JPS5837199U - Tape-like aggregate of chip-like electronic components - Google Patents

Tape-like aggregate of chip-like electronic components

Info

Publication number
JPS5837199U
JPS5837199U JP13156381U JP13156381U JPS5837199U JP S5837199 U JPS5837199 U JP S5837199U JP 13156381 U JP13156381 U JP 13156381U JP 13156381 U JP13156381 U JP 13156381U JP S5837199 U JPS5837199 U JP S5837199U
Authority
JP
Japan
Prior art keywords
chip
tape
electronic components
aggregate
resin tape
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13156381U
Other languages
Japanese (ja)
Inventor
辻本 幸男
Original Assignee
松下電器産業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 松下電器産業株式会社 filed Critical 松下電器産業株式会社
Priority to JP13156381U priority Critical patent/JPS5837199U/en
Publication of JPS5837199U publication Critical patent/JPS5837199U/en
Pending legal-status Critical Current

Links

Landscapes

  • Packages (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は従来のチップ状電子部品のテーピング状集合体
の封止テープのはがされる状態の説明図、第2図は本考
案のチップ状電子部品のテーピング状集合体の二実施例
を示す斜視図、第3図は同実施例の封止テープのはがさ
れる状態の説明図である。 3−・・・・・・搬送テープ1.4ト・袖穴、−5・・
曲チップ状電子部品、6・・間熱可塑性樹脂テープ(封
止チー“プ)。
FIG. 1 is an explanatory diagram of a state in which the sealing tape of a conventional taping-like assembly of chip-like electronic components is peeled off, and FIG. 2 shows two embodiments of the taping-like assembly of chip-like electronic components of the present invention. The perspective view shown in FIG. 3 is an explanatory view of the state in which the sealing tape of the same embodiment is peeled off. 3-...Conveyor tape 1.4t/armhole, -5...
Curved chip-shaped electronic components, 6... thermoplastic resin tape (sealing tape).

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 搬送テープのチップ状電子部品を収納する穴を熱溶着封
止するホットメルト接着割付の樹脂テープとして熱可塑
性樹脂テープを用いたチップ状電子部品のテーピング状
棄合体。
A taping-like combination of chip-like electronic components using a thermoplastic resin tape as a resin tape with hot-melt adhesion to thermally weld and seal the hole in the transport tape for housing the chip-like electronic component.
JP13156381U 1981-09-03 1981-09-03 Tape-like aggregate of chip-like electronic components Pending JPS5837199U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13156381U JPS5837199U (en) 1981-09-03 1981-09-03 Tape-like aggregate of chip-like electronic components

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13156381U JPS5837199U (en) 1981-09-03 1981-09-03 Tape-like aggregate of chip-like electronic components

Publications (1)

Publication Number Publication Date
JPS5837199U true JPS5837199U (en) 1983-03-10

Family

ID=29925134

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13156381U Pending JPS5837199U (en) 1981-09-03 1981-09-03 Tape-like aggregate of chip-like electronic components

Country Status (1)

Country Link
JP (1) JPS5837199U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60180199A (en) * 1984-02-07 1985-09-13 山本 武士 Carrier tape and method of producing same

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS562300B2 (en) * 1971-08-16 1981-01-19
JPS56101800A (en) * 1980-01-17 1981-08-14 Matsushita Electric Ind Co Ltd Miniature electronic part packaging material

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS562300B2 (en) * 1971-08-16 1981-01-19
JPS56101800A (en) * 1980-01-17 1981-08-14 Matsushita Electric Ind Co Ltd Miniature electronic part packaging material

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60180199A (en) * 1984-02-07 1985-09-13 山本 武士 Carrier tape and method of producing same

Similar Documents

Publication Publication Date Title
JPS60140740U (en) side molding
JPS5837199U (en) Tape-like aggregate of chip-like electronic components
JPS5848738U (en) Sealing material
JPS6057199U (en) Taping parts series for chip-shaped electronic parts
JPS59166498U (en) Materials for taping circuit parts
JPS6029985U (en) Connection device for conductive resin pipe members
JPS60156799U (en) Chip component connection structure
JPS6025790U (en) sealing tape
JPS60171031U (en) Harness end structure
JPS5972796U (en) Taping parts series for chip-shaped electronic parts
JPS5872778U (en) Cassette tape with non-adhesive surface
JPS5874395U (en) taping parts
JPS58119522U (en) cardboard case
JPS59173895U (en) Gap sealing material
JPS59161558U (en) Seamless case for VTR tape
JPS6078199U (en) Tape for semiconductor taping
JPS5827332U (en) adhesive tape
JPS58150896U (en) Chip parts taping parts series
JPS60124913U (en) Bags with adhesive other than for sealing
JPS5946347U (en) Mount for positive film
JPS5840858U (en) chip parts
JPS5840678U (en) clamp
JPS59188880U (en) Chip parts taping type storage device
JPS5957339U (en) Envelope with opening string or tape
JPS59118173U (en) Recording tape with both ends connected