JPS5837514A - Cooling type photoelectric converter - Google Patents

Cooling type photoelectric converter

Info

Publication number
JPS5837514A
JPS5837514A JP56135965A JP13596581A JPS5837514A JP S5837514 A JPS5837514 A JP S5837514A JP 56135965 A JP56135965 A JP 56135965A JP 13596581 A JP13596581 A JP 13596581A JP S5837514 A JPS5837514 A JP S5837514A
Authority
JP
Japan
Prior art keywords
photoelectric conversion
polyhedron
cooling
signal processing
type photoelectric
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP56135965A
Other languages
Japanese (ja)
Inventor
Hiroshi Sakai
宏 酒井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP56135965A priority Critical patent/JPS5837514A/en
Publication of JPS5837514A publication Critical patent/JPS5837514A/en
Pending legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01JMEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02Constructional details
    • G01J5/06Arrangements for eliminating effects of disturbing radiation; Arrangements for compensating changes in sensitivity
    • G01J5/061Arrangements for eliminating effects of disturbing radiation; Arrangements for compensating changes in sensitivity by controlling the temperature of the apparatus or parts thereof, e.g. using cooling means or thermostats

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Optical Transform (AREA)
  • Light Receiving Elements (AREA)

Abstract

PURPOSE:To reduce the size of a cooling type photoelectric converter by forming a polyhedron on the external circumferential surface of a cooling board on which a photoelectric converting element is arranged and dispersedly arranging elements for processing signals from the photoelectric converting element on respective surfaces of the polyhedron. CONSTITUTION:An airtight vessel having a Dewar construction is constituted by both inner and outer tubes 1, 2 and the space between these inner and outer tubes 1, 2 is kept under vacuum. A cooling board 24 is cooled by an electronic cooler 9 to cool an infrared-ray detecting element 25. The sides of the cooling board 24 are formed like a polyhedron and a signal processing element 26 for reading out and processing signal outputs from the infrared-ray detecting element 25 and a driving element 26' for driving the signal processing element 26 are arranged on each surface of the polyhedron.

Description

【発明の詳細な説明】 本発明は冷却型光電変換装置に係り、特に多素子型の光
電変換素子と信号処理用の回路素子とを組込んだ211
管構造の冷却型光電変換装置の改良に関するものである
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a cooling type photoelectric conversion device, and in particular to a cooling type photoelectric conversion device incorporating a multi-element type photoelectric conversion device and a signal processing circuit element.
This invention relates to an improvement of a cooling type photoelectric conversion device having a tube structure.

一般に冷却型光電変換装置は、例えば力゛フス管とコバ
ー〃会金等の金属リングからなる2重管構造の気密容器
からな9、その外管の一部に透光窓が設けられ、該透光
窓に対向した内管の真空側管壁に光電変換素子(赤外線
検知素子等)を配設した構成をそなえている。第1図は
そのような従来の光電変換装蓋の構成を示しており、図
において1は外管、2は内管であって、これら内外両管
1゜2でデユワ構造の気密容器が構成され、内外両管1
.2間は真空に保たれている。8は前記外管1の一端外
側に設けられた透光窓、4は前記透光窓8に対向する内
管2上に配設された冷却基台である。該冷却基台4上に
光電変換素子、本例では赤外線検知素子6が図示しない
絶縁板を介して固着され、該素子5からの信号出力は前
記素子6の側部にもうけられた中継端子板6を介してリ
ード線7により曲紀外管lに植設された外部引出端子8
より取り出される。tた前記素子6は比較的低温で動作
させる必要がめることから内管2内に例えばジューMト
ムソン5あるいは電子型冷却器9を取りつけて前記冷却
基台4を介して赤外線検知素子6を冷却している。
In general, a cooled photoelectric conversion device consists of an airtight container with a double tube structure consisting of, for example, a power tube and a metal ring made of Koba metal. It has a structure in which a photoelectric conversion element (infrared detection element, etc.) is disposed on the vacuum side tube wall of the inner tube facing the light-transmitting window. Figure 1 shows the structure of such a conventional photoelectric conversion unit. In the figure, 1 is an outer tube, 2 is an inner tube, and these inner and outer tubes 1°2 constitute an airtight container with a dewar structure. Both inner and outer pipes 1
.. The space between the two is kept in vacuum. Reference numeral 8 indicates a light-transmitting window provided outside one end of the outer tube 1, and 4 indicates a cooling base disposed on the inner tube 2 facing the light-transmitting window 8. A photoelectric conversion element, in this example an infrared detection element 6, is fixed on the cooling base 4 via an insulating plate (not shown), and a signal output from the element 5 is connected to a relay terminal board provided on the side of the element 6. External lead-out terminal 8 implanted in the curved outer tube l by the lead wire 7 through the lead wire 6
taken out. Since it is necessary to operate the infrared sensing element 6 at a relatively low temperature, the infrared sensing element 6 is cooled via the cooling base 4 by installing, for example, a Joux M Thomson 5 or an electronic type cooler 9 in the inner tube 2. ing.

