ltd.) at 33 weight φ based on the total solid content. , this mixture was made to a thickness of 0. 3 on a 20 mm aluminum plate
Using the support plate obtained by applying the coating to a thickness of 0 micron and immediately heating it at 120°C for 30 minutes, a letterpress printing plate was made according to the method of Example 1. Even after a printing test of 100,000 copies, the resin remained No peeling was observed.

上記において用いたエポキシ塗料(川上塗料製エトン#
2100)を含む塗料の詳細は下記の通りである。
Epoxy paint used in the above (Eton # manufactured by Kawakami Paint Co., Ltd.)
The details of the paint containing 2100) are as follows.

ビスフエノルAとエピクロルヒドリンをアルカリ性溶液
で縮合せしめた分子量約1100のエポキシ樹脂20重
量部、ヘキサメチレンジアミンとグリシジルメタアクリ
レートの1二2モル比反応生成物(塗料と同じ溶媒を用
いて、固形分濃度30重量饅で徐々に加熱して、ゲル化
防止剤としてメトキシフェノールを存在さたた状態で反
応せしめて得られた粘稠液)15重量部、硬化剤として
エチレンジアミン2重量部、ハレーション防止剤として
シアニングリーン7重量部並びにトルエン、n−ブタノ
ール及びメチルセロソルブから或る混合溶媒80重量部
を混合して調整した。
20 parts by weight of an epoxy resin with a molecular weight of approximately 1100, which is obtained by condensing bisphenol A and epichlorohydrin in an alkaline solution, and a reaction product of 122 molar ratio of hexamethylene diamine and glycidyl methacrylate (using the same solvent as the paint, solid content concentration 30 parts) 15 parts by weight of a viscous liquid obtained by gradually heating a steamed rice cake and reacting in the presence of methoxyphenol as an anti-gelling agent, 2 parts by weight of ethylenediamine as a hardening agent, and cyanine as an anti-halation agent. It was prepared by mixing 7 parts by weight of green and 80 parts by weight of a certain mixed solvent from toluene, n-butanol and methyl cellosolve.

CH3 なお、硬化塗膜中のCH2−C一基の含有量は約1.5
X10”−3モル/ 9 rである。
CH3 The content of one CH2-C group in the cured coating is approximately 1.5
X10"-3 mol/9 r.

実施例 3 厚さ0.15mmのポリエステルフイルムをサンドプラ
ストした後、ヘキサメチレンジアミン2モルに対してグ
リシジールアリルエーテル3モルを実施例2(こ示した
と同様の方法で予備的に反応させた化合物を6.7重量
φ、実施例1で用いたエポキシ樹脂6.7重量饅及び鉛
丹を5重量多含有するエポキシ塗料を7ミクロンの厚さ
に吹付け塗装し充分乾燥後80℃で60分間加熱処理し
た。
Example 3 After sand-blasting a polyester film with a thickness of 0.15 mm, 3 moles of glycidyl allyl ether were preliminarily reacted with 2 moles of hexamethylene diamine in the same manner as in Example 2. was 6.7 weight φ, and an epoxy paint containing 6.7 weight weight of the epoxy resin used in Example 1 and 5 weight of red lead was spray-coated to a thickness of 7 microns, and after sufficiently drying, it was heated at 80°C for 60 minutes. Heat treated.

得られた塗膜中にはCH2−CH一基が約2×10−3
モル/9 r含まれている。
In the resulting coating film, one CH2-CH group is approximately 2 x 10-3
Contains mol/9 r.

かかる支持板は感光性樹脂用支持板として粘着性のない
、接着性の優れた支持板であった。
This support plate was a support plate for photosensitive resins that had no tackiness and had excellent adhesive properties.

実施例 4 厚さ0.3朋のポリカーボネイトフイルムにベンジジン
イエロー30重量部と実施例1で用いた下塗り層用エポ
キシ塗料から鉛丹を除いたエポキシ塗料100重量部と
の混合溶液を20ミクロンの厚さに塗布乾燥後、実施例
1で用いたクリヤーB液(ポリアミド樹脂含量40重量
多)に該クリヤーB液中の硬化剤(アミン当量3.7X
10−”当量/&)59に対してグリシジルメタクリレ
ート(エポキシ当量7.OX10−3当量#)2gを添
加して130’Cで1時間反応せしめ得られた化合物を
全固型分に対して40重量多含有する上記の透明なエポ
キシ塗料を5ミクロンの厚さ(こ塗布し、100’Cで
30分間加熱処理した。
Example 4 A mixed solution of 30 parts by weight of benzidine yellow and 100 parts by weight of an epoxy paint obtained by removing red lead from the epoxy paint for the undercoat layer used in Example 1 was applied to a polycarbonate film with a thickness of 20 microns. After coating and drying, the hardening agent (amine equivalent: 3.7×
2 g of glycidyl methacrylate (epoxy equivalent: 7.OX10-3 equivalent #) was added to 10-"equivalent/&) 59, and the resulting compound was reacted at 130'C for 1 hour. The heavy-duty transparent epoxy paint described above was applied to a thickness of 5 microns and heat treated at 100'C for 30 minutes.

