JPS5834937A - Packaging unit for semiconductor chip - Google Patents
Packaging unit for semiconductor chipInfo
- Publication number
- JPS5834937A JPS5834937A JP56134696A JP13469681A JPS5834937A JP S5834937 A JPS5834937 A JP S5834937A JP 56134696 A JP56134696 A JP 56134696A JP 13469681 A JP13469681 A JP 13469681A JP S5834937 A JPS5834937 A JP S5834937A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor chip
- tool
- solder bumps
- bonding
- bonding tool
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 18
- 238000004806 packaging method and process Methods 0.000 title abstract 2
- 229910000679 solder Inorganic materials 0.000 claims abstract description 23
- 238000000034 method Methods 0.000 claims abstract description 9
- 230000001154 acute effect Effects 0.000 claims description 3
- 238000005476 soldering Methods 0.000 abstract description 3
- 238000010276 construction Methods 0.000 abstract 2
- 239000000155 melt Substances 0.000 abstract 1
- 230000004907 flux Effects 0.000 description 6
- 238000002844 melting Methods 0.000 description 6
- 230000008018 melting Effects 0.000 description 6
- 230000000694 effects Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000006378 damage Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/79—Apparatus for Tape Automated Bonding [TAB]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/86—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using tape automated bonding [TAB]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Wire Bonding (AREA)
Abstract
Description
【発明の詳細な説明】
本発明は半田パンツを有した半導体チップをギヤングボ
ンディング法にて実装する実装装置に関し、４？に半田
バンプの溶融方式並びに実装装置のツール形状に間する
。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a mounting apparatus for mounting a semiconductor chip having solder pants by a Guyang bonding method. The method of melting solder bumps and the shape of the tool for mounting equipment will be discussed.
本発明の目的は、半田バンプを温風にて溶融し又ツール
先端形状を齋える事により、構造が簡単でツール寿命の
長い実装装置を提供すると共Ｋ。An object of the present invention is to provide a mounting device with a simple structure and a long tool life by melting solder bumps with hot air and fixing the shape of the tool tip.
信頼性の高い、半導体チップ実装品を提供する事にある
。Our goal is to provide highly reliable semiconductor chip mounted products.
従来のギヤングボンディング法による半導体チップの実
装方法を館１図に示す。Figure 1 shows a method for mounting semiconductor chips using the conventional Guy Young bonding method.
■は半田バンプ■を有する半導体チップ。■はインナー
ボンディング用リード（以下インナーリードと言う）、
■は半田バンプを溶融しインナーリードと半田付けする
為の実装装置のツールである。■ is a semiconductor chip with solder bumps ■. ■ is an inner bonding lead (hereinafter referred to as inner lead),
■ is a mounting equipment tool for melting solder bumps and soldering them to inner leads.
ツール■けヒーターによ少加熱された外円バンブ■を溶
融する。溶融された半田インナーリード■へ濡れてい鯉
チップとインナーリードは半田付けされる、この時イン
ナーリードの濡れ性が悪いと十分なボンディング強度が
得られない、ソノ為ボンディング時にフラックスを使用
している。フラックスの効要は半田の特性を上げ又外−
品質を向上させるのにも役立っている。しかし通常使用
するフラッフ７は半田付は後粘性が高くなる物が多い為
、メンディング後ツール先端とインナーリード■はフラ
ックスによ〉接着されたと同じ状書となる。その為ツー
ルを離す時ボンディング部が一緒に１１Ｊ？！、ボンデ
ィング部を破壊する結果となる。防ぎ方としてはボンデ
ィング後温度が高くフラックスの粘性の飲い時にツール
を離す方法又はツール先端を特殊加工しフラックスを付
着させない方法郷がとられているが、前者は条件診定が
むづかしく、後者は寿命が短かい岬の欠点がある。Melt the outer circular bump ■ which has been slightly heated by the heater in the tool ■. The molten solder inner lead is wet.The chip and the inner lead are soldered.At this time, if the inner lead has poor wettability, sufficient bonding strength cannot be obtained.For this reason, flux is used during bonding. . The effect of flux is to improve the properties of solder.
It also helps improve quality. However, the normally used fluff 7 often has high viscosity after soldering, so after mending, the tool tip and inner lead ② will have the same shape as if they had been glued together with flux. Therefore, when the tool is released, the bonding part is 11J? ! , resulting in destruction of the bonding part. To prevent this, there are two methods: releasing the tool when the temperature is high after bonding and the flux is viscous, or special processing the tip of the tool to prevent flux from adhering to it, but in the former case, it is difficult to diagnose the conditions; The latter has the disadvantage of a short lifespan.
