JPS5837199U - Tape-like aggregate of chip-like electronic components - Google Patents
Tape-like aggregate of chip-like electronic componentsInfo
- Publication number
- JPS5837199U JPS5837199U JP13156381U JP13156381U JPS5837199U JP S5837199 U JPS5837199 U JP S5837199U JP 13156381 U JP13156381 U JP 13156381U JP 13156381 U JP13156381 U JP 13156381U JP S5837199 U JPS5837199 U JP S5837199U
- Authority
- JP
- Japan
- Prior art keywords
- chip
- tape
- electronic components
- aggregate
- resin tape
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920005992 thermoplastic resin Polymers 0.000 claims description 2
- 239000012943 hotmelt Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 238000007789 sealing Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Packages (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図は従来のチップ状電子部品のテーピング状集合体
の封止テープのはがされる状態の説明図、第2図は本考
案のチップ状電子部品のテーピング状集合体の二実施例
を示す斜視図、第3図は同実施例の封止テープのはがさ
れる状態の説明図である。
3−・・・・・・搬送テープ1.4ト・袖穴、−5・・
曲チップ状電子部品、6・・間熱可塑性樹脂テープ(封
止チー“プ)。FIG. 1 is an explanatory diagram of a state in which the sealing tape of a conventional taping-like assembly of chip-like electronic components is peeled off, and FIG. 2 shows two embodiments of the taping-like assembly of chip-like electronic components of the present invention. The perspective view shown in FIG. 3 is an explanatory view of the state in which the sealing tape of the same embodiment is peeled off. 3-...Conveyor tape 1.4t/armhole, -5...
Curved chip-shaped electronic components, 6... thermoplastic resin tape (sealing tape).
Claims (1)
止するホットメルト接着割付の樹脂テープとして熱可塑
性樹脂テープを用いたチップ状電子部品のテーピング状
棄合体。A taping-like combination of chip-like electronic components using a thermoplastic resin tape as a resin tape with hot-melt adhesion to thermally weld and seal the hole in the transport tape for housing the chip-like electronic component.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13156381U JPS5837199U (en) | 1981-09-03 | 1981-09-03 | Tape-like aggregate of chip-like electronic components |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13156381U JPS5837199U (en) | 1981-09-03 | 1981-09-03 | Tape-like aggregate of chip-like electronic components |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5837199U true JPS5837199U (en) | 1983-03-10 |
Family
ID=29925134
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13156381U Pending JPS5837199U (en) | 1981-09-03 | 1981-09-03 | Tape-like aggregate of chip-like electronic components |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5837199U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60180199A (en) * | 1984-02-07 | 1985-09-13 | 山本 武士 | Carrier tape and method of producing same |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS562300B2 (en) * | 1971-08-16 | 1981-01-19 | ||
JPS56101800A (en) * | 1980-01-17 | 1981-08-14 | Matsushita Electric Ind Co Ltd | Miniature electronic part packaging material |
-
1981
- 1981-09-03 JP JP13156381U patent/JPS5837199U/en active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS562300B2 (en) * | 1971-08-16 | 1981-01-19 | ||
JPS56101800A (en) * | 1980-01-17 | 1981-08-14 | Matsushita Electric Ind Co Ltd | Miniature electronic part packaging material |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60180199A (en) * | 1984-02-07 | 1985-09-13 | 山本 武士 | Carrier tape and method of producing same |
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