このように製造された支持板は感光性樹脂用支持板とし
て接着効果が優れておりきわめて品質の優れたものであ
った。
The support plate manufactured in this way had an excellent adhesive effect as a support plate for photosensitive resin, and was of extremely high quality.

Claims (1)

【特許請求の範囲】[Claims] 1 エポキシ化合物A1分子内に不飽和炭素一炭素二重
結合とエポキシ基又はアミン基とを併有する化合物(D
および硬化斉1,KOとを反応せしめて得られた、不飽
和炭素一炭素二重結合を側鎖に有する三次元重合体の層
を基材の上に設けてなる感光性樹脂用支持板。
1 Epoxy compound A A compound having both an unsaturated carbon-carbon double bond and an epoxy group or an amine group in one molecule (D
A support plate for a photosensitive resin, comprising a base material and a layer of a three-dimensional polymer having an unsaturated carbon-carbon double bond in a side chain, which is obtained by reacting a polymer with a cured compound 1,KO.
JP3754673A 1973-04-02 1973-04-02 Kankoseijiyushuyoushijiban Expired JPS5837532B2 (en)

Priority Applications (12)

Application Number Priority Date Filing Date Title
JP3754673A JPS5837532B2 (en) 1973-04-02 1973-04-02 Kankoseijiyushuyoushijiban
AU67152/74A AU483122B2 (en) 1974-03-26 Support for liquid photosensitive resin
DE19742414596 DE2414596C3 (en) 1973-04-02 1974-03-26 Method of making a presensitized printing plate
BE142607A BE813020A (en) 1973-04-02 1974-03-29 SUPPORT FOR LIQUID PHOTOSENSITIVE RESIN
FR7411264A FR2223197B1 (en) 1973-04-02 1974-03-29
CH453174A CH597623A5 (en) 1973-04-02 1974-04-01
CA196,445A CA1045880A (en) 1973-04-02 1974-04-01 Support for liquid photosensitive resin
DD17762674A DD110705A5 (en) 1973-04-02 1974-04-02
GB1461274A GB1463616A (en) 1973-04-02 1974-04-02 Supports for photosensitive polymer coatings
NL7404486A NL161711C (en) 1973-04-02 1974-04-02 METHOD FOR MANUFACTURING A PRESSURE PLATE CARRIER
IT2061074A IT1007425B (en) 1973-04-02 1974-04-08 SUPPORT FOR PHOTOSENSITIVE LIQUID RESIN
US05/596,189 US4060656A (en) 1973-04-02 1975-07-15 Support for photosensitive resin

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3754673A JPS5837532B2 (en) 1973-04-02 1973-04-02 Kankoseijiyushuyoushijiban

Publications (2)

Publication Number Publication Date
JPS49132167A JPS49132167A (en) 1974-12-18
JPS5837532B2 true JPS5837532B2 (en) 1983-08-17

Family

ID=12500512

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3754673A Expired JPS5837532B2 (en) 1973-04-02 1973-04-02 Kankoseijiyushuyoushijiban

Country Status (10)

Country Link
JP (1) JPS5837532B2 (en)
BE (1) BE813020A (en)
CA (1) CA1045880A (en)
CH (1) CH597623A5 (en)
DD (1) DD110705A5 (en)
DE (1) DE2414596C3 (en)
FR (1) FR2223197B1 (en)
GB (1) GB1463616A (en)
IT (1) IT1007425B (en)
NL (1) NL161711C (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011197425A (en) * 2010-03-19 2011-10-06 Tokyo Ohka Kogyo Co Ltd Surface modifying material, resist pattern forming method and pattern forming method

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5492402A (en) * 1977-12-28 1979-07-21 Asahi Chemical Ind Photosensitive resin relief printing and fabrication
EP1129390A1 (en) * 1998-11-12 2001-09-05 Andrew Michael Thompson Priming composition for bonding photoresists on substrates
DE10040929A1 (en) 2000-08-18 2002-02-28 Basf Drucksysteme Gmbh Process for the production of organically developable, photopolymerizable flexographic printing elements on flexible metallic supports

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE623613A (en) * 1961-10-16

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011197425A (en) * 2010-03-19 2011-10-06 Tokyo Ohka Kogyo Co Ltd Surface modifying material, resist pattern forming method and pattern forming method

Also Published As

Publication number Publication date
FR2223197B1 (en) 1979-07-06
DE2414596B2 (en) 1980-11-13
NL7404486A (en) 1974-10-04
CH597623A5 (en) 1978-04-14
NL161711C (en) 1980-03-17
NL161711B (en) 1979-10-15
DE2414596A1 (en) 1974-10-03
DD110705A5 (en) 1975-01-05
IT1007425B (en) 1976-10-30
AU6715274A (en) 1975-10-02
CA1045880A (en) 1979-01-09
DE2414596C3 (en) 1981-07-23
GB1463616A (en) 1977-02-02
JPS49132167A (en) 1974-12-18
FR2223197A1 (en) 1974-10-25
BE813020A (en) 1974-07-15

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