JPS5833470A - Laser printing apparatus - Google Patents

Abstract

PURPOSE:To make it possible to carry out laser printing inexpensively in good efficiency, by constitution wherein plural sheet articles to be processed are accomodated in a carrier and this carrier is placed on and conveyed by a conveyor mechanism to print evey one sheet successively while said sheet articles to be processed are accomodated in the carrier. CONSTITUTION:Plural wafers 6 which are articles to be processed are accomodated in a carrier 5 at equal intervals and this carrier is placed on a carrier conveyor mechanism 4. In this condition, the conveyor mechanism 4 is operated to move the carrier 5 and stopped at a time when the first wafer 6 accomodated in the carrier 5 reaches the focus position of laser beams. Subsequently, laser beams are issued from a laser oscillator apparatus 2 and condensed to the surface of the wafer 6 through a scanning optical part 3 and a condensing lens 7 to carry out printing. After printing is completed, the conveyor mechanism 4 is again operated to move the carrier and the carrier 5 is stopped at the position of the next wafer 6 to successively carry out the printing.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a laser printing device that uses a laser beam, and more particularly to a laser printing device that uses a laser beam to form characters on the surface of a semiconductor wafer.

Normal semiconductor integrated circuit wafer (hereinafter simply referred to as wafer)
In the manufacturing process, several dozen pieces form 10 pieces,
Conventionally, wafers are manufactured through each process, and their lot management has been performed by a person using a sapphire bevel to write lot numbers on the surface of each wafer at the time of entering the semiconductor integrated circuit manufacturing process. However, printing with the Su7 Aiya pen has disadvantages such as the automation of the noodle making process being a national electricity, and the fact that it imparts morphology 41 to the single-crystal wafer, which can cause cracks, especially when heated at high temperatures to diffuse impurities. I was disappointed.

On the other hand, marking using a laser beam can be automated by mechanically printing by dot processing, and since it can be done by melting the dot processing μ copying facet, it does not affect the crystals of the wafer. This method has a great effect on preventing the wafer from cracking during heating without giving too much heat to the wafer.

Conventionally, the printing am on this cypress was done using a Leb oscillation device and a laser beam 1iii! from this device, as shown in FIG. Fulfill the
It also consists of a two-dimensional focusing optical system, a loading/unloading device, a table device, etc.

In such a device, wafers set on a wafer carrier are transported one wafer at a time from a load section to a printing position using a belt, and are identified by vacuum suction on a printing table section, and the laser beam output from a laser emitting IkR device is transferred. A beam scanning optical section condenses the beam to perform printing, and then the printed wafer is stored in a wafer carrier in an unloading section using a belt or the like. One disadvantage of printing devices such as those described above is that the cost of the device increases as the number of load/unload units for setting wafer carriers increases. Furthermore, conventional equipment can print only on the back side of the wafer.

However, with the recent expansion of applications for semiconductor integrated circuits,
It has become necessary to efficiently manufacture a wide variety of products in small quantities, and for this purpose, it is necessary to automate and save labor in the process management of each wafer. For this purpose, it is necessary that the equipment cost be low and that each printed wafer be automatically read and classified according to processing conditions. This automatic reading device requires printing on the front side of the wafer, and a problem arises in that the automatic reading device cannot be installed for printing on the back side. Also, as the diameter of the wafer 1 increases, the thickness of the wafer increases, and in the process after pattern formation, the back surface P51I9 has to be widened to make it easier to divide into individual elements. As a result, the portion printed on the surface is also scratched off, creating a problem that lot management is no longer possible.

A simple method to solve the above-mentioned problem is to reverse the wafer in the conventional apparatus. In other words, there is a method of installing a sea urchin surface to collect the laser beam, but it is common knowledge that the sea urchin surface should be extremely dirty, as shown in Figure 1.

If the convex surface of the sea urchin is vacuum-adsorbed on the table before printing, the above method cannot be adopted because it will cause the surface of the convex sea urchin to become dirty.

