JPS5834747U - Heat exchanger for semiconductor cooling - Google Patents
Heat exchanger for semiconductor coolingInfo
- Publication number
- JPS5834747U JPS5834747U JP12789681U JP12789681U JPS5834747U JP S5834747 U JPS5834747 U JP S5834747U JP 12789681 U JP12789681 U JP 12789681U JP 12789681 U JP12789681 U JP 12789681U JP S5834747 U JPS5834747 U JP S5834747U
- Authority
- JP
- Japan
- Prior art keywords
- heat exchanger
- cooling
- semiconductors
- protrusions
- aluminum alloy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図は本考案による半導体冷却用の熱交換器の外観図
、第2図は第1図の縦断正面間諜3図は保温ケースの縦
断正面図である。第4図は同じく蓄冷体の縦断正面図、
第5図は同じく基板と蓄冷体の縦断正面図、第6図は同
じく垂直形の縦断正面図である。第7図は同じく縦断正
面図である。
−1・・・基板、2・・・表面、3・・・裏面、4・・
・半導体、5・・・突条、6・・・蓄冷体7・・・凹形
(深溝)、9・・・冷却媒体。FIG. 1 is an external view of a heat exchanger for cooling semiconductors according to the present invention, and FIG. 2 is a longitudinal sectional front view of FIG. Figure 4 is also a longitudinal sectional front view of the cold storage body.
FIG. 5 is a vertical sectional front view of the substrate and the cool storage body, and FIG. 6 is a vertical sectional front view of the same. FIG. 7 is also a longitudinal sectional front view. -1... Board, 2... Front side, 3... Back side, 4...
- Semiconductor, 5... Projection, 6... Cool storage body 7... Concave shape (deep groove), 9... Cooling medium.
Claims (2)
の表面の、裏面には複数条の断面歯形又は波形の突条が
、はぼ等ピッチにて並列してなるアルミニウム合金製の
基板と、 表面には前記突条と密着当接する凹形を形成したる箱状
のアルミニウム合金よりなる密閉蓄冷体よりなり、 且つ蓄冷体の内部には常温では液体で低温では固体であ
る冷却媒体が封入されてなる半導体冷却用の熱交換器。(1) An aluminum alloy substrate with a smooth plate-like surface on which multiple semiconductors are adhesively fixed, and a plurality of cross-sectional tooth-shaped or wavy protrusions arranged in parallel at a roughly equal pitch on the back side. , consists of a box-shaped sealed regenerator made of aluminum alloy with a concave shape that is in close contact with the protrusions on the surface, and a cooling medium that is liquid at room temperature and solid at low temperature is sealed inside the regenerator. A heat exchanger for cooling semiconductors.
る実用新案登録請求の範囲第(1)項記載の半導体冷却
用の熱交換器。(2) The heat exchanger for cooling semiconductors according to claim (1), wherein the protrusions provided on the back surface of the substrate have a comb-like cross section.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12789681U JPS5834747U (en) | 1981-08-31 | 1981-08-31 | Heat exchanger for semiconductor cooling |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12789681U JPS5834747U (en) | 1981-08-31 | 1981-08-31 | Heat exchanger for semiconductor cooling |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5834747U true JPS5834747U (en) | 1983-03-07 |
Family
ID=29921609
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12789681U Pending JPS5834747U (en) | 1981-08-31 | 1981-08-31 | Heat exchanger for semiconductor cooling |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5834747U (en) |
-
1981
- 1981-08-31 JP JP12789681U patent/JPS5834747U/en active Pending
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