JPS5832632U - Parts mounting device - Google Patents
Parts mounting deviceInfo
- Publication number
- JPS5832632U JPS5832632U JP12499181U JP12499181U JPS5832632U JP S5832632 U JPS5832632 U JP S5832632U JP 12499181 U JP12499181 U JP 12499181U JP 12499181 U JP12499181 U JP 12499181U JP S5832632 U JPS5832632 U JP S5832632U
- Authority
- JP
- Japan
- Prior art keywords
- mounting device
- insulation coating
- parts mounting
- component
- peeled
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Details Of Resistors (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Insulating Bodies (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図ａは部品のリードに従来のチューブを挿入した状
態を示す図、第１図すはリードにチ五−ブを挿入してプ
リント基板に対して部品を浮かせて取り付けた状態を示
す図、第２図はこの考案の部品装着装置に使用される電
線類および、この電線類の端末から剥離された絶縁被覆
材を示す分解斜視図、第３図は第２図の剥離された絶縁
被覆材を使用したこの考案の部品装着装置の一実施例を
示す斜視図、第４図はこの考案の部品装着装置に使用さ
れる電線類および、この電線類から剥離された絶縁被覆
材の分解斜視図、第５図はこの考案の部品装着装置の他
の実施例を示す斜視図である。
１１．１６・・・電線類、１２． １３． １７． １
８・・・絶縁被覆材、１４・・・部品、１４′ａ・・・
リード、１５・・・プリント基板。Figure 1a shows a state in which a conventional tube is inserted into the lead of a component, and Figure 1a shows a state in which a tube is inserted into the lead and the component is suspended and attached to a printed circuit board. , FIG. 2 is an exploded perspective view showing the electrical wires used in the component mounting device of this invention and the insulation coating peeled off from the ends of the electrical wires, and FIG. 3 is the stripped insulation coating of FIG. 2. FIG. 4 is an exploded perspective view of the electrical wires used in the component mounting device of this invention and the insulating coating material peeled off from the electrical wires. 5 are perspective views showing other embodiments of the component mounting device of this invention. 11.16...Electric wires, 12. 13. 17. 1
8... Insulating coating material, 14... Parts, 14'a...
Lead, 15...Printed circuit board.
Claims (1)
材を剥離させ、この剥離した絶縁被覆材を部品のリード
に挿入して、プリント基板と部品間をこの剥離した絶縁
被覆材で浮かせることを特徴とする部品装着装置。Process the ends of electrical wires coated with insulation coating to peel off the insulation coating, insert this peeled insulation coating into the leads of the component, and use the peeled insulation coating to float between the printed circuit board and the component. A parts mounting device characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12499181U JPS5832632U (en) | 1981-08-24 | 1981-08-24 | Parts mounting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12499181U JPS5832632U (en) | 1981-08-24 | 1981-08-24 | Parts mounting device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5832632U true JPS5832632U (en) | 1983-03-03 |
Family
ID=29918835
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12499181U Pending JPS5832632U (en) | 1981-08-24 | 1981-08-24 | Parts mounting device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5832632U (en) |
-
1981
- 1981-08-24 JP JP12499181U patent/JPS5832632U/en active Pending
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