JPS5835952U - liquid spray device - Google Patents
liquid spray deviceInfo
- Publication number
- JPS5835952U JPS5835952U JP1981131484U JP13148481U JPS5835952U JP S5835952 U JPS5835952 U JP S5835952U JP 1981131484 U JP1981131484 U JP 1981131484U JP 13148481 U JP13148481 U JP 13148481U JP S5835952 U JPS5835952 U JP S5835952U
- Authority
- JP
- Japan
- Prior art keywords
- liquid
- spray device
- pipe
- liquid spray
- pass
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000007788 liquid Substances 0.000 title claims description 7
- 239000007921 spray Substances 0.000 title claims description 6
- 238000005507 spraying Methods 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 2
Landscapes
- Details Or Accessories Of Spraying Plant Or Apparatus (AREA)
- Nozzles (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図は従来の液体噴霧装置の原理を説明するための構
成略図、第2図はこの考案の一実施例を示す構成略図で
ある。
図中、1は加圧式タンク、2はスプレーノズル、3.8
は気体、4. 6. 9はパイプ、5は液体、
・7.10は電磁バルブ、11は大径部である。なお、
図中の同一符号は同一または相当部分を示す。FIG. 1 is a schematic structural diagram for explaining the principle of a conventional liquid spraying device, and FIG. 2 is a schematic structural diagram showing an embodiment of this invention. In the figure, 1 is a pressurized tank, 2 is a spray nozzle, 3.8
is a gas, 4. 6. 9 is a pipe, 5 is a liquid,
・7.10 is a solenoid valve, 11 is a large diameter part. In addition,
The same reference numerals in the figures indicate the same or corresponding parts.
Claims (1)
に導き噴霧する液体噴霧装置において、前記パイプを前
記スプレーノズルより高い位置を経過させ低い位置を経
過しない構成とし、かつ、前記高い位置部分のパイプの
一部を太くした大径部を設けたことを特徴とする液体噴
霧装置。In a liquid spraying device that leads liquid from a pressurized tank to a spray nozzle through a pipe and sprays the liquid, the pipe is configured to pass through a position higher than the spray nozzle and not pass through a lower position, and the pipe in the high position portion is A liquid spray device characterized by having a large-diameter portion that is partially thickened.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1981131484U JPS5835952U (en) | 1981-09-03 | 1981-09-03 | liquid spray device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1981131484U JPS5835952U (en) | 1981-09-03 | 1981-09-03 | liquid spray device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5835952U true JPS5835952U (en) | 1983-03-09 |
Family
ID=29925059
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1981131484U Pending JPS5835952U (en) | 1981-09-03 | 1981-09-03 | liquid spray device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5835952U (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5977225U (en) * | 1982-11-15 | 1984-05-25 | ソニー株式会社 | Semiconductor device manufacturing equipment |
JPS6242240U (en) * | 1985-08-30 | 1987-03-13 | ||
JPH01205423A (en) * | 1988-02-10 | 1989-08-17 | Tokyo Electron Ltd | Resist coater |
-
1981
- 1981-09-03 JP JP1981131484U patent/JPS5835952U/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5977225U (en) * | 1982-11-15 | 1984-05-25 | ソニー株式会社 | Semiconductor device manufacturing equipment |
JPS6242240U (en) * | 1985-08-30 | 1987-03-13 | ||
JPH01205423A (en) * | 1988-02-10 | 1989-08-17 | Tokyo Electron Ltd | Resist coater |
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