ところで1述の如き111成の光電変換装蓋において、
光電変sA素子と信号処理素子等とを一緒に配置する方
法は周知であるが、例えば光電変換部を赤外線検知用−
次元アレイ素子と、信号処理素子及び信号処理素子を動
作させる駆動素子などの複数種の素子を組合せて同一平
面上にハイブリッド構造とした場合、これらの配設面積
が大幅に増大するばかりでなく、これに起因して装置の
大型化は避けられない。また赤外線検知用−次元アレイ
素子の配設同一平面上に前記信号処理素子等も配設され
ているので、透光窓から入射される入射光は当然−次元
プレイ素子以外の素子にも漏洩する恐れがあり、該素子
の特性を劣化させる不都合があった。
By the way, in the 111-component photoelectric conversion device as mentioned above,
A method of arranging a photoelectric converter sA element and a signal processing element etc. together is well known, but for example, a photoelectric converter for infrared detection
When multiple types of elements such as dimensional array elements, signal processing elements, and drive elements for operating the signal processing elements are combined to form a hybrid structure on the same plane, not only the area for these elements increases significantly, but also Due to this, an increase in the size of the device is unavoidable. Furthermore, since the signal processing elements and the like are arranged on the same plane as the dimensional array element for infrared detection, the incident light that enters through the transparent window naturally leaks to elements other than the dimensional array element. There was a risk that the characteristics of the device would deteriorate.

本発明の目的は、上記の点を解消すべく光電変換素子と
信号処理素子尋をハイブリッド構造に配設する構成を更
に発展させて、赤外線検知用−次元プレイ素子からなる
光電変換素子が配設された冷却基台の外周面を多面体と
し、該多面体の各面上に前記光電変換素子からの信号を
処理する処理素子及びその的の関連素子を分散配置して
装置全体を小型化した新規な冷却型光1[変換装置を提
供せんとするものである。
An object of the present invention is to further develop the configuration in which a photoelectric conversion element and a signal processing element are arranged in a hybrid structure in order to solve the above problems, and to provide a photoelectric conversion element consisting of a dimensional play element for infrared detection. The outer circumferential surface of the cooling base is made into a polyhedron, and processing elements for processing signals from the photoelectric conversion element and related elements are distributed on each surface of the polyhedron, thereby reducing the size of the entire device. Cooling type light 1 [This is intended to provide a conversion device.

以下図面を用いて本発明の実施例について詳細に説明す
る。
Embodiments of the present invention will be described in detail below with reference to the drawings.

