JPS5834799U - Chip-shaped electronic component transfer mechanism - Google Patents
Chip-shaped electronic component transfer mechanismInfo
- Publication number
- JPS5834799U JPS5834799U JP12791581U JP12791581U JPS5834799U JP S5834799 U JPS5834799 U JP S5834799U JP 12791581 U JP12791581 U JP 12791581U JP 12791581 U JP12791581 U JP 12791581U JP S5834799 U JPS5834799 U JP S5834799U
- Authority
- JP
- Japan
- Prior art keywords
- chip
- shaped electronic
- electronic component
- transfer mechanism
- component transfer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001125 extrusion Methods 0.000 claims description 2
Landscapes
- Specific Conveyance Elements (AREA)
- Feeding Of Articles To Conveyors (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図は本考案に係るチップ状電子部品移し変え機構の
実施例を示す側断面図、第2図乃至第4図は実施例の動
作を説明するための斜視図1、第5図はパレット側の構
成を示す斜視図である。
1・・・基台枠、2.3・・・固定ブロック、4・・・
スラ、イダ、9・・・チップ押出し7スライダ、10・
・・チップ状電子部品、11・・・切欠部、14・・・
チップ押えレバー、20・・・シュート底面、21・・
・チップ押上げスライダ、22・・・チップガイド部材
、23・・・チップガイド溝、3G・・・パレット。Fig. 1 is a side sectional view showing an embodiment of the chip-shaped electronic component transfer mechanism according to the present invention, Figs. 2 to 4 are perspective views 1 for explaining the operation of the embodiment, and Fig. 5 is a pallet. It is a perspective view showing the structure of the side. 1... Base frame, 2.3... Fixed block, 4...
Slider, Ida, 9...Chip extrusion 7 Slider, 10.
...Chip-shaped electronic component, 11...Notch, 14...
Tip presser lever, 20... Bottom of chute, 21...
- Chip push-up slider, 22... Chip guide member, 23... Chip guide groove, 3G... Pallet.
Claims (1)
往復運動するチップ押出しスライダと、下降位置にてパ
ーツフィーダ底面と一致した状態でチップ状電子部品を
受は上昇位置にてチップ状電子部品を前記切欠部に係合
させるチップ押上げスライダと、該チップ押上げスライ
ダ上のチップ状電子部品の上面を押えるチップ押え部材
とを備えたことを特徴とするチップ状電子部品移し変え
機構。A chip extrusion slider that has a notch for engaging chip-shaped electronic components and moves back and forth, and a chip-extruding slider that is aligned with the bottom surface of the parts feeder in the lowered position and that receives the chip-shaped electronic components in the raised position. A chip-shaped electronic component transfer mechanism comprising: a chip-pushing slider for engaging an electronic component in the notch; and a chip-pressing member for pressing the top surface of the chip-shaped electronic component on the chip-pushing slider. .
Priority Applications (10)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12791581U JPS5834799U (en) | 1981-08-31 | 1981-08-31 | Chip-shaped electronic component transfer mechanism |
GB08222570A GB2108015B (en) | 1981-08-24 | 1982-08-05 | Apparatus for mounting chip type circuit elements on printed circuit boards |
US06/409,184 US4520557A (en) | 1981-08-24 | 1982-08-18 | Apparatus for mounting chip type circuit elements on printed circuit boards |
DE19823231174 DE3231174A1 (en) | 1981-08-24 | 1982-08-21 | DEVICE FOR ATTACHING DABLET CIRCUIT ELEMENTS TO PRINTED CIRCUIT BOARDS |
NL8203293A NL8203293A (en) | 1981-08-24 | 1982-08-23 | DEVICE FOR MOUNTING CHIP TYPE CHAIN ELEMENTS ON PRINTED CHAIN PANELS. |
CA000409940A CA1201881A (en) | 1981-08-24 | 1982-08-23 | Apparatus for mounting chip type circuit elements on printed circuit boards |
FR8214520A FR2511831B1 (en) | 1981-08-24 | 1982-08-24 | MACHINE FOR MOUNTING PELLET-TYPE CIRCUIT ELEMENTS ON PRINTED CIRCUIT PANELS |
IT22948/82A IT1152044B (en) | 1981-08-24 | 1982-08-24 | APPAREIL POUR LE MONTAGE D'ELEMENTS DE CIRCUIT DU TYPE "PUCE" SUR DES PLAQUETTES DE CIRCUIT IMPRIME |
CH5023/82A CH659734A5 (en) | 1981-08-24 | 1982-08-24 | DEVICE FOR MOUNTING CHIP-SHAPED ELECTRICAL OR. ELECTRONIC COMPONENTS ON BOARDS FOR PRINTED CIRCUITS. |
BE0/208867A BE894184A (en) | 1981-08-24 | 1982-08-24 | APPARATUS FOR MOUNTING "CHIP" TYPE CIRCUIT ELEMENTS ON PRINTED CIRCUIT BOARDS |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12791581U JPS5834799U (en) | 1981-08-31 | 1981-08-31 | Chip-shaped electronic component transfer mechanism |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5834799U true JPS5834799U (en) | 1983-03-07 |
Family
ID=29921629
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12791581U Pending JPS5834799U (en) | 1981-08-24 | 1981-08-31 | Chip-shaped electronic component transfer mechanism |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5834799U (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60113497A (en) * | 1983-11-24 | 1985-06-19 | 三菱電機株式会社 | Cooler for electric device |
JPS60113498A (en) * | 1983-11-24 | 1985-06-19 | 三菱電機株式会社 | Cooler for electric device |
JP2012180202A (en) * | 2011-03-02 | 2012-09-20 | Unitec:Kk | Work delivery device and work delivery method |
-
1981
- 1981-08-31 JP JP12791581U patent/JPS5834799U/en active Pending
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60113497A (en) * | 1983-11-24 | 1985-06-19 | 三菱電機株式会社 | Cooler for electric device |
JPS60113498A (en) * | 1983-11-24 | 1985-06-19 | 三菱電機株式会社 | Cooler for electric device |
JPH023319B2 (en) * | 1983-11-24 | 1990-01-23 | Mitsubishi Electric Corp | |
JPH023320B2 (en) * | 1983-11-24 | 1990-01-23 | Mitsubishi Electric Corp | |
JP2012180202A (en) * | 2011-03-02 | 2012-09-20 | Unitec:Kk | Work delivery device and work delivery method |
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