またツールの構造として、ヒーターで加熱する方法は熱
璽導、材質等の開運で先端の温度調整がむづかしく、機
構が複雑で高価な実装機棟となりてしまっている。零発
ｌ１１けかかる欠点を除却した物で以下実施例に沿って
説明する。In addition, when heating the tool with a heater, it is difficult to adjust the temperature at the tip due to the heat conduction, material, etc., resulting in a complicated and expensive mounting machine. This is a product which eliminates the drawbacks of the zero-fired model and will be described below with reference to examples.
第２！ｌｌけ本発明の一実施例である。■け・・ンダバ
ンプを有する半導体チップ。■は半田バンプと結合する
インナーリード、■は本発明によるパイプ状になったボ
ンディングツール、■はエアーを加熱するヒーターであ
る０図中◆印の方向よ抄工了−（酸化を防ぐ為窒素ガス
が有効）を通すとヒーターので加熱され、中空になって
いるツール内を通って半導体°チップにあたる、第３図
はツール先端部の拡大図であるがチップにあたった温風
は図中φ印の様に広がり半田バンプのＫかかる。ここで
半田バンプが溶融されインナーリード■と濡れて接続さ
れる０以上の様な構造をとると、エアー加熱用のヒータ
ーと、エアー量調整のノズルがあれば事かたシる為、非
常に簡単な構造になる。Second! This is an embodiment of the present invention. ■Ke... A semiconductor chip with bumps. ■ is the inner lead that connects to the solder bump, ■ is the pipe-shaped bonding tool according to the present invention, and ■ is the heater that heats the air. When the gas is passed through (effective), it is heated by the heater, passes through the hollow tool and hits the semiconductor ° chip. Figure 3 is an enlarged view of the tool tip, and the hot air that hits the chip is φ in the figure. It spreads out like a mark and takes the K of the solder bump. If the solder bump is melted and connected to the inner lead ■ in a structure like 0 or more, it is very difficult to solve the problem if there is a heater for heating the air and a nozzle to adjust the amount of air. It becomes a simple structure.
又、ツールはインナーリードと半田バンプを接触させる
だけの役割になる為、半田バンプ溶融温度９上の耐熱性
があればどの様な材質でも良くなる。Further, since the tool only serves to bring the inner lead into contact with the solder bump, any material can be used as long as it has heat resistance above the solder bump melting temperature 9.
たとえばガラス管等を使用しても良い、しかし、ツール
先端形状が館３図に示すが如く、面でインナーリードと
接触している場合、フラックスによるボンディング部破
ＩＩＯ問題は解決されていない。For example, a glass tube or the like may be used, but if the tip shape of the tool is in contact with the inner lead at the surface as shown in Figure 3, the problem of bonding part breakage IIO due to flux has not been solved.
そこで第４図のに示す如く、ツール先端形状をインナー
リードと纏マ接する様に鋭角にした。この様にするとイ
ンナーリードとの接触面積が小さい為、７ラツクスによ
り接着されたと同じ状態になっても、ボンディング強度
の方が勝る為、ボンディング部を破壊する事なく、ツー
ルを離す事が可能になる。インナーリードとの接触面積
が小さい為、ツールをと一ターで加熱する方法を取った
時十分に熱が半田バンプｆ伝わらず半田溶融が不完全と
なり接続不良発生の原因となるが、第４図のツールの様
にツールをパイプ状ｗし、＋Ｈ番で示す温風によって半
田溶融を行なうと、この心配はな？なる。よって、ツー
ル先端形状を本発明の様にした時は、前述した温風によ
る半田溶融方法を並用する事により、更に効果が増すも
のである。Therefore, as shown in Fig. 4, the tip of the tool was made to have an acute angle so as to make full contact with the inner lead. In this way, the contact area with the inner lead is small, so even if it is the same as being bonded with 7lux, the bonding strength is superior, so it is possible to separate the tool without damaging the bonding part. Become. Because the contact area with the inner lead is small, when the tool is heated all at once, the heat is not sufficiently transferred to the solder bumps f, resulting in incomplete solder melting and connection failures, as shown in Figure 4. If you make the tool into a pipe shape like the tool shown above and melt the solder using hot air indicated by +H, you won't have to worry about this. Become. Therefore, when the tip of the tool is shaped as in the present invention, the effect can be further enhanced by also using the aforementioned solder melting method using hot air.