第2図は本発明に係る冷却型光電変換装置の一実施例を
示す141断面図であり、第1図と同等部分には同一符
号を付している0図示のように本実施例においては、多
素子型の光電変換素子、例えば赤外tsi知用−次元プ
レイ素子26が配置される冷却基台24の側周面を多面
体とした形状とし、該冷却基台24の上面に前記−次元
プレイ素子25を図示しない絶縁板を介して配置すると
共に、前記多面体の各面上にそれぞれ図示しない絶縁板
を介して前記−次元アレイ素子25の信号出力を続出し
処理する信号処理素子26、及び該信号処理素子を動作
させる駆動素子26′等を配設し、前記−次元アレイ素
子26と信号処理素子26、及び駆動素子26をそれぞ
れリード線27で接続して立体形状に組合せたハイブリ
ッド構造とする。第8図は、前記冷却基台24の側周面
を6面体とした場合の構成例を示している。このように
mtiすれば光電変換部が極めて合理的に小型になると
共に曲記−次元アレイ素子26以外の各素子26゜26
′が入射光に対して垂直な面に配置されているので、該
各素子26.26’への入射光の漏洩をなくすることが
できる。
FIG. 2 is a 141 cross-sectional view showing one embodiment of the cooling type photoelectric conversion device according to the present invention, and the same parts as in FIG. 1 are given the same reference numerals. The side circumferential surface of the cooling base 24 on which a multi-element type photoelectric conversion element, for example, the infrared TSI known-dimensional play element 26 is disposed, is shaped as a polyhedron, and the upper surface of the cooling base 24 has the above-mentioned -dimensional A signal processing element 26 which arranges the play element 25 via an insulating plate (not shown) and sequentially processes the signal output of the -dimensional array element 25 on each surface of the polyhedron via an insulating plate (not shown), and A hybrid structure in which a drive element 26' etc. for operating the signal processing element is provided, and the -dimensional array element 26, the signal processing element 26, and the drive element 26 are connected by lead wires 27 and combined into a three-dimensional shape. do. FIG. 8 shows a configuration example in which the side peripheral surface of the cooling base 24 is a hexahedron. By using mti in this way, the photoelectric conversion section can be extremely rationally miniaturized, and each element other than the curvature-dimensional array element 26 can be
Since the elements 26 and 26' are arranged on a plane perpendicular to the incident light, leakage of the incident light to each element 26 and 26' can be prevented.

なお本実施例では冷却基台24の側周面を6面体とした
図例で示したが、本発明はこれに限定するものではなく
必要に応じて例えば8面体から7゜8面体と槁々斐形し
て夾施できることはいうまで本ない。また各素子間の電
気的な接続tより一ド線による接続のほかに前記冷却基
台の上面及び側周面を絶縁体で覆い、該絶縁体面に族7
v法あるいは印刷法によってリードパターンをもうけ、
かかるリードパターンを利用して各素子間の電気的接続
をはかるようにしてもよい。
In this embodiment, the side peripheral surface of the cooling base 24 is illustrated as a hexahedron, but the present invention is not limited to this, and may be changed from an octahedron to a 7° octahedron as necessary. Needless to say, there is nothing that can be done in a certain form. In addition to the electrical connection between each element using a single lead wire, the top surface and side circumferential surface of the cooling base are covered with an insulator, and the surface of the insulator is covered with a group 7
Create a lead pattern using the v method or printing method,
Such lead patterns may be used to establish electrical connections between the elements.

以上の説明から明らかなように本発明の冷却型光電変換
装置の構成によれば、光電変換部に赤外線検知用の一次
元アレイ素子及び該素子からの信号出力を読出す機能を
有する信号処理素子等の多数種の素子を小型に組込むこ
とが可能となる。また小型化により熱負荷が低減され前
記−次元アレイ素子に対する冷却効率が向上する。さら
に曲記−次元アレイ素子以外の各関連素子が入射光に直
接さらされない配設W4aとなるので入射光の影響を受
ける恐れが解消する等の利点を有し、赤外線検知用の一
次元アレイ素子、あるいは二次元プレイ素子と信号処理
素子等を組込んだ多素子型赤外線検知装置を小型にして
性能よく構成することができる。よって冷却を必要とす
る多素子型の各櫨光電変換装置に適用して極めて有利で
ある。
As is clear from the above description, according to the configuration of the cooled photoelectric conversion device of the present invention, the photoelectric conversion section includes a one-dimensional array element for infrared detection and a signal processing element having a function of reading signal output from the element. It becomes possible to incorporate a large number of types of elements such as these into a small size. Further, due to the miniaturization, the thermal load is reduced and the cooling efficiency for the above-mentioned one-dimensional array element is improved. Furthermore, each related element other than the one-dimensional array element for infrared detection has the advantage of eliminating the possibility of being affected by the incident light because it is arranged W4a so that it is not directly exposed to the incident light. Alternatively, a multi-element infrared detection device incorporating a two-dimensional play element, a signal processing element, etc. can be made compact and configured with good performance. Therefore, it is extremely advantageous to apply it to a multi-element type photoelectric conversion device that requires cooling.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は従来の冷却型光電変換装置を説明する側断面図
、第2図は本発明に係る冷却型光電変換装置の一実施例
を示す側断面図、第8図は本発明に係る冷却型光を変換
装置の冷却基台の形状と、該冷却基台に対する各素子の
配設N4成の池の実施例を示す要部斜視図である。 図において、1は外管、2は内管、8け透光窓、24は
側周面を多面体とした冷却基台、26は−次元アレイ素
子からなる光電変換素子、26は信号処理素子、26′
はイJ号処理素子を動作させる駆動素子を示す。 第1図 第2! 一す 第3図 へ−妃 1 :4 G
FIG. 1 is a side sectional view illustrating a conventional cooling type photoelectric conversion device, FIG. 2 is a side sectional view showing an embodiment of the cooling type photoelectric conversion device according to the present invention, and FIG. 8 is a side sectional view illustrating a cooling type photoelectric conversion device according to the present invention. FIG. 3 is a perspective view of a main part showing an embodiment of the shape of a cooling base of the type light converting device and the arrangement of each element with respect to the cooling base. In the figure, 1 is an outer tube, 2 is an inner tube, 8 light-transmitting windows, 24 is a cooling base whose side peripheral surface is polyhedral, 26 is a photoelectric conversion element consisting of a -dimensional array element, 26 is a signal processing element, 26'
A indicates a drive element that operates the No. J processing element. Figure 1, Figure 2! Go to Figure 3 - Queen 1: 4 G