Furthermore, it is not easy to reduce the device price by a large margin due to the structure.

An object of the present invention is to simplify the structure Fs by making it possible to print while a temporary workpiece is stored in a carrier without installing a device for transporting the workpiece, thereby reducing costs. It can be done cheaply, and it can be done easily by changing the carrier settings.
i A laser that can print arbitrary marks on the surface or surface of the workpiece.
: i1 character device 1t.

The present invention will be specifically explained below using one embodiment.

#! Figure 2 shows an embodiment of the present invention, in which l is a system control unit and operation unit, 2 is a laser oscillation device, 3 is a scanning optical unit, 4 is a carrier transport mechanism, 5 is a carrier, and 6 is a workpiece. (Wafer) 7 is a condensing lens. The carrier transport mechanism 4 is arranged at a certain angle with respect to the optical path of the laser beam. That is, the angle is such that the wafers stored in the carrier before and after the wafer to be printed do not block the optical path of the laser beam. The wafers 6, which are the workpieces, have the same dimensions as the wafers 6 stored in a large number in the carrier 5 as shown in Figure 3. In this state, the orientation of the wafer 6 is 1 to 7 (hereinafter 0).
．． Since the tit position (referred to as "F") is not aligned on each wafer, the OF of each wafer is aligned using a commercially available 012 alignment device so that each wafer is aligned at the same position.
Carrier 5 containing one or more sheets is transferred to carrier conveyor #11.
Set it on 4.

After that, set the character t system system (IIS and operation unit IVCe) that you want to print, and start the device.

First, the carrier transport mechanism 4 starts operating, the carrier 5 placed on the carrier transport mechanism 4 moves, and the first wafer 6 stored in the carrier 5 is stopped at the focal position of the laser beam. After that, the laser excavation device 2 outputs a laser beam, which is deflected by the scanning optical section 3 and condensing lens 7.
The laser beam is introduced into the wafer 6 and printed on the surface of the wafer 6 by condensing the laser beam. When printing is completed, the carrier transport mechanism 4 starts operating again, moves the carrier 5, stops at the next wafer position, and prints. Printing is performed in sequence.

Next, when printing on the opposite side of the wafer, use a carrier conveyor! This is possible by installing the carrier 5 at s4 in the opposite manner to the above installation.

As described above, according to the present invention, the way I-transfer M&(
It is possible to print with the wafer stored in the carrier without installing a loading/unloading device), and it is possible to print on the front or back side of the wafer depending on the way the carrier is installed, so automatic reading equipment etc. It has the great advantage of being able to be connected to the U-I, and also being able to accommodate larger diameter U-I. Furthermore, since the device configuration is simplified, the cost per unit can be reduced, and the impact on semiconductor integrated circuit manufacturing costs is also reduced.

[Brief explanation of the drawing]

Figure 1 is a schematic block diagram of a conventional laser printing device, Figure 2 is a schematic block diagram of a conventional laser printing device.
The figure is a schematic block diagram of one embodiment of the present invention, and FIG. 3 is a perspective view of a standard carrier. l...System operation unit, 2...Laser oscillation device, 3
...Scan optical section, 4...Carrier transport device, 5
...Carrier, 6. Workpiece, 7. Condensing lens. , 1□′..., Agent Patent Attorney Uchihara Day , 1゛
−“Fuki-2 illustrations Kyo 3 stories

Claims (1)

[Scope of Claims] A laser printing device that irradiates a workpiece with condensed laser light to perform melt processing in the form of dots on the surface of the workpiece, and expresses entire characters by linking the dots. A laser beam generator, an optical system that condenses the laser beam from this device and shakes the laser beam two-dimensionally with 1/C, and a carrier T-mounted with a large number of workpieces stored at the focal position of this condensing optical system. , a printing device fII equipped with a device to move the middle
A laser printing device characterized by being able to print 1 & workpieces while they are housed in a carrier from tVc.