第５図は他の実施例である。第４図での実施例ではツー
ル先端が鋭角である為ツールに圧力がかかりすぎた場合
、インナーリード■を切断するおそれがある。菖５図で
の実施例は前記欠点を改良したもの寸、ツール先端■を
円弧状ドしである。この様にするとある容度圧力がかか
つてもインナーリードを切断することなくボンディング
が行なえる・
以上本発明によると半田パンツを形成しである半導体チ
ップの実装装置に於いて、構造が簡単でしかも使い易い
装置を提供すると共に、ツールに於いては、安価で寿命
の長いツーｈを提供するものである。FIG. 5 shows another embodiment. In the embodiment shown in FIG. 4, the tip of the tool is at an acute angle, so if too much pressure is applied to the tool, there is a risk of cutting the inner lead (2). The embodiment shown in Fig. 5 is an improved version of the above-mentioned drawback, and the tip of the tool (3) is shaped like an arc. In this way, even if a certain volumetric pressure is applied, bonding can be performed without cutting the inner leads. As described above, according to the present invention, in a semiconductor chip mounting apparatus that forms solder pants, the structure is simple, and In addition to providing an easy-to-use device, the present invention provides tools that are inexpensive and have a long life.
第１図は従来の害施例の断面図、館２図は本発明の一実
施例の断面図、第３図Ｆｉ館２図のツール先端部の拡大
断面図。館４図、ＩＩＥ５図は本発明の他の実施例の断
面図。
以 上
出願人 信州精器株式会社
棟梁会社 諏訪精工金
代理人 弁理士 最上 務
／４″
千２図FIG. 1 is a sectional view of a conventional example, FIG. 2 is a sectional view of an embodiment of the present invention, and FIG. 3 is an enlarged sectional view of the tool tip in FIG. 2. FIG. 4 and FIG. 5 are cross-sectional views of other embodiments of the present invention. Applicant: Shinshu Seiki Co., Ltd. Leader Company Suwa Seikokin Agent Patent Attorney Tsutomu Mogami / 4″ 1,200 drawings
Claims (3)
チップをギヤングボンディング法を用いて実装する実装
装置に於いて、半田バンプを溶融する方法として温風を
用いる事を特徴とした半導体チップ実装装置。(1) A semiconductor chip mounting device that uses hot air to melt solder bumps in a mounting device that mounts semiconductor chips having solder pants formed on the pads using the Guyang bonding method. .
る様にパイプ状になっている事を４Ｉ徽とした特許請求
の範１１１Ａ記載の半導体チップ実装装置。(2) The semiconductor chip mounting apparatus according to claim 111A, wherein the opening A- of the semiconductor chip mounting M opening is pipe-shaped so that warm air can pass through.
はインナーリードとの接触が線である様に、鋭角、もし
くけ円弧状になっている事を特徴とする特許請求の範囲
＃１項及び第２項記載の半導体チップ実装装置。(3) Claims #1 and 2, characterized in that the shape of the tip of the tool for the actual semiconductor chip is an acute angle or curved arc so that the contact with the inner lead is a line. Semiconductor chip mounting device as described in .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56134696A JPS5834937A (en) | 1981-08-27 | 1981-08-27 | Packaging unit for semiconductor chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56134696A JPS5834937A (en) | 1981-08-27 | 1981-08-27 | Packaging unit for semiconductor chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5834937A true JPS5834937A (en) | 1983-03-01 |
Family
ID=15134450
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56134696A Pending JPS5834937A (en) | 1981-08-27 | 1981-08-27 | Packaging unit for semiconductor chip |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5834937A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59212167A (en) * | 1983-05-16 | 1984-12-01 | Matsushita Electric Ind Co Ltd | Soldering method of electronic parts |
| JPH02198150A (en) * | 1988-10-31 | 1990-08-06 | Natl Semiconductor Corp <Ns> | Outer lead bonding device |
| JPH04177890A (en) * | 1990-11-13 | 1992-06-25 | Matsushita Electric Ind Co Ltd | Method of joining metallic plate |
| WO2014139099A1 (en) * | 2013-03-13 | 2014-09-18 | China Sunergy (Nanjing) Co., Ltd. | Soldering system |
-
1981
- 1981-08-27 JP JP56134696A patent/JPS5834937A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59212167A (en) * | 1983-05-16 | 1984-12-01 | Matsushita Electric Ind Co Ltd | Soldering method of electronic parts |
| JPH02198150A (en) * | 1988-10-31 | 1990-08-06 | Natl Semiconductor Corp <Ns> | Outer lead bonding device |
| JPH04177890A (en) * | 1990-11-13 | 1992-06-25 | Matsushita Electric Ind Co Ltd | Method of joining metallic plate |
| WO2014139099A1 (en) * | 2013-03-13 | 2014-09-18 | China Sunergy (Nanjing) Co., Ltd. | Soldering system |
| US9837559B2 (en) | 2013-03-13 | 2017-12-05 | China Sunergy (Nanjing) Co. Ltd. | Soldering system |
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