Claims (1)

【特許請求の範囲】[Claims] 透光窓を設けた外管と、該透光窓に対向して光電変換素
子を配設した内管とからなり、かつ内外両管の空間を真
空状顧とした2重管構造の冷却型光電変換装置において
、J:配光電変換素子が配設された内管の冷却基台の側
周面を多面体とし、該多面体の各面上に前記光電変換素
子の信号出力を処理する複数種の信号処理素子を分散配
置してなることを特徴とする冷却型光電変換装置。
A cooling type with a double tube structure, consisting of an outer tube with a light-transmitting window and an inner tube with a photoelectric conversion element arranged opposite to the light-transmitting window, and with a vacuum condition in the space between both the inner and outer tubes. In the photoelectric conversion device, the side circumferential surface of the cooling base of the inner tube on which the J: light distribution electric conversion element is disposed is a polyhedron, and a plurality of types of signals for processing the signal output of the photoelectric conversion element are placed on each surface of the polyhedron. A cooled photoelectric conversion device characterized by having signal processing elements arranged in a distributed manner.
JP56135965A 1981-08-28 1981-08-28 Cooling type photoelectric converter Pending JPS5837514A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56135965A JPS5837514A (en) 1981-08-28 1981-08-28 Cooling type photoelectric converter

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56135965A JPS5837514A (en) 1981-08-28 1981-08-28 Cooling type photoelectric converter

Publications (1)

Publication Number Publication Date
JPS5837514A true JPS5837514A (en) 1983-03-04

Family

ID=15163987

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56135965A Pending JPS5837514A (en) 1981-08-28 1981-08-28 Cooling type photoelectric converter

Country Status (1)

Country Link
JP (1) JPS5837514A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63153868A (en) * 1986-12-17 1988-06-27 Fujitsu Ltd Photoelectric transducer
WO1989000323A1 (en) * 1987-06-29 1989-01-12 Hughes Aircraft Company Optical data link
JPH03503862A (en) * 1987-10-20 1991-08-29 アルベリッド,ビルガー Cutting tools with status indicators
US5391875A (en) * 1990-07-18 1995-02-21 Raytheon Company Infrared sensor package
JP2010129833A (en) * 2008-11-28 2010-06-10 Nippon Telegr & Teleph Corp <Ntt> Optical module
CN108955899A (en) * 2018-07-24 2018-12-07 中国电子科技集团公司第十研究所 Infrared detector Dewar and detector assembly

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63153868A (en) * 1986-12-17 1988-06-27 Fujitsu Ltd Photoelectric transducer
WO1989000323A1 (en) * 1987-06-29 1989-01-12 Hughes Aircraft Company Optical data link
JPH03503862A (en) * 1987-10-20 1991-08-29 アルベリッド,ビルガー Cutting tools with status indicators
US5391875A (en) * 1990-07-18 1995-02-21 Raytheon Company Infrared sensor package
JP2010129833A (en) * 2008-11-28 2010-06-10 Nippon Telegr & Teleph Corp <Ntt> Optical module
CN108955899A (en) * 2018-07-24 2018-12-07 中国电子科技集团公司第十研究所 Infrared detector Dewar and detector